JPH04124898A - Production of hybrid multi layer circuit wiring board - Google Patents
Production of hybrid multi layer circuit wiring boardInfo
- Publication number
- JPH04124898A JPH04124898A JP24509190A JP24509190A JPH04124898A JP H04124898 A JPH04124898 A JP H04124898A JP 24509190 A JP24509190 A JP 24509190A JP 24509190 A JP24509190 A JP 24509190A JP H04124898 A JPH04124898 A JP H04124898A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- substrate
- alumina
- resin
- sprayed layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000919 ceramic Substances 0.000 claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 14
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 abstract description 5
- 239000009719 polyimide resin Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 239000004744 fabric Substances 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007750 plasma spraying Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミック基板上に樹脂基板を設けた混成多
層回路配線板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a hybrid multilayer circuit wiring board in which a resin substrate is provided on a ceramic substrate.
（従来の技術）
従来から多層セラミック基板上に、導電性を有する樹脂
基板を設けた混成多層回路配線板が種々提供されている
。この混成多層回路配線板を製造する際は、セラミック
基板を焼成法で作製した後、その上に樹脂基板を接着し
て回路パターンおよびスルーホールなどを形成するよう
にしている。(Prior Art) Various hybrid multilayer circuit wiring boards have been conventionally provided in which a conductive resin substrate is provided on a multilayer ceramic substrate. When manufacturing this hybrid multilayer circuit wiring board, a ceramic substrate is produced by a firing method, and then a resin substrate is bonded thereon to form circuit patterns, through holes, and the like.
（発明が解決しようとする課題）
しかしながら、このようにして作製した混成多層回路配
線板は、セラミック基板の表面が平滑であるために、セ
ラミック基板と樹脂基板の接着力が弱いものとなる。し
かも、セラミック基板と樹脂基板とでは熱膨脹係数が互
いに大きく異なるために、温度変化によってセラミック
基板から樹脂基板が剥がれやすく、特に混成多層回路配
線板に熱衝撃を与えた場合には、樹脂基板がセラミック
基板から容易に剥がれてしまうという問題点があった。(Problems to be Solved by the Invention) However, in the hybrid multilayer circuit wiring board produced in this manner, the surface of the ceramic substrate is smooth, so that the adhesive force between the ceramic substrate and the resin substrate is weak. Moreover, because the thermal expansion coefficients of ceramic and resin substrates are significantly different from each other, the resin substrate is likely to peel off from the ceramic substrate due to temperature changes.In particular, if a hybrid multilayer circuit board is subjected to a thermal shock, the resin substrate may peel off from the ceramic substrate. There was a problem that it easily peeled off from the substrate.
本発明は、このような従来技術が有する混成多層配線板
の欠点を改良するもので、その目的は、セラミック基板
と樹脂基板の密着性に優れた混成多層回路配線板の製造
方法を提供することにある。The present invention aims to improve the drawbacks of the hybrid multilayer circuit board of the prior art, and its purpose is to provide a method for manufacturing a hybrid multilayer circuit board with excellent adhesion between a ceramic substrate and a resin substrate. It is in.
（課題を解決するための手段）
すなわち、上記目的を達成するため、本発明は、セラミ
ック基板上に樹脂基板を設けてなる混成多層回路配線板
の製造方法において、前記セラミ・ツク基板の少なくと
も樹脂基板に接する側の面にセラミック溶射層を形成し
、該セラミック溶射層上に樹脂基板を接着することを特
徴とするものである。(Means for Solving the Problem) That is, in order to achieve the above object, the present invention provides a method for manufacturing a hybrid multilayer circuit wiring board in which a resin substrate is provided on a ceramic substrate. The method is characterized in that a ceramic sprayed layer is formed on the surface that contacts the substrate, and a resin substrate is bonded onto the ceramic sprayed layer.
