JPH0386706A - Magnetic recording medium - Google Patents
Magnetic recording mediumInfo
- Publication number
- JPH0386706A JPH0386706A JP1223184A JP22318489A JPH0386706A JP H0386706 A JPH0386706 A JP H0386706A JP 1223184 A JP1223184 A JP 1223184A JP 22318489 A JP22318489 A JP 22318489A JP H0386706 A JPH0386706 A JP H0386706A
- Authority
- JP
- Japan
- Prior art keywords
- film
- recording medium
- magnetic recording
- magnetic
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 claims abstract description 68
- 230000003068 static effect Effects 0.000 claims abstract description 14
- 230000003746 surface roughness Effects 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 24
- 239000010419 fine particle Substances 0.000 claims description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 52
- 239000010410 layer Substances 0.000 abstract description 30
- 239000002356 single layer Substances 0.000 abstract description 3
- 230000000704 physical effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 84
- -1 polyethylene terephthalate Polymers 0.000 description 52
- 238000000034 method Methods 0.000 description 39
- 239000002585 base Substances 0.000 description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000002245 particle Substances 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 12
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 239000012778 molding material Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 150000003440 styrenes Chemical class 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000003011 styrenyl group Polymers [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 1
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical group C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- KYARBIJYVGJZLB-UHFFFAOYSA-N 7-amino-4-hydroxy-2-naphthalenesulfonic acid Chemical compound OC1=CC(S(O)(=O)=O)=CC2=CC(N)=CC=C21 KYARBIJYVGJZLB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910020630 Co Ni Inorganic materials 0.000 description 1
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 1
- 229910002440 Co–Ni Inorganic materials 0.000 description 1
- 229910020516 Co—V Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical group CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 1
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- KCFQLCPMVCXRHF-UHFFFAOYSA-N O.[Na+].[Na+].[Na+].[O-]B([O-])[O-] Chemical compound O.[Na+].[Na+].[Na+].[O-]B([O-])[O-] KCFQLCPMVCXRHF-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- FAARTQSZKSBAOS-UHFFFAOYSA-N barium(2+);diphosphite Chemical compound [Ba+2].[Ba+2].[Ba+2].[O-]P([O-])[O-].[O-]P([O-])[O-] FAARTQSZKSBAOS-UHFFFAOYSA-N 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- AAEHPKIXIIACPQ-UHFFFAOYSA-L calcium;terephthalate Chemical compound [Ca+2].[O-]C(=O)C1=CC=C(C([O-])=O)C=C1 AAEHPKIXIIACPQ-UHFFFAOYSA-L 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- GRFFKYTUNTWAGG-UHFFFAOYSA-N chloroethene;prop-2-enenitrile Chemical compound ClC=C.C=CC#N GRFFKYTUNTWAGG-UHFFFAOYSA-N 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- DGVMNQYBHPSIJS-UHFFFAOYSA-N dimagnesium;2,2,6,6-tetraoxido-1,3,5,7-tetraoxa-2,4,6-trisilaspiro[3.3]heptane;hydrate Chemical compound O.[Mg+2].[Mg+2].O1[Si]([O-])([O-])O[Si]21O[Si]([O-])([O-])O2 DGVMNQYBHPSIJS-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- BMQVDVJKPMGHDO-UHFFFAOYSA-K magnesium;potassium;chloride;sulfate;trihydrate Chemical compound O.O.O.[Mg+2].[Cl-].[K+].[O-]S([O-])(=O)=O BMQVDVJKPMGHDO-UHFFFAOYSA-K 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- CPOFMOWDMVWCLF-UHFFFAOYSA-N methyl(oxo)alumane Chemical compound C[Al]=O CPOFMOWDMVWCLF-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- YALAVAYMNJCEBU-UHFFFAOYSA-N n-(2-chloro-3-formylpyridin-4-yl)-2,2-dimethylpropanamide Chemical compound CC(C)(C)C(=O)NC1=CC=NC(Cl)=C1C=O YALAVAYMNJCEBU-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- FPVKHBSQESCIEP-JQCXWYLXSA-N pentostatin Chemical compound C1[C@H](O)[C@@H](CO)O[C@H]1N1C(N=CNC[C@H]2O)=C2N=C1 FPVKHBSQESCIEP-JQCXWYLXSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920003197 poly( p-chlorostyrene) Polymers 0.000 description 1
- 229920001620 poly(3-methyl styrene) Polymers 0.000 description 1
- 229920001627 poly(4-methyl styrene) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001608 poly(methyl styrenes) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- XWKBMOUUGHARTI-UHFFFAOYSA-N tricalcium;diphosphite Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])[O-].[O-]P([O-])[O-] XWKBMOUUGHARTI-UHFFFAOYSA-N 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Magnetic Record Carriers (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁気記録媒体に関し、詳しくはすべり性、平滑
性、温度及び湿度に対する寸法安定性等にすぐれ、磁気
テープ、磁気ディスク、磁気ドラム、磁気カードなどに
有用な磁気記録媒体に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magnetic recording medium, and more specifically, it has excellent slip properties, smoothness, dimensional stability against temperature and humidity, etc., and is suitable for use in magnetic tapes, magnetic disks, magnetic drums, etc. This invention relates to magnetic recording media useful for magnetic cards and the like.
