JPH04107872U - organic electronic components - Google Patents

Abstract

(57) [Summary] [Structure] Consists of a plurality of organic substrates 1A and 1B on which components are mounted and external terminals taken out. Among these organic substrates, the basic organic substrate 1A has external terminals of other organic substrates 1B. 2
The other organic substrate has a through hole 4 at a position corresponding to B, and the external terminal 2B of the other organic substrate is inserted into the through hole 4 of the base substrate, and the organic substrate is overlaid on the base substrate and fixedly connected and integrated with solder 5 at the through hole portion. [Effect] Since the organic substrates are stacked and connected, the component mounting area per organic electronic component can be increased several times compared to the conventional area, making high-density mounting possible. By using external terminals as pins, it is possible to support a large number of pins.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to organic electronic components, and in particular to the structure of high-density packaging of organic electronic components. .

0002

[Conventional technology]

Conventional high-density mounting methods for organic electronic components include multilayering of single organic substrates, and thinner conductor wiring formed on organic substrates. In addition, as shown in Figure 3, the mounting part As the number of products increases, components can be mounted on both sides of an organic substrate and the size of the organic substrate increases. The solution was to increase the size of the .

0003

[Problem that the idea aims to solve]

In the conventional high-density mounting structure for single-organic electronic components, there are only two component mounting surfaces: front and back. As the number of components mounted increases as the circuit becomes more complex, the number of organic substrates increases proportionally. The size also needs to be increased. Additionally, the current standardized assembly process is no longer required. There were problems such as not coming.

0004 The purpose of this invention is to increase the number of mounted components without increasing the size of the organic board. This enables high-density mounting and standardization of the assembly process. Our goal is to provide organic electronic components that can.

[0005]

[Means to solve the problem]

The organic electronic component of this invention consists of multiple organic substrates on which components are mounted and external terminals are taken out. Among these organic substrates, the basic organic substrate has an external layer of other organic substrates. There is a through hole at the position corresponding to the terminal, and other organic substrates are connected to the outside of the organic substrate. Insert the terminal into the above-mentioned through-hole, stack it on the base board, and secure it at the through-hole part. It is characterized by being connected and integrated.

[0006] In addition, by using the external terminals attached to each organic board as is, it is possible to increase the number of pins. It becomes possible to respond to changes in

[0007]

【Example】

Next, the present invention will be explained with reference to the drawings. Figure 1 is a cross section of an embodiment of the present invention. In the figure, Figure 1(a) shows the state of each organic board before integration, and Figure 1(b) shows the state of each organic plate after insertion. It shows a state where they are connected and integrated. As shown in Figure 1(a), the present invention has a membrane circuit configuration. Components 2A and 2B are mounted on the organic substrates 1A and 1B, respectively, and external terminals 2A are installed. , 2B, attach the upper part to the through-hole part 4 installed on the organic substrate 1A that will serve as the base. Insert the external terminal 2B of the organic substrate 1B and connect it to the solder 5 as shown in Figure 1(b). It is further fixed and connected to become a single electronic component.

[0008] FIG. 2 is a sectional view of another embodiment of the present invention, in which organic substrates 1A, 1 B and 1C are stacked in three layers and fixed and connected using solder 5 to form a single electronic component. let At this time, the external terminals 2B and 2C of the second and third layers are installed at corresponding positions on the base board. Each external terminal is an integrated electronic Consists of component pins.

[0009]

[Effect of the idea]

As explained above, the present invention consists of overlapping multiple organic substrates on a basic organic substrate. By making cross-connections and integrating them, the mounting area per organic electronic component can be reduced compared to conventional Since the area can be several times larger than the actual area, it has the effect of enabling high-density mounting. have

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of one embodiment of the organic electronic component of the present invention, where (a) shows the state of each organic substrate before integration;
Part (b) shows a state in which they are integrated by soldering.

FIG. 2 is a sectional view of another embodiment of the organic electronic component of the present invention.

FIG. 3 is a cross-sectional view of an example of a conventional organic electronic component.

[Explanation of symbols]

1, 1A, 1B, 1C Organic board 2, 2A, 2B, 2C (clip type) external terminal 3, 3A, 3B Various mounting parts 4 Through hole 5 Solder for connection

Claims (2)

[Scope of utility model registration request] Claim 1: Consisting of a plurality of organic substrates on which components are mounted and external terminals taken out, a base organic substrate among the organic substrates has through holes at positions corresponding to external terminals of other organic substrates. An organic electronic component characterized in that the other organic substrate is integrated by inserting external terminals of the organic substrate into the through holes, superimposing them on the base substrate, and fixedly connecting them at the through hole portions. 2. The organic electronic component according to claim 1, wherein the external terminals attached to each of the organic substrates are directly used as external terminals of an integrated product.