セラミック基板上にセラミック溶射層を形成するには、
ガス溶射法、プラズマ溶射法、減圧プラズマ溶射法など
により、セラミック基板上に溶融セラミックを溶射すれ
ばよい。溶射するセラミック材料は、価格、絶縁特性、
溶射のしやすさなどの観点から、セラミック基板として
広く用いられているアルミナが好適である。そのほかに
ムライト、スピネル、ジルコニア、ジルコン、シリカ。To form a ceramic sprayed layer on a ceramic substrate,
The molten ceramic may be sprayed onto the ceramic substrate by a gas spraying method, a plasma spraying method, a reduced pressure plasma spraying method, or the like. Ceramic materials to be thermally sprayed vary in price, insulation properties,
From the viewpoint of ease of thermal spraying, alumina, which is widely used as a ceramic substrate, is suitable. In addition, mullite, spinel, zirconia, zircon, and silica.
マグネシア、カルシアなどの電気絶縁性の高いセラミッ
ク材料を用いることができる。Ceramic materials with high electrical insulation properties such as magnesia and calcia can be used.
セラミック基板上に形成するセラミック溶射層の厚さは
、本発明の範囲を制限するものではないか、５μｍ〜１
００μｍの範囲か好適である。セラミック溶射層の厚さ
か５μｍ未満であるときは、セラミック溶射層の厚さが
薄いためにセラミック溶射層が連続に形成されず、その
下のセラミ・ツク基板の表面か露出する部分か多く生ず
る。その結果、セラミック基板と樹脂基板の相互密着性
はほとんど向上しないことになる。The thickness of the ceramic sprayed layer formed on the ceramic substrate may be 5 μm to 1 μm, which may limit the scope of the present invention.
A range of 00 μm is suitable. When the thickness of the ceramic sprayed layer is less than 5 μm, the ceramic sprayed layer is not formed continuously because the ceramic sprayed layer is thin, and a large portion of the surface of the ceramic substrate underneath is exposed. As a result, the mutual adhesion between the ceramic substrate and the resin substrate is hardly improved.
また、セラミック溶射層の厚さか１００μｍを越えると
、セラミック基板からセラミック溶射層が剥離しやすく
なり、不必要にセラミック溶射層の厚さを厚くするのは
経済的にも不利になる。したがって、セラミック溶射層
の厚さは５μｍ〜１００μｍに設定するのが望ましい。Furthermore, if the thickness of the ceramic sprayed layer exceeds 100 μm, the ceramic sprayed layer will easily peel off from the ceramic substrate, and it will be economically disadvantageous to unnecessarily increase the thickness of the ceramic sprayed layer. Therefore, it is desirable to set the thickness of the ceramic sprayed layer to 5 μm to 100 μm.
次に、このようにして得られたセラミック溶射層上に樹
脂基板を接着する方法としては、既に成形済みの樹脂基
板を接着剤もしくはプリプレグを介してセラミック溶射
層に接着する方法、あるいはセラミック溶射層上にプリ
プレグおよび銅箔を載置して、熱圧成形による接着工程
と樹脂基板の成形工程とを同時に行なう方法が用いられ
る。Next, the method of bonding a resin substrate onto the ceramic sprayed layer obtained in this way is to bond an already molded resin substrate to the ceramic sprayed layer via adhesive or prepreg, or to bond the ceramic sprayed layer to the ceramic sprayed layer. A method is used in which a prepreg and a copper foil are placed on top and the adhesion process by hot pressure molding and the resin substrate molding process are performed simultaneously.
セラミック溶射層に接着する樹脂制料としては、樹脂基
板に広く用いられているエポキシ樹脂、ポリイミド樹脂
が好適であるが、そのほかにフェノール樹脂、メラミン
樹脂、ビニルエステル樹脂。Epoxy resins and polyimide resins, which are widely used for resin substrates, are suitable as the resin material to be bonded to the ceramic sprayed layer, but phenol resins, melamine resins, and vinyl ester resins are also suitable.
不飽和ポリエステル樹脂などを用いても差し支えない。There is no problem in using unsaturated polyester resin or the like.
