JPH0350782A - Circuit module - Google Patents
Circuit moduleInfo
- Publication number
- JPH0350782A JPH0350782A JP1185527A JP18552789A JPH0350782A JP H0350782 A JPH0350782 A JP H0350782A JP 1185527 A JP1185527 A JP 1185527A JP 18552789 A JP18552789 A JP 18552789A JP H0350782 A JPH0350782 A JP H0350782A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- conductors
- metal
- circuit module
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ハイブリットＩＣ等の回路モジュールに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to circuit modules such as hybrid ICs.
従来の技術
従来、この種の電子回路モジュールは、第３図に示すよ
うなスルーホール接続や、第４図に示すようなリード端
子によって表裏の導体が接続されていた。なお、第３図
において、１は印刷基板、２は印刷導体、３はスルーホ
ール接続穴である。2. Description of the Related Art Conventionally, in this type of electronic circuit module, conductors on the front and back sides were connected by through-hole connections as shown in FIG. 3 or lead terminals as shown in FIG. 4. In addition, in FIG. 3, 1 is a printed circuit board, 2 is a printed conductor, and 3 is a through-hole connection hole.
又、第４図において４は印刷基板、５は導体、６はリー
ド端子である。Further, in FIG. 4, 4 is a printed circuit board, 5 is a conductor, and 6 is a lead terminal.
発明が解決しようとする課題
このような電子回路モジュールにおいては、コスト高で
あったり、設計の自由性に制限がつけられたりする事が
多いという問題があった。Problems to be Solved by the Invention In such electronic circuit modules, there are problems in that the cost is high and the freedom of design is often limited.
本発明はこのような課題に鑑み、ローコスト化と設計自
由度向上を目的とする。In view of these problems, the present invention aims to reduce costs and improve design freedom.
課題を解決するための手段
この課題を解決するために本発明は、金属からなる接続
用薄板を基板の端部に嵌着し、表裏の導体を電気的に接
続を行なうものである。Means for Solving the Problems In order to solve the problems, the present invention provides a method in which a thin metal connection plate is fitted onto the edge of the substrate to electrically connect the conductors on the front and back sides.
作用
この構成により、基板の端部の任意の場所で接続が可能
となり、スルーホールと併用すれば、さらに自由度の高
い効率的な回路構成が得られる。Function: This configuration allows connection to be made at any location on the edge of the board, and when used in conjunction with through holes, an efficient circuit configuration with even greater flexibility can be obtained.
実施例
以下、本発明の実施例を第１図、第２図を用いて説明す
る。EXAMPLE Hereinafter, an example of the present invention will be explained using FIGS. 1 and 2.
（実施例１）
第１図に本発明の第１の実施例を示しており、第１図に
おいて１１は印刷基板であり、１２は表面に印刷された
導体であり、１３は接続用薄板であり、通常鋼又は鉄の
金属よりなり、印刷基板１１の端部に嵌着されると共に
、先端部が印刷基板１１の表裏の導体１２に半田付けさ
れる。(Example 1) Fig. 1 shows a first embodiment of the present invention. In Fig. 1, 11 is a printed circuit board, 12 is a conductor printed on the surface, and 13 is a thin connection plate. It is usually made of metal such as steel or iron, and is fitted onto the end of the printed circuit board 11, and its tip end is soldered to the conductor 12 on the front and back sides of the printed circuit board 11.
この実施例によれば、コスト高なスルーホールがなくて
も表面と裏面の接続ができ、板状の接続用薄板を用いる
事により容易に接続ができる。According to this embodiment, the front and back surfaces can be connected without the need for expensive through holes, and the connection can be made easily by using a thin plate-like connection plate.
（実施例２）
第２図に本発明の第２の実施例を示しており、第２図に
おいて、１４は印刷基板であり、１５は表面に印刷され
た導体であり、１６は接続用薄板であり、１７は導体保
護を兼ねた絶縁層である。(Embodiment 2) Fig. 2 shows a second embodiment of the present invention. In Fig. 2, 14 is a printed circuit board, 15 is a conductor printed on the surface, and 16 is a thin connection plate. 17 is an insulating layer that also serves as conductor protection.
すなわち、本実施例では、複数枚の印刷基板１４を積層
し、この積層体の端部に接続用薄板１６を嵌着し、印刷
基板１４の導体１５同志を接続したものである。That is, in this embodiment, a plurality of printed circuit boards 14 are stacked, a connecting thin plate 16 is fitted to the end of this stacked body, and the conductors 15 of the printed circuit boards 14 are connected to each other.
この構成により、簡単な印刷基板による４層以上の高密
度配線が簡単に得られる。With this configuration, high-density wiring of four or more layers can be easily obtained using a simple printed circuit board.
発明の効果
以上のように本発明によれば、基板の外周を利用して接
続用薄板により接続する事により、容易に回路の高集積
度化を図ることができる。Effects of the Invention As described above, according to the present invention, it is possible to easily increase the degree of integration of circuits by making connections using the thin connecting plates using the outer periphery of the substrate.
第１図及び第２図はそれぞれ本発明の一実施例による回
路モジュールの断面図、第３図及び第４図は従来の回路
モジュールの断面図である。
１１．１４・・・・・・印刷基板、１２．１５・・・・
・・導体、１３．１７・・・・・・接続用薄板、１６・
・・・・・絶縁層。FIGS. 1 and 2 are sectional views of a circuit module according to an embodiment of the present invention, and FIGS. 3 and 4 are sectional views of a conventional circuit module. 11.14...Printed circuit board, 12.15...
...Conductor, 13.17...Thin plate for connection, 16.
...Insulating layer.
Claims (2)
の端部に嵌着される接続用薄板により接続した回路モジ
ユール。(1) A circuit module in which conductors on the front and back sides of a board with printed wiring on both sides are connected by a thin connection plate fitted to the end of the board.
体の端部に嵌着される接続用薄板により複数枚の基板上
の導体を接続した回路モジュール。(2) A circuit module in which a plurality of boards with printed wiring are stacked and conductors on the plurality of boards are connected by a connecting thin plate fitted to the end of the laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1185527A JPH0350782A (en) | 1989-07-18 | 1989-07-18 | Circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1185527A JPH0350782A (en) | 1989-07-18 | 1989-07-18 | Circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350782A true JPH0350782A (en) | 1991-03-05 |
Family
ID=16172363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1185527A Pending JPH0350782A (en) | 1989-07-18 | 1989-07-18 | Circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350782A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160098758A (en) * | 2015-02-11 | 2016-08-19 | 최동권 | Rotating accessory |
-
1989
- 1989-07-18 JP JP1185527A patent/JPH0350782A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160098758A (en) * | 2015-02-11 | 2016-08-19 | 최동권 | Rotating accessory |
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