〔従来の技術及び発明が解決しようとする課題]従来か
ら、磁気記録媒体としてポリエチレンテレフタレート(
PET)フィルム支持体に磁性層を塗布したものが広く
用いられている。しかし、PETフィルムは耐水性が劣
り、高温、高湿下で加水分解するおそれがあり、使用に
耐えなくなる場合がある。また、PETのガラス転移温
度は、60〜70°Cであり、それ以上の高温下での使
用には、伸び等が生じやすいため、必ずしも信頼性が充
分でない。[Prior art and problems to be solved by the invention] Conventionally, polyethylene terephthalate (
PET) film supports coated with a magnetic layer are widely used. However, PET film has poor water resistance and may be hydrolyzed under high temperature and high humidity, making it unusable in some cases. Further, the glass transition temperature of PET is 60 to 70°C, and when used at higher temperatures, elongation tends to occur, so reliability is not necessarily sufficient.
一方、近年に至って磁気記録媒体が高密度化する傾向に
あり、その信頼性への要求が高まっている。高密度化の
一つの手段として蒸着法があるが、PETフィルムでは
耐熱性が不足し、またオリゴマー析出等の問題がある。On the other hand, in recent years, magnetic recording media have tended to have higher densities, and demands for their reliability have increased. Vapor deposition is one method for increasing the density, but PET films lack heat resistance and have problems such as oligomer precipitation.
ところで、本発明者らのグループが先般開発した主とし
てシンジオタクチック構造を有するスチレン系重合体は
、PETに比べ、耐熱性、耐水性や寸法安定性にすぐれ
、しかもオリゴマーの少ない重合体であって、様々な用
途が期待されている。By the way, the styrenic polymer mainly having a syndiotactic structure, which was recently developed by the group of the present inventors, has superior heat resistance, water resistance, and dimensional stability compared to PET, and is a polymer with less oligomers. , is expected to have a variety of uses.
そこで、本発明者らはこの主としてシンジオタクチック
構造を有するスチレン系重合体を用いて、高温、高温等
の過酷な条件下でも信頼性の高い磁気記録媒体を開発す
べく鋭意研究を重ねた。Therefore, the inventors of the present invention have conducted intensive research to develop a magnetic recording medium that is highly reliable even under harsh conditions such as high temperatures and high temperatures, using this styrene polymer mainly having a syndiotactic structure.
その結果、上記スチレン系重合体又はその組成物の延伸
フィルムあるいは該延伸フィルムを含む積層フィルムで
あって、線膨張係数及び静摩擦係数が一定範囲にある基
材フィルムに磁性層を有するものが、上記目的に適う磁
気記録媒体になることを見出した。本発明はかかる知見
に基いて完成したものである。As a result, a stretched film of the above-mentioned styrenic polymer or its composition or a laminated film containing the stretched film, which has a magnetic layer on a base film whose coefficient of linear expansion and coefficient of static friction are within a certain range, is as follows. It was discovered that this material can be used as a magnetic recording medium suitable for the purpose. The present invention was completed based on this knowledge.
すなわち本発明は、主としてシンジオタクチック構造を
有するスチレン系重合体又はその組成物の延伸フィルム
あるいは該延伸フィルムを含む積層フィルムであって、
線膨張係数が5X10−’/°C以下及び静摩擦係数が
0.3以上1.0以下である基材フィルムの少なくとも
片面に磁性層を有する磁気記録媒を提供するものである
。That is, the present invention mainly relates to a stretched film of a styrenic polymer having a syndiotactic structure or a composition thereof, or a laminated film containing the stretched film,
The present invention provides a magnetic recording medium having a magnetic layer on at least one side of a base film having a linear expansion coefficient of 5X10-'/°C or less and a static friction coefficient of 0.3 or more and 1.0 or less.
本発明では磁気記録媒体の基材フィルムとして、上述し
た延伸フィルムからなる単層フィルムあるいは該延伸フ
ィルムを含む積層フィルムが用いられる。また、この基
材フィルムは、線膨張係数が5 X 10−5/℃以下
、好ましくは4 X 10−5/℃以下であり、また、
この基材フィルムの静摩擦係数μsについては、0.3
〜1.0、好ましくは0.3〜0.9である。この静摩
擦係数μsは、基材フィルムの表面状態を規定するもの
であるが、特に基材フィルムの磁性層形成側と反対側表
面の静摩擦係数μsが、上記範囲にあることが望ましい
。In the present invention, a single layer film made of the above-mentioned stretched film or a laminated film containing the stretched film is used as the base film of the magnetic recording medium. Further, this base film has a linear expansion coefficient of 5 x 10-5/°C or less, preferably 4 x 10-5/°C or less, and
The static friction coefficient μs of this base film is 0.3
-1.0, preferably 0.3-0.9. This static friction coefficient μs defines the surface condition of the base film, and it is particularly desirable that the static friction coefficient μs of the surface of the base film on the side opposite to the magnetic layer forming side be within the above range.