（作用）
本発明では、セラミック基板と樹脂基板とを接着する際
に、セラミック基板上にセラミック溶射層を形成し、そ
の上に樹脂基板を接着するため、セラミック溶射層の介
在によってセラミック基板と樹脂基板の密着性が向上す
る。すなわち、セラミック基板上に形成したセラミック
溶射層は多孔質であり、しかも表面は微細凹凸状の粗面
である。(Function) In the present invention, when bonding a ceramic substrate and a resin substrate, a ceramic sprayed layer is formed on the ceramic substrate, and the resin substrate is bonded on top of the ceramic sprayed layer. The adhesion of the substrate is improved. That is, the ceramic sprayed layer formed on the ceramic substrate is porous and has a rough surface with fine irregularities.
したがって、セラミック基板と樹脂基板との接着時に、
接着剤となる樹脂は、セラミック溶射層の気孔部分に容
易に含浸する。Therefore, when bonding a ceramic substrate and a resin substrate,
The adhesive resin easily impregnates the pores of the ceramic sprayed layer.
また、セラミック溶射層の表面は粗面であるために、接
着面積か非常に大きくなる。そのために、樹脂含浸容易
性と接着面積増加の効果により、セラミック溶射層と樹
脂基板との接着力は強固なものとなる。Furthermore, since the surface of the ceramic sprayed layer is rough, the adhesion area becomes very large. Therefore, due to the ease of resin impregnation and the effect of increasing the bonding area, the adhesive force between the ceramic sprayed layer and the resin substrate becomes strong.
さらに、セラミック基板にセラミック材料を溶射すると
、溶射ガンから溶融セラミックが音速レベルの速度でセ
ラミック基板に衝突して冷却固着するので、アンカー効
果によりその密着力はすこぶる強固なものとなる。Furthermore, when a ceramic material is thermally sprayed onto a ceramic substrate, the molten ceramic from the thermal spray gun collides with the ceramic substrate at a speed close to the speed of sound and is cooled and fixed, making the adhesion extremely strong due to the anchor effect.
以上の理由より、セラミック基板と樹脂基板の密着ノコ
は従来に比べて格段に優れたものになる。For the above reasons, the contact saw between the ceramic substrate and the resin substrate is much better than the conventional one.
（実施例） 以下、実施例を挙げて本発明をさらに説明する。(Example) The present invention will be further explained below with reference to Examples.
まず、グリーンシート法により純度９９．６％のアルミ
ナα−Ａ１２０３の４層板を作製した。First, a four-layer plate of alumina α-A1203 with a purity of 99.6% was produced by the green sheet method.
次に、このアルミナ４層板の片面にプラズマ溶射法置（
商品名、プラズマダイシンステム３６００８０Ｒ型、米
国プラズマダイン社製）を用いてアルミナ（商品名、シ
ョウコートに一１６Ｔ、昭和電工製）を厚さ２５μｍに
なるように溶射し、アルミナ溶射層を形成した。Next, plasma spraying (
Alumina (trade name: Showcoat 116T, manufactured by Showa Denko) was sprayed to a thickness of 25 μm using a plasma dicing system model 360080R (trade name, manufactured by Plasma Dyne, Inc., USA) to form an alumina sprayed layer. .
次に、このようにして得られたアルミナ溶射層の上に、
プレス成形した厚み０．０５ｍｍのガラス布幕オ」ポリ
イミド樹脂プリブレク（樹脂分６２ｗｔ％）を２枚載置
し、さらにその上に厚さ１８μｍの電解銅箔を載置し、
これを熱圧成形して接着した。Next, on the alumina sprayed layer obtained in this way,
Two sheets of press-molded glass fabric curtains with a thickness of 0.05 mm (resin content: 62 wt%) were placed, and on top of that, an electrolytic copper foil with a thickness of 18 μm was placed.
This was hot-press molded and bonded.
アルミナ溶射層は、１０ｖｏ１％の気孔を有しているが
、プリプレグとの熱圧成形時にプリプレグから溶融、低
粘度化したポリイミド樹脂が、アルミナ溶射層の気孔に
容易に含浸し、完全に封孔することかできた。The alumina sprayed layer has 10vo1% pores, but the polyimide resin melted from the prepreg and reduced in viscosity during hot press molding with the prepreg easily impregnates the pores of the alumina sprayed layer, completely sealing the pores. I was able to do something.
