JPH0410753B2 - - Google Patents
Info
- Publication number
- JPH0410753B2 JPH0410753B2 JP60294501A JP29450185A JPH0410753B2 JP H0410753 B2 JPH0410753 B2 JP H0410753B2 JP 60294501 A JP60294501 A JP 60294501A JP 29450185 A JP29450185 A JP 29450185A JP H0410753 B2 JPH0410753 B2 JP H0410753B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal transfer
- transfer metal
- insulating film
- film base
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29450185A JPS62150896A (ja) | 1985-12-25 | 1985-12-25 | 配線回路基板の配線形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29450185A JPS62150896A (ja) | 1985-12-25 | 1985-12-25 | 配線回路基板の配線形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62150896A JPS62150896A (ja) | 1987-07-04 |
| JPH0410753B2 true JPH0410753B2 (enEXAMPLES) | 1992-02-26 |
Family
ID=17808587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29450185A Granted JPS62150896A (ja) | 1985-12-25 | 1985-12-25 | 配線回路基板の配線形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62150896A (enEXAMPLES) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5251828B2 (ja) * | 2009-10-26 | 2013-07-31 | 住友金属鉱山株式会社 | 立体的回路基板の製造方法 |
| JP6057135B2 (ja) * | 2013-07-11 | 2017-01-11 | コニカミノルタ株式会社 | 導電パターンの形成方法 |
| JP2016213221A (ja) * | 2015-04-30 | 2016-12-15 | 国立研究開発法人物質・材料研究機構 | 金属箔を用いた電極配線の形成方法及びこれを用いた有機トランジスタの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS565077A (en) * | 1979-06-26 | 1981-01-20 | Bibun Corp | Preparation of dried fish paste product |
-
1985
- 1985-12-25 JP JP29450185A patent/JPS62150896A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62150896A (ja) | 1987-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MC2169A1 (fr) | Resistance electrique sous forme de puce a montage de surface et son procede de fabrication | |
| JPH0410753B2 (enEXAMPLES) | ||
| US5219607A (en) | Method of manufacturing printed circuit board | |
| EP0835046B1 (en) | Component mounting board, process for producing the board, and process for producing the module | |
| JPS5815957B2 (ja) | 接点付プリント配線基板の製造方法 | |
| US20050062587A1 (en) | Method and structure of a substrate with built-in via hole resistors | |
| KR950001266B1 (ko) | 알루미늄 회로기판의 제조방법 및 그 회로기판 | |
| JP2000133943A (ja) | 多層基板の製造方法 | |
| US20060096780A1 (en) | Thin film circuit integrating thick film resistors thereon | |
| JPH0224395B2 (enEXAMPLES) | ||
| JP2003304060A (ja) | 両面回路基板の製造法 | |
| JP2681205B2 (ja) | 膜素子付プリント配線板 | |
| JPS6244840B2 (enEXAMPLES) | ||
| JPS5814726B2 (ja) | デンシカイロソウチセイゾウホウホウ | |
| JPH03255691A (ja) | プリント配線板 | |
| JP3855303B2 (ja) | プリント配線板の製造方法 | |
| WO1979000860A1 (en) | Ceramic condenser and method of manufacturing the same | |
| JP2000323837A (ja) | 多層印刷配線基板の製造方法 | |
| JPS62171194A (ja) | マトリクス配線板 | |
| JPH0122758B2 (enEXAMPLES) | ||
| JPS59232491A (ja) | 多層印刷配線板の製造方法 | |
| JPS5841799B2 (ja) | 印刷配線板 | |
| JPS6049588B2 (ja) | セラミック多層プリント板の製造方法 | |
| JPH04336489A (ja) | プリント基板 | |
| JPH0358197B2 (enEXAMPLES) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |