JPH0412628U - - Google Patents
Info
- Publication number
- JPH0412628U JPH0412628U JP5345890U JP5345890U JPH0412628U JP H0412628 U JPH0412628 U JP H0412628U JP 5345890 U JP5345890 U JP 5345890U JP 5345890 U JP5345890 U JP 5345890U JP H0412628 U JPH0412628 U JP H0412628U
- Authority
- JP
- Japan
- Prior art keywords
- dummy wafer
- semiconductor manufacturing
- utility
- manufacturing process
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図は本考案の一実施例の平面図、第２図ａ
，ｂ及び第３図ａ，ｂはそれぞれダミーウエーハ
と半導体製造用ウエーハとを識別する方法を説明
する平面図及び側面図、第４図は従来のダミーウ
エーハの一例の平面図である。 １……ダミーウエーハ、２……従来のダミーウ
エーハ、３……Ｏ・Ｆ、４……光センサ発光部、
５……光センサ受光部、６……光、７……チヤツ
ク、１２……半導体製造用ウエーハ。
，ｂ及び第３図ａ，ｂはそれぞれダミーウエーハ
と半導体製造用ウエーハとを識別する方法を説明
する平面図及び側面図、第４図は従来のダミーウ
エーハの一例の平面図である。 １……ダミーウエーハ、２……従来のダミーウ
エーハ、３……Ｏ・Ｆ、４……光センサ発光部、
５……光センサ受光部、６……光、７……チヤツ
ク、１２……半導体製造用ウエーハ。
Claims (1)
- 半導体製造過程で使用されるダミーウエーハに
おいて、オリエンテーシヨンフラツトが無く外形
が真円の円板であることを特徴とするダミーウエ
ーハ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990053458U JP2542930Y2 (ja) | 1990-05-22 | 1990-05-22 | ダミーウェーハ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990053458U JP2542930Y2 (ja) | 1990-05-22 | 1990-05-22 | ダミーウェーハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412628U true JPH0412628U (ja) | 1992-01-31 |
| JP2542930Y2 JP2542930Y2 (ja) | 1997-07-30 |
Family
ID=31574660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990053458U Expired - Lifetime JP2542930Y2 (ja) | 1990-05-22 | 1990-05-22 | ダミーウェーハ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2542930Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63279163A (ja) * | 1987-05-12 | 1988-11-16 | Tokyo Gas Co Ltd | 管用探傷器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52106681A (en) * | 1976-03-05 | 1977-09-07 | Toshiba Corp | Etching method |
| JPS63127125U (ja) * | 1987-02-12 | 1988-08-19 |
-
1990
- 1990-05-22 JP JP1990053458U patent/JP2542930Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52106681A (en) * | 1976-03-05 | 1977-09-07 | Toshiba Corp | Etching method |
| JPS63127125U (ja) * | 1987-02-12 | 1988-08-19 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63279163A (ja) * | 1987-05-12 | 1988-11-16 | Tokyo Gas Co Ltd | 管用探傷器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2542930Y2 (ja) | 1997-07-30 |