JPH039377Y2 - - Google Patents
Info
- Publication number
- JPH039377Y2 JPH039377Y2 JP1983104061U JP10406183U JPH039377Y2 JP H039377 Y2 JPH039377 Y2 JP H039377Y2 JP 1983104061 U JP1983104061 U JP 1983104061U JP 10406183 U JP10406183 U JP 10406183U JP H039377 Y2 JPH039377 Y2 JP H039377Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- metal plate
- thin plate
- yig
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Die Bonding (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10406183U JPS6013744U (ja) | 1983-07-05 | 1983-07-05 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10406183U JPS6013744U (ja) | 1983-07-05 | 1983-07-05 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6013744U JPS6013744U (ja) | 1985-01-30 |
| JPH039377Y2 true JPH039377Y2 (enrdf_load_stackoverflow) | 1991-03-08 |
Family
ID=30244507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10406183U Granted JPS6013744U (ja) | 1983-07-05 | 1983-07-05 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6013744U (enrdf_load_stackoverflow) |
-
1983
- 1983-07-05 JP JP10406183U patent/JPS6013744U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6013744U (ja) | 1985-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3721841A (en) | Contact for piezoelectric crystals | |
| JPS63106910A (ja) | 薄膜磁気ヘツド | |
| JPS58172008A (ja) | 圧電振動子の構造及びその製造方法 | |
| JPH039377Y2 (enrdf_load_stackoverflow) | ||
| JP2000114608A (ja) | 回路基板の実装方法および回路基板の実装構造 | |
| JPS6213005A (ja) | 磁性体の製造方法 | |
| JPH056949A (ja) | ヒ−トシンク | |
| JP2565226B2 (ja) | 磁気共振装置 | |
| JPH0233392Y2 (enrdf_load_stackoverflow) | ||
| JPS6431444A (en) | Porcelain substrate for surface mounting | |
| JPH03269976A (ja) | 電気的接続部材の製造方法 | |
| JP2558769Y2 (ja) | 誘電体共振子 | |
| JPH0238497Y2 (enrdf_load_stackoverflow) | ||
| JPH0119458Y2 (enrdf_load_stackoverflow) | ||
| JPH0249757Y2 (enrdf_load_stackoverflow) | ||
| JPH0251906A (ja) | チップ型圧電共振子及びその製造方法 | |
| JPS6317263Y2 (enrdf_load_stackoverflow) | ||
| JPS60183434U (ja) | 集積回路形成用ウエハ | |
| JPS5855673Y2 (ja) | 電子部品の取付装置 | |
| JPH0628267B2 (ja) | 半導体装置容器 | |
| JPH02207556A (ja) | 混成集積回路及びその製造方法 | |
| JP2575996Y2 (ja) | ワイヤボンディング用パッド | |
| JPH0136326Y2 (enrdf_load_stackoverflow) | ||
| JPS63246806A (ja) | 薄膜デバイス | |
| JPH0469936A (ja) | はんだバンプの形成方法および実装方法 |