JPH04119663A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH04119663A JPH04119663A JP24058790A JP24058790A JPH04119663A JP H04119663 A JPH04119663 A JP H04119663A JP 24058790 A JP24058790 A JP 24058790A JP 24058790 A JP24058790 A JP 24058790A JP H04119663 A JPH04119663 A JP H04119663A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cells
- semiconductor substrate
- pads
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 241000220317 Rosa Species 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセミカスタム半導体装置におけるパッド及び、
入出力セルの配置方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a pad in a semi-custom semiconductor device and
Concerning how to arrange input/output cells.
本発明は、セミカスタム半導体装置において、半導体装
置のパッド及び入出力セルを、半導体基板の裏部に配置
することにより、半導体基板の表部の全体を内部セルで
使用可能にするものである〔従来の技術〕
従来のセミカスタム半導体装置は、第４図に示すように
、２０１のパッド、２０２０人出力セルを、半導体基板
の表部に配置していた。The present invention provides a semi-custom semiconductor device in which pads and input/output cells of the semiconductor device are arranged on the back side of the semiconductor substrate, thereby making the entire front side of the semiconductor substrate usable for internal cells. Prior Art] As shown in FIG. 4, a conventional semi-custom semiconductor device has 201 pads and 2020 output cells arranged on the surface of a semiconductor substrate.
しかし、従来のセミカスタム半導体装置は、パッド及び
入出力セルを、半導体基板の表部に配置していたため、
表部全体を内部セルで使用することは、不可能であり、
内部セルの利用率が低いという問題を有していた。そこ
で、本発明は、従来のこのような問題を解決するための
もので、その目的は、パッド及び入出力セルを、半導体
基板の裏部に配置することにより、半導体基板の表部（
全体を内部セルで使用可能にするところにある。However, in conventional semi-custom semiconductor devices, pads and input/output cells were placed on the surface of the semiconductor substrate.
It is not possible to use the entire surface area for internal cells;
The problem was that the utilization rate of internal cells was low. SUMMARY OF THE INVENTION The present invention is intended to solve these conventional problems.The purpose of the present invention is to arrange pads and input/output cells on the back side of a semiconductor substrate, so that pads and input/output cells can be placed on the front side (
The whole thing is made available in internal cells.
本発明の半導体装置は、
１）セミカスタム半導体装置において、２）金属材料ま
たは、半導体材料からなるバラを有し、
３）前記、パッドに隣接している入出力セルを口し、
４）前記、パッドと入出力セルを、半導体基板６裏邪に
配置することを特徴とする。The semiconductor device of the present invention includes: 1) a semi-custom semiconductor device, 2) having a rose made of a metal material or a semiconductor material, 3) connecting an input/output cell adjacent to the pad, and 4) said , the pads and input/output cells are arranged on the back side of the semiconductor substrate 6.
第１図は本発明の表の全体図であり、１０１＆内部セル
のセル列、１０２は半導体装置の基板、１０３は半導体
基板の表の内部セルと、裏の人しカセルとを接続するた
めの貫通溝である。FIG. 1 is an overall view of the front of the present invention, with cell rows 101 and internal cells, 102 a substrate of a semiconductor device, and 103 a cell line for connecting the internal cells on the front of the semiconductor substrate and the human case on the back. It is a through groove.
第２図は本発明の裏の全体図であり、２０１ ＆：パッ
ド、２０２は前記パッドに接続されているノ出力セルで
ある。FIG. 2 is an overall view of the back of the present invention, in which 201 &: pads and 202 are output cells connected to the pads.
第６図は本発明の断面図であり、５０１は半導体基板の
表の内部セルと、裏の人出力セルを、１０５の貫通溝を
通して接続するための、アルミ配線である。FIG. 6 is a sectional view of the present invention, and 501 is an aluminum wiring for connecting the internal cells on the front side of the semiconductor substrate and the human output cells on the back side through the through groove 105.
１０６０貫通溝の情報は予めマスク作成時に入れておく
ものとする。Information on the 1060 through grooves shall be entered in advance at the time of mask creation.
実施例では、半導体基板の表の内部セルと、裏の人出力
セルを接続するために、アルミを用いたが、これは導伝
材料であれば、どのようなものでもよく、特に限定する
ものではない。In the embodiment, aluminum was used to connect the internal cells on the front side of the semiconductor substrate and the human output cells on the back side, but any conductive material may be used, and there are no particular limitations. isn't it.
以上述べたように発明によれば、人出力セルを、半導体
基板の裏側に配置することにより、半導体基板の表金体
を内部セルで使用することが可能になり、内部セルの利
用率が飛躍的に向上する。As described above, according to the invention, by arranging the human output cell on the back side of the semiconductor substrate, it becomes possible to use the surface metal body of the semiconductor substrate in the internal cell, which dramatically increases the utilization rate of the internal cell. to improve.
このように、本発明の、半導体装置の内部セル数の増大
の効果は、極めて大きい。As described above, the effect of increasing the number of internal cells of a semiconductor device according to the present invention is extremely large.
第１図は本発明の半導体装置の表部の全体図第２図は本
発明の半導体装置の裏部の全体区第６図は本発明の半導
体装置の断面図。
第４図は従来の半導体装置の全体図である。
１０１・・・・・・・・・セル列
１０２・・・・・・・・・半導体基板
１０５・・・・・・・・・貫通溝
２０１・・・・・・・・・パッド
２０２・・・・・・・・・入出力セル
５０１・・・・・・・・・アルミ配線
以上FIG. 1 is an overall view of the front side of the semiconductor device of the present invention. FIG. 2 is an overall view of the back side of the semiconductor device of the present invention. FIG. 6 is a sectional view of the semiconductor device of the present invention. FIG. 4 is an overall diagram of a conventional semiconductor device. 101...Cell row 102...Semiconductor substrate 105...Through groove 201...Pad 202... ......Input/output cell 501...More than aluminum wiring
Claims (1)
、 ｂ）前記、パッドに隣接している入出力セルを有し、 ｃ）前記、パッドと入出力セルを、半導体基板の裏部に
配置することを特徴とする半導体装置。(1) A semi-custom semiconductor device, a) having a pad made of a metal material or a semiconductor material, b) having an input/output cell adjacent to the pad, c) the pad and the input/output cell A semiconductor device characterized in that: is arranged on the back side of a semiconductor substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24058790A JPH04119663A (en) | 1990-09-11 | 1990-09-11 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24058790A JPH04119663A (en) | 1990-09-11 | 1990-09-11 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04119663A true JPH04119663A (en) | 1992-04-21 |
Family
ID=17061735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24058790A Pending JPH04119663A (en) | 1990-09-11 | 1990-09-11 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04119663A (en) |
-
1990
- 1990-09-11 JP JP24058790A patent/JPH04119663A/en active Pending
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