JPH0387665U - - Google Patents
Info
- Publication number
- JPH0387665U JPH0387665U JP14782889U JP14782889U JPH0387665U JP H0387665 U JPH0387665 U JP H0387665U JP 14782889 U JP14782889 U JP 14782889U JP 14782889 U JP14782889 U JP 14782889U JP H0387665 U JPH0387665 U JP H0387665U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor device
- adhesive
- adhesive member
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Packages (AREA)
Description
第１図ａはテーピング状態を示す平面図、第１
図ｂは本考案の一実施例のＡＡ′線断面図、第２
図は別の実施例の断面図、第３図は別の実施例の
断面図である。
１……テープ、２……接着部材、３……非粘着
性テープ、４……パツケージ本体、５……外部リ
ード、６……開口部、８……ソルダペースト。
Figure 1a is a plan view showing the taping state;
Figure b is a sectional view taken along the line AA' of one embodiment of the present invention.
The figure is a sectional view of another embodiment, and FIG. 3 is a sectional view of another embodiment. DESCRIPTION OF SYMBOLS 1... Tape, 2... Adhesive member, 3... Non-adhesive tape, 4... Package body, 5... External lead, 6... Opening, 8... Solder paste.
Claims (1)
装するときの仮止め接着部材として流用可能な接
着部材を、パツケージ本体のフラツト面に設けた
半導体装置が、テープ開口部に配置され、テープ
裏側から前記接着部材を利用してテープに固定さ
れていることを特徴とする半導体装置のテーピン
グ構造。 A semiconductor device having an adhesive member provided on the flat surface of the package body, which can be used as a temporary adhesive member when mounting a flat package type semiconductor device on a board, is placed in the tape opening, and the adhesive is applied from the back side of the tape. A taping structure for a semiconductor device, characterized in that it is fixed to a tape using a member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14782889U JPH0387665U (en) | 1989-12-22 | 1989-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14782889U JPH0387665U (en) | 1989-12-22 | 1989-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0387665U true JPH0387665U (en) | 1991-09-06 |
Family
ID=31694303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14782889U Pending JPH0387665U (en) | 1989-12-22 | 1989-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0387665U (en) |
-
1989
- 1989-12-22 JP JP14782889U patent/JPH0387665U/ja active Pending
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