このように、アルミナ基板とガラス布基祠ポリイミド樹
脂基板とを一体化して得られた混成多層回路配線板は、
接着性か良好であった。具体的には、ホットオイル熱衝
撃試験において、２６０℃のンリコーンオイル浸漬２０
秒と室温の水浸漬２０秒を１００サイクル繰り返して行
なったところ、アルミナ基板とアルミナ溶射層との界面
での剥離、およびアルミナ溶剤層とカラス布基祠ポリイ
ミド樹脂層との界面での１＋＋離は全く認められなかっ
た。In this way, the hybrid multilayer circuit wiring board obtained by integrating the alumina substrate and the glass cloth-based polyimide resin substrate is
Adhesion was good. Specifically, in the hot oil thermal shock test, 260 ° C.
After repeating 100 cycles of 20 seconds of immersion in water at room temperature for 20 seconds, it was found that there was no peeling at the interface between the alumina substrate and the alumina sprayed layer, and 1++ separation at the interface between the alumina solvent layer and the glass cloth-based polyimide resin layer. It was not recognized at all.
（発明の効果）
以上説明したように、請求項１，２の発明による混成多
層回路配線板の製造方法によれば、セラミック基板」二
に設けたセラミック溶射層が、樹脂基板との接着性を著
しく向上させるため、セラミック基板と樹脂基板との接
合密着性に優れ、耐熱衝撃性の高い混成多層回路配線板
を容易に製造することができる。(Effects of the Invention) As explained above, according to the method for manufacturing a hybrid multilayer circuit wiring board according to the invention of claims 1 and 2, the ceramic sprayed layer provided on the ceramic substrate 2 improves adhesiveness with the resin substrate. Because of this remarkable improvement, it is possible to easily manufacture a hybrid multilayer circuit wiring board that has excellent bonding adhesion between the ceramic substrate and the resin substrate and has high thermal shock resistance.
とりわけ、請求項２の発明によれば、セラミック溶射層
の主成分がアルミナであるため、オＡ料コストが安価で
あるばかりでなく、電気絶縁特性が向上するとともに、
基板上への溶射作業を容易に行なうことができるという
効果を有する。In particular, according to the invention of claim 2, since the main component of the ceramic sprayed layer is alumina, not only the cost of the OA material is low, but also the electrical insulation properties are improved.
This has the effect that thermal spraying onto a substrate can be easily performed.
Claims (2)
回路配線板において、 前記セラミック基板の少なくとも樹脂基板と接する側の
面にセラミック溶射層を形成し、該セラミック溶射層上
に樹脂基板を接着することを特徴とする混成多層回路配
線板の製造方法。1. In a hybrid multilayer circuit wiring board in which a resin substrate is provided on a ceramic substrate, a ceramic sprayed layer is formed on at least the surface of the ceramic substrate in contact with the resin substrate, and the resin substrate is bonded on the ceramic sprayed layer. A method for manufacturing a hybrid multilayer circuit wiring board characterized by:
ミック材料よりなることを特徴とする請求項１記載の混
成多層回路配線板の製造方法。2. 2. The method of manufacturing a hybrid multilayer circuit wiring board according to claim 1, wherein the ceramic sprayed layer is made of a ceramic material containing alumina as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24509190A JPH04124898A (en) | 1990-09-14 | 1990-09-14 | Production of hybrid multi layer circuit wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24509190A JPH04124898A (en) | 1990-09-14 | 1990-09-14 | Production of hybrid multi layer circuit wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04124898A true JPH04124898A (en) | 1992-04-24 |
Family
ID=17128474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24509190A Pending JPH04124898A (en) | 1990-09-14 | 1990-09-14 | Production of hybrid multi layer circuit wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04124898A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018163982A1 (en) * | 2017-03-09 | 2018-09-13 | 株式会社村田製作所 | Multilayered substrate |
-
1990
- 1990-09-14 JP JP24509190A patent/JPH04124898A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018163982A1 (en) * | 2017-03-09 | 2018-09-13 | 株式会社村田製作所 | Multilayered substrate |
| US11375611B2 (en) | 2017-03-09 | 2022-06-28 | Murata Manufacturing Co., Ltd. | Multilayer substrate |
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