JPH0410689B2 - - Google Patents

Info

Publication number
JPH0410689B2
JPH0410689B2 JP21241082A JP21241082A JPH0410689B2 JP H0410689 B2 JPH0410689 B2 JP H0410689B2 JP 21241082 A JP21241082 A JP 21241082A JP 21241082 A JP21241082 A JP 21241082A JP H0410689 B2 JPH0410689 B2 JP H0410689B2
Authority
JP
Japan
Prior art keywords
base metal
contact
contact material
peripheral vertical
sintering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21241082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59101721A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP21241082A priority Critical patent/JPS59101721A/ja
Priority to US06/508,160 priority patent/US4530815A/en
Priority to DE8383303763T priority patent/DE3381576D1/de
Priority to EP83303763A priority patent/EP0099671B1/en
Publication of JPS59101721A publication Critical patent/JPS59101721A/ja
Publication of JPH0410689B2 publication Critical patent/JPH0410689B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacture Of Switches (AREA)
JP21241082A 1982-06-29 1982-12-01 開閉器用接点の製造方法 Granted JPS59101721A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP21241082A JPS59101721A (ja) 1982-12-01 1982-12-01 開閉器用接点の製造方法
US06/508,160 US4530815A (en) 1982-06-29 1983-06-27 Method of producing a contact device for a switch
DE8383303763T DE3381576D1 (de) 1982-06-29 1983-06-29 Verfahren zur herstellung von kontakten fuer schalter.
EP83303763A EP0099671B1 (en) 1982-06-29 1983-06-29 Method of producing a contact device for a switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21241082A JPS59101721A (ja) 1982-12-01 1982-12-01 開閉器用接点の製造方法

Publications (2)

Publication Number Publication Date
JPS59101721A JPS59101721A (ja) 1984-06-12
JPH0410689B2 true JPH0410689B2 (enrdf_load_stackoverflow) 1992-02-26

Family

ID=16622120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21241082A Granted JPS59101721A (ja) 1982-06-29 1982-12-01 開閉器用接点の製造方法

Country Status (1)

Country Link
JP (1) JPS59101721A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5734067B2 (ja) * 2011-04-13 2015-06-10 三菱電機株式会社 真空バルブ用接点材料の製造方法及び真空バルブ

Also Published As

Publication number Publication date
JPS59101721A (ja) 1984-06-12

Similar Documents

Publication Publication Date Title
EP0500750A4 (en) METHOD FOR HOUSING AN ELECTRONIC DEVICE ADHESIVE BY ADHESIVE TAPE AND HOUSING USED.
JP2000022044A (ja) 半導体装置とその製造方法
US6284985B1 (en) Ceramic circuit board with a metal plate projected to prevent solder-flow
US4138691A (en) Framed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead strips
JPH05226564A (ja) 半導体装置
JP2000003988A (ja) リードフレームおよび半導体装置
WO1992004730A1 (en) Semiconductor device and its manufacturing process
US5055909A (en) System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink
US5200365A (en) System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink
EP0099671B1 (en) Method of producing a contact device for a switch
JPH0410689B2 (enrdf_load_stackoverflow)
JP2001267461A (ja) 半導体装置の製造方法
US5345038A (en) Multi-layer ceramic packages
JPS5936426B2 (ja) Ｉｃ用リ−ドフレ−ム
JPH04134852A (ja) リードフレーム
JPS6232622B2 (enrdf_load_stackoverflow)
JP3420469B2 (ja) 配線基板
JPH0749152B2 (ja) 整流素子の外囲器の製造方法
JP3301915B2 (ja) 半導体素子収納用パッケージ及びその製造方法
JPH0350736A (ja) 半導体チップのバンプ製造方法
JP2005158771A (ja) 半導体装置およびその製造方法
JP2005191270A (ja) 半導体装置の製造方法
JP2005079524A (ja) 半導体装置用リードフレーム
JPS6178150A (ja) 樹脂封止型半導体装置用リ−ドフレ−ム
JPH11135546A (ja) 樹脂封止型半導体装置及びその製造方法