また、この基材フィルムの表面粗さRaについては、特
に制限はないが、少なくともその片面の表面粗さRaが
、0.001〜0.05 umであることが好ましく、
特に0.001〜0.04μmが最適である。とりわけ
、磁性層形成側の基材フィルムの表面粗さRaが上記範
囲にあることが望ましい。Further, there is no particular restriction on the surface roughness Ra of this base film, but it is preferable that the surface roughness Ra of at least one side thereof is 0.001 to 0.05 um.
In particular, 0.001 to 0.04 μm is optimal. In particular, it is desirable that the surface roughness Ra of the base film on the side where the magnetic layer is formed is within the above range.
なお、上記基材フィルムの湿度膨張係数については、特
に制限はないが、5X10−’/%RH以下が好ましい
。The humidity expansion coefficient of the base film is not particularly limited, but is preferably 5X10-'/%RH or less.
このような本発明の磁気記録媒体のベースフィルムを作
成するにあたっては、各種の方法があるが、具体的には
下記(1)〜(3)の三つの方法を例示することができ
る。There are various methods for producing the base film of the magnetic recording medium of the present invention, and specifically, the following three methods (1) to (3) can be exemplified.
(1)主としてシンジオタクチック構造を有するスチレ
ン系重合体に、無機微粒子を配合してなる組成物、特に
、平均粒径0.01〜3μmの無機微粒子を0.001
−1重量%配合してなる組成物を加熱溶融、押出、冷却
固化、加熱、延伸、熱処理して延伸フィルムを形成する
。これによって、この延伸フィルムのみからなる両面が
平滑かつ粗面化された易滑な単層フィルムが得られる。(1) A composition obtained by blending inorganic fine particles into a styrene polymer mainly having a syndiotactic structure, especially 0.001 μm of inorganic fine particles with an average particle size of 0.01 to 3 μm.
-1% by weight of the composition is heated and melted, extruded, solidified by cooling, heated, stretched, and heat treated to form a stretched film. As a result, an easily slippery single-layer film with smooth and roughened surfaces on both sides can be obtained, which is made only of this stretched film.
(2)上記(1)で用いた組成物と、主としてシンジオ
タクチック構造を有するスチレン系重合体、特に残留ア
ルミニウム分が3000ppm以下、残留チタン分が1
0ppm以下及び残留スチレン系単量体が7000pp
n+以下の高純度のスチレン系重合体、あるいはこのス
チレン系重合体を主成分とする組成物(但し、無機微粒
子を含有しない。)とを加熱溶融、共押出、冷却固化、
加熱、延伸、熱処理して二種類あるいはそれ以上の延伸
フィルムを積層状態で形成する。これによって、片面が
超平滑で他面が粗面化された易滑な多層(積層)フィル
ムが得られる。(2) The composition used in (1) above and a styrenic polymer mainly having a syndiotactic structure, especially a residual aluminum content of 3000 ppm or less and a residual titanium content of 1
0ppm or less and residual styrenic monomer 7000pp
A high-purity styrenic polymer of n+ or less, or a composition containing this styrene polymer as a main component (however, it does not contain inorganic fine particles) is heated and melted, coextruded, cooled and solidified,
Two or more types of stretched films are formed in a laminated state by heating, stretching, and heat treatment. As a result, an easily smooth multilayer (laminated) film having one side that is ultra-smooth and the other side that is roughened can be obtained.
(3)主としてシンジオタクチック構造を有するスチレ
ン系重合体、特に残留アル旦ニウム分が3000ppm
以下、残留チタン分が10ppm以下及び残留スチレン
系単量体が7000ppn+以下の高純度のスチレン系
重合体あるいはこのスチレン系重合体を主成分とする組
成物(但し、無機微粒子を含有しない。)を、加熱溶融
、押出、冷却固化、加熱。(3) Styrenic polymer mainly having a syndiotactic structure, especially residual aluminum content of 3000 ppm
Hereinafter, a high-purity styrenic polymer with a residual titanium content of 10 ppm or less and a residual styrene monomer of 7000 ppn+ or less, or a composition containing this styrene polymer as a main component (however, it does not contain inorganic fine particles) will be used. , heating melting, extrusion, cooling solidification, heating.
延伸、熱処理する過程でその少なくとも片面に、表面粗
面化可能な樹脂或いは無機超微粒子を含有する樹脂M放
物からなる層を、貼り合わせ(ラミネート)、塗布ある
いは蒸着等により形成させることによって、片面が超平
滑でもう一方の面が粗面化された易滑な多層フィルムが
得られる。この際上記樹脂組成物からなる層は、必要に
応じて延伸したものを用いてもよい。By forming a layer of a resin M parabolite containing a resin capable of surface roughening or inorganic ultrafine particles on at least one side during the stretching and heat treatment process by laminating, coating, vapor deposition, etc. An easily smooth multilayer film with one side ultra-smooth and the other side roughened can be obtained. At this time, the layer made of the resin composition may be stretched as necessary.
ここで、積層に用いる樹脂は、主としてシンジオタクチ
ック構造を有するスチレン系重合体や各種ブレンド樹脂
を用いることができるが、融点あるいは軟化点の高い樹
脂が好ましい。また、他樹脂中に含有させる無機微粒子
の種類、量1粒径は、後述の無機微粒子を用いることが
できる。Here, as the resin used for lamination, a styrene polymer having a syndiotactic structure or various blend resins can be used, but a resin having a high melting point or softening point is preferable. Further, as for the type, quantity, and particle size of the inorganic fine particles to be contained in the other resin, the inorganic fine particles described below can be used.
また、積層する方法は特に限定はないが、共押出法の他
にこれらの他樹脂、他樹脂組成物を溶解、塗布する方法
を延伸フィルム製造工程に組み込むと生産性が良い。Although there are no particular limitations on the laminating method, productivity is improved if a method of melting and coating other resins or other resin compositions is incorporated into the stretched film manufacturing process in addition to the coextrusion method.
ここで、特にテープにおいては、上記粗面を有する層を
バックコート層とする場合があり、主として磁性層はこ
の反対の超平滑面側に設けられる。Here, especially in tapes, the layer having the rough surface may be used as a back coat layer, and the magnetic layer is mainly provided on the opposite ultra-smooth surface side.
このようにして得られた延伸フィルムは厚さ2〜500
μmで、線膨張係数5 X 10−S/’C以下。The stretched film thus obtained has a thickness of 2 to 500
In μm, the linear expansion coefficient is 5 x 10-S/'C or less.
静摩擦係数μs0.3〜1.0で且つ(1)の方法によ
れば両面の表面粗さRaが0.005〜0.05μm、
(2)、 (3)の方法によれば易滑な粗面と平滑面の
両方を合せ持ち、それぞれの表面粗さが0.005〜0
.05 μm、 0.001〜0.04 umのもので
ある。また湿度膨張係数が5X10−’/%RH以下で
あればより好ましい。The static friction coefficient μs is 0.3 to 1.0, and according to method (1), the surface roughness Ra on both sides is 0.005 to 0.05 μm,
According to methods (2) and (3), both smooth and rough surfaces are obtained, and the surface roughness of each surface is between 0.005 and 0.
.. 05 μm and 0.001 to 0.04 μm. Further, it is more preferable that the humidity expansion coefficient is 5×10 −′/%RH or less.
フィルム厚さについては、2〜20μmのフィルムが磁
気テープ用に、20〜150μmのフィルムが磁気ディ
スク用に、100〜500μmのフィルムが磁気カード
用として好適である。Regarding the film thickness, a film of 2 to 20 μm is suitable for magnetic tapes, a film of 20 to 150 μm is suitable for magnetic disks, and a film of 100 to 500 μm is suitable for magnetic cards.
これらのフィルムを用いて、磁気記録媒体を作成するが
、必要に応じて、コロナ処理等により表面接着性を改良
したフィルムも用いてもよく、さらに予め、磁性層を設
ける側に接着層を設けていてもよい。These films are used to create magnetic recording media, but if necessary, films whose surface adhesion has been improved by corona treatment etc. may also be used, and an adhesive layer may be provided in advance on the side where the magnetic layer is to be provided. You can leave it there.
ところで、上記フィルム素材として用いられる主として
シンジオタクチック構造を有するスチレン系重合体とは
、立体化学構造が主としてシンジオタクチック構造、即
ち炭素−炭素結合から形成される主鎖に対して側鎖であ
るフェニル基や置換フェニル基が交互に反対方向に位置
する立体構造を有するものであり、そのタフティシティ
−は同位体炭素による核磁気共鳴法(”C−NMR法)
により定量される。13C−NMR法により測定される
タフティシティ−は、連続する複数個の構成単位の存在
割合、例えば2個の場合はダイアツド。By the way, the styrenic polymer mainly having a syndiotactic structure used as the above-mentioned film material has a stereochemical structure mainly having a syndiotactic structure, that is, a side chain with respect to the main chain formed from carbon-carbon bonds. It has a three-dimensional structure in which phenyl groups and substituted phenyl groups are alternately positioned in opposite directions, and its toughness can be determined by nuclear magnetic resonance (C-NMR) method using carbon isotopes.
It is quantified by Toughness measured by 13C-NMR is the proportion of a plurality of consecutive structural units, for example, in the case of two units, it is a diad.
3個の場合はトリアット、5個の場合はペンタッドによ
って示すことができるが、本発明に言う主としてシンジ
オタクチック構造を有するスチレン系重合体とは、通常
はうセミダイアツドで75%以上、好ましくは85%以
上、若しくはラセミペンタッドで30%以上、好ましく
は50%以上のシンジオタクテイシテイ−を有するポリ
スチレン。In the case of 3 atoms, it can be expressed as triat, and in the case of 5 atoms, it can be expressed as pentad, but the styrenic polymer having a mainly syndiotactic structure as used in the present invention is usually 75% or more, preferably 85 % or more, or 30% or more in terms of racemic pentads, preferably 50% or more.
ポリ(アルキルスチレン)、ポリ(ハロゲン化スチレン
)、ポリ(アルコキシスチレン)、ポリ(ビニル安息香
酸エステル)、これらの水素化重合体およびこれらの混
合物、あるいはこれらの構造単位を含む共重合体を指称
する。なお、ここでポリ(アルキルスチレン)としては
、ポリ(メチルスチレン)、ポリ(エチルスチレン)、
ポリ(プロピルスチレン)、ポリ(ブチルスチレン)、
ポリ(フェニルスチレン)、ポリ(ビニルナフタレン)
、ポリ(ビニルスチレン)、ポリ(アセナフチレン)な
どがあり、ポリ(ハロゲン化スチレン)としては、ポリ
(クロロスチレン)、ポリ(ブロモスチレン)、ポリ(
フルオロスチレン)などがある。また、ポリ(アルコキ
シスチレンyとしては、ポリ(メトキシスチレン)、ポ
リ(エトキシスチレン)などがある。これらのうち特に
好ましいスチレン系重合体としては、ポリスチレン、ポ
リ(p−メチルスチレン)、ポリ(m−メチルスチレン
)、ポリ(p−ターシャリ−ブチルスチレン)ポリ(p
−クロロスチレン)、ポリ(m−クロロスチレン)、ポ
リ(p−フルオロスチレン)、またスチレンとp−メチ
ルスチレンとの共重合体をあげることができる(特開昭
62−187708号公報)。Refers to poly(alkyl styrene), poly(halogenated styrene), poly(alkoxystyrene), poly(vinyl benzoate), hydrogenated polymers thereof, mixtures thereof, or copolymers containing these structural units. do. Note that poly(alkylstyrene) here includes poly(methylstyrene), poly(ethylstyrene),
Poly(propylstyrene), poly(butylstyrene),
Poly(phenylstyrene), poly(vinylnaphthalene)
, poly(vinylstyrene), poly(acenaphthylene), etc. Poly(halogenated styrene) includes poly(chlorostyrene), poly(bromostyrene), poly(
fluorostyrene), etc. In addition, examples of poly(alkoxystyrene y) include poly(methoxystyrene) and poly(ethoxystyrene). Among these, particularly preferred styrenic polymers include polystyrene, poly(p-methylstyrene), and poly(m -methylstyrene), poly(p-tert-butylstyrene) poly(p-
-chlorostyrene), poly(m-chlorostyrene), poly(p-fluorostyrene), and copolymers of styrene and p-methylstyrene (JP-A-62-187708).
更に、スチレン系共重合体におけるコモノマーとしては
、上述の如きスチレン系重合体のモノマーのほか、エチ
レン、プロピレン、ブテン、ヘキセン、オクテン等のオ
レフィンモノマー、ブタジェン、イソプレン等のジエン
モノマー、環状ジエンモノマーやメタクリル酸メチル、
無水マレイン酸、アクリロニトリル等の極性ビニルモノ
マー等をあげることができる。Furthermore, as comonomers in the styrene copolymer, in addition to the above-mentioned styrene polymer monomers, olefin monomers such as ethylene, propylene, butene, hexene, and octene, diene monomers such as butadiene and isoprene, cyclic diene monomers, etc. methyl methacrylate,
Examples include polar vinyl monomers such as maleic anhydride and acrylonitrile.
またこのスチレン系重合体は、分子量について特に制限
はないが、重量平均分子量が10.000以上3,00
0,000以下のものが好ましく、とりわけ50.00
0以上1,500.000以下のものが最適である。こ
こで重量平均分子量が10.000未満であると、延伸
が充分にできない。さらに、分子量分布についてもその
広狭は制約がなく、様々なものを充当することが可能で
あるが、重量平均分子量(Mw)/数平均分子量(Mn
)が1.5以上8以下が好ましい。なお、この主として
シンジオタクチック構造を有するスチレン系重合体は、
従来のアククチツク構造のスチレン系重合体に比べて耐
熱性が格段に優れている。In addition, this styrene polymer has a weight average molecular weight of 10.000 or more and 3,000 or more, although there is no particular restriction on the molecular weight.
0,000 or less is preferred, especially 50.00
The optimum value is 0 or more and 1,500.000 or less. If the weight average molecular weight is less than 10,000, sufficient stretching cannot be achieved. Furthermore, there are no restrictions on the width or narrowness of the molecular weight distribution, and various values can be used, but weight average molecular weight (Mw)/number average molecular weight (Mn
) is preferably 1.5 or more and 8 or less. In addition, this styrenic polymer mainly having a syndiotactic structure is
It has much better heat resistance than conventional styrene-based polymers with an active structure.
また、前述の延伸フィルム(特に超平滑面を有するフィ
ルム)を構成する主としてシンジオタクチック構造を有
するスチレン系重合体は、上述した如きものであればよ
いが、特に残留アルミニウム分が3000ppmg以下
、残留チタン分が10ppm以下及び残留スチレン系単
量体が7000ppm以下のものが好ましい。とりわけ
、残留アル稟ニウム分が11000pp以下、残留チタ
ン分が7 ppm以下及び残留スチレン系単量体が50
00ppm以下のものが最適である。The styrenic polymer mainly having a syndiotactic structure constituting the above-mentioned stretched film (particularly the film having an ultra-smooth surface) may be of the type described above, but in particular, if the residual aluminum content is 3000 ppmg or less, the styrene polymer mainly has a syndiotactic structure. Preferably, the titanium content is 10 ppm or less and the residual styrene monomer content is 7000 ppm or less. In particular, the residual aluminum content is 11,000 ppm or less, the residual titanium content is 7 ppm or less, and the residual styrene monomer content is 50 ppm or less.
00 ppm or less is optimal.
このような高純度のスチレン系重合体を製造するには、
様々な手法があるが、例えば次の如くである。まず、残
留アルミニウム分及び残留チタン分を上記の範囲内に抑
えるためには、■高活性触媒を用いてスチレン系重合体
を製造する方法(特願昭63−7466号明細書参照)
あるいは■脱灰、洗浄による方法、即ち、特開昭62−
187708号公報等に記載の通常のIVA族の有機金
属化合物とメチルアルミツキサン等のアルキルアルミノ
キサンを触媒成分として、スチレン系単量体を重合させ
た後、得られたシンジオタクチック構造のスチレン系重
合体を、酸、アルカリを適当な溶媒に溶解させた溶液に
より脱灰し、適当な溶媒で洗浄する方法である。To produce such high-purity styrenic polymers,
There are various methods, such as the following. First, in order to suppress the residual aluminum content and the residual titanium content within the above range, there is a method for producing a styrenic polymer using a highly active catalyst (see the specification of Japanese Patent Application No. 7466/1986).
Or ■ method by deashing and washing, that is, JP-A-62-
A styrenic monomer with a syndiotactic structure obtained by polymerizing a styrenic monomer using an ordinary IVA group organometallic compound described in Publication No. 187708 and an alkylaluminoxane such as methylaluminoxane as a catalyst component. In this method, the polymer is deashed using a solution of an acid or alkali dissolved in an appropriate solvent, and then washed with an appropriate solvent.
このようにして■あるいは■の方法により、残留アルミ
ニウム分及び残留チタン分の少ないシンジオタクチック
構造のスチレン系重合体が得られるが、さらに、これを
下記■あるいは■の方法で処理すれば、残留スチレン系
単量体が7000ppm以下のものとなる。In this way, a styrenic polymer with a syndiotactic structure with a low residual aluminum content and a low residual titanium content can be obtained by the method (1) or (2). The styrene monomer content is 7000 ppm or less.
■上記スチレン系重合体を減圧乾燥する方法ここで減圧
乾燥するにあたっては、乾燥温度を該重合体のガラス転
移温度以上とすると効率がよい。(2) Method of drying the styrenic polymer under reduced pressure When drying under reduced pressure, it is efficient to set the drying temperature to the glass transition temperature or higher of the polymer.
■上記スチレン系重合体を押出機にまり脱気する方法
上記スチレン系重合体あるいは■の方法で減圧乾燥した
スチレン系重合体を、押出機により脱気し、同時に成形
用材料(ベレット)とする。ここで押出機はベント付き
が好ましく、−軸、二軸いずれの押出機を用いてもよい
。■ Method of degassing the above styrenic polymer in an extruder The above styrenic polymer or the styrenic polymer dried under reduced pressure using method (2) is degassed in an extruder and at the same time is made into a molding material (bullet). . Here, the extruder is preferably equipped with a vent, and either a -shaft or twin-screw extruder may be used.
このような処理を経て残留アルミニウム分、残留チタン
分及び残留スチレン系単量体の少ない高純度のシンジオ
タクチック構造のスチレン系重合体が得られる。Through such treatment, a highly purified styrenic polymer having a syndiotactic structure with a small residual aluminum content, residual titanium content, and residual styrene monomer can be obtained.
一方、易滑な粗面を有する延伸フィルムの構成素材は、
主としてシンジオタクチック構造を有するスチレン系重
合体に無機微粒子を含有させた組成物、特に上記スチレ
ン系重合体に平均粒径0.0〜3μmの無機微粒子を0
.001〜1重量%含有させた組成物である。この組成
物は、スチレン系重合体で但し、必ずしも上記の如き高
純度であることを要せず、特開昭62−187708号
公報等に記載の方法等によればよい。)に、無機微粒子
を配合するあるいは重合中に析出させることによって調
製される。ここで、無機微粒子とは、IA族、 II
A族、IVA族、VIA族、■A族、■族。On the other hand, the constituent material of the stretched film has a smooth rough surface.
A composition in which inorganic fine particles are mainly contained in a styrenic polymer having a syndiotactic structure, in particular, inorganic fine particles with an average particle size of 0.0 to 3 μm are added to the above styrenic polymer.
.. This is a composition containing 001 to 1% by weight. Although this composition is a styrene polymer, it does not necessarily have to be as highly purified as mentioned above, and may be prepared by the method described in JP-A-62-187708 and the like. ) with inorganic fine particles or by precipitating them during polymerization. Here, the inorganic fine particles are group IA, II
Group A, Group IVA, Group VIA, Group ■A, Group ■.
IB族、IIB族、IIrB族、IVB族元素の酸化物
。Oxides of Group IB, Group IIB, Group IIrB, Group IVB elements.
水酸化物、硫化物、窒素化物、ハロゲン化物8炭酸塩、
酢酸塩、燐酸塩、亜燐酸塩1有機カルボン酸塩、珪酸塩
、チタン酸塩、硼酸塩及びそれらの含水化合物、それら
を中心とする複合化合物、天然鉱物粒子を示す。hydroxide, sulfide, nitride, halide 8 carbonate,
Acetate, phosphate, phosphite 1 Shows organic carboxylates, silicates, titanates, borates and their hydrated compounds, complex compounds centered on them, and natural mineral particles.
具体的には、弗化リチウム、硼砂(硼酸ナトリウム含水
塩)等のIA族元素化合物、炭酸マグネシウム、燐酸マ
グネシウム、酸化マグネシウム(マグネシア)、塩化マ
グネシウム、酢酸マグネシウム、弗化マグネシウム、チ
タン酸マグネシウム、珪酸マグネシウム、珪酸マグネシ
ウム含水塩(タルク)、炭酸カルシウム、燐酸カルシウ
ム。Specifically, lithium fluoride, Group IA element compounds such as borax (sodium borate hydrate), magnesium carbonate, magnesium phosphate, magnesium oxide (magnesia), magnesium chloride, magnesium acetate, magnesium fluoride, magnesium titanate, and silicic acid. Magnesium, magnesium silicate hydrate (talc), calcium carbonate, calcium phosphate.
亜燐酸カルシウム、硫酸カルシウム(石膏)、酢酸カル
シウム、テレフタル酸カルシウム、水酸化カルシウム、
珪酸カルシウム、弗化カルシウム。Calcium phosphite, calcium sulfate (gypsum), calcium acetate, calcium terephthalate, calcium hydroxide,
Calcium silicate, calcium fluoride.
チタン酸カルシウム、チタン酸ストロンチウム。Calcium titanate, strontium titanate.
炭酸バリウム、#!J酸バリウム、硫酸バリウム、亜燐
酸バリウム等のIIA族元素化合物、二酸化チタン(チ
タニア)、−酸化チタン、窒化チタン、二酸化ジルコニ
ウム(ジルコニア)、−酸化ジルコニウム等のIVA族
元素化合物、二酸化モリブデン。Barium carbonate, #! IIA group element compounds such as barium J acid, barium sulfate, barium phosphite, IVA group element compounds such as titanium dioxide (titania), -titanium oxide, titanium nitride, zirconium dioxide (zirconia), -zirconium oxide, molybdenum dioxide.
三酸化モリブデン、硫化モリブデン等のVIA族元素化
合物、塩化マンガン、酢酸マンガン等の■A族元素化合
物、塩化コバルト、酢酸コバルト等の■族元素化合物、
沃化第一銅等のIB族元素化合物、酸化亜鉛、酢酸亜鉛
等のnB族元素化合物、酸化アルごニウム(アルミナ)
、水酸化アルミニウム、弗化アルミニウム、アルミノシ
リケート(珪酸アルミナ、カオリン、カオリナイト)等
の11rB族元素化合物、酸化珪素(シリカ、シリカゲ
ル)9石墨、カーボン、グラファイト、ガラス等のIV
B族元素化合物、カーナル石、カイナイト。Group VIA element compounds such as molybdenum trioxide and molybdenum sulfide; ■ Group A element compounds such as manganese chloride and manganese acetate; Group ■ element compounds such as cobalt chloride and cobalt acetate;
IB group element compounds such as cuprous iodide, nB group element compounds such as zinc oxide and zinc acetate, argonium oxide (alumina)
, aluminum hydroxide, aluminum fluoride, 11rB group element compounds such as aluminosilicate (alumina silicate, kaolin, kaolinite), silicon oxide (silica, silica gel) 9 graphite, carbon, graphite, glass, etc.
Group B element compounds, carnalite, kainite.
雲母(マイカ、キンウンモ)、バイロース鉱等の天然を
物の粒子が挙げられる。Examples include natural particles such as mica and bilosite.
本発明で用いる無機微粒子の平均粒径は、特に制限はな
いが、好ましくは0.01〜3μm、より好ましくは0
.01〜1μmで、組成物中の含量は0.001〜1重
量%、好ましくは0.001〜0.6重量%である。こ
こで平均粒径が0.01μmより小さいと粒子同士の二
次凝集のため分散が困難となる場合があり、また平均粒
径が3μmより大きいと平滑性が低下する。また、組成
物中の無機微粒子の含量が0.001重量%より少ない
とすべり性の改良の効果が不充分となり、含量が1重量
%より多いと薄物での延伸が困難となる場合がある。The average particle size of the inorganic fine particles used in the present invention is not particularly limited, but is preferably 0.01 to 3 μm, more preferably 0.01 to 3 μm, and more preferably 0.01 to 3 μm.
.. 01-1 μm, the content in the composition is 0.001-1% by weight, preferably 0.001-0.6% by weight. If the average particle size is smaller than 0.01 μm, dispersion may become difficult due to secondary aggregation of particles, and if the average particle size is larger than 3 μm, smoothness will decrease. Furthermore, if the content of inorganic fine particles in the composition is less than 0.001% by weight, the effect of improving slipperiness will be insufficient, and if the content is more than 1% by weight, it may be difficult to stretch thin products.
また、前述の無機微粒子は本発明の目的を達成する上で
、効果的な成分であるが、本発明の目的を阻害しない限
り、他の種類あるいは他の粒径の微粒子、無機充填材等
を含むものであってもよい。In addition, although the above-mentioned inorganic fine particles are an effective component in achieving the object of the present invention, other types or particle sizes of fine particles, inorganic fillers, etc. may be used as long as they do not impede the object of the present invention. It may include.
本発明で用いる無機微粒子は、最終的な成形品(フィル
ム)に含有されるが、含有させる方法に限定はない。例
えば、スチレン系単量体の重合中の任意の過程で添加あ
るいは析出させる方法、溶融押出する任意の過程で添加
する方法が挙げられる。The inorganic fine particles used in the present invention are contained in the final molded product (film), but there is no limitation on the method of containing them. Examples include a method of adding or precipitating the styrenic monomer at any step during polymerization, and a method of adding at any step of melt extrusion.
この中で特に本発明においては、重合過程の任意の段階
で上記無機微粒子をスラリー状として添加する方法が、
粒子の二次凝集を防げるうえで好ましい。Among these, particularly in the present invention, the method of adding the above-mentioned inorganic fine particles in the form of a slurry at any stage of the polymerization process is
This is preferable since secondary aggregation of particles can be prevented.
またこれらの微粒子を効果的に分散させるため、分散剤
、界面活性剤等を用いてもよい。Further, in order to effectively disperse these fine particles, a dispersant, a surfactant, etc. may be used.
本発明の基材フィルムを構成する延伸フィルムに使用さ
れる素材には、さらに成形性、力学物性。The material used for the stretched film constituting the base film of the present invention further has moldability and mechanical properties.
表面性等を考慮して、本発明の目的を阻害しない範囲で
、酸化防止剤、帯電防止剤、難燃剤、無機充填材、さら
に他の樹脂などを適宜配合することもできる。In consideration of surface properties, etc., antioxidants, antistatic agents, flame retardants, inorganic fillers, and other resins may be appropriately blended within a range that does not impede the object of the present invention.
ここで他の樹脂としては、各種のものがあるが、例えば
、アククチツク構造のスチレン系重合体。There are various types of other resins, such as styrene polymers with an active structure.
アイソタクチック構造のスチレン系重合体、ポリフェニ
レンエーテル等は、前述のシンジオタクチック構造のス
チレン系重合体と相溶になりやすく、延伸用予備成形体
を作成するときの結晶化の制御に有効で、その後の延伸
性が向上し、延伸条件の制御が容易で、且つ力学物性に
優れたフィルムを得ることができる。このうち、アクク
チツク構造および/またはアイソタクチック構造のスチ
レン系重合体を含有させる場合、シンジオタクチック構
造のスチレン系重合体と同様のモノマーからなるものが
好ましい。また、これら相溶性樹脂成分の含有割合は7
0〜1重量%、特に好ましくは50〜2重量%とすれば
よい。ここで相溶性樹脂成分の含有割合が70重量%を
超えると、シンジオタクチック構造のスチレン系重合体
の長所である耐熱性等が損なわれるため好ましくない。Isotactic structure styrenic polymers, polyphenylene ethers, etc. are easily compatible with the syndiotactic structure styrenic polymers mentioned above, and are effective in controlling crystallization when creating preforms for stretching. , it is possible to obtain a film with improved subsequent stretchability, easy control of stretching conditions, and excellent mechanical properties. Among these, when a styrene polymer having an actic structure and/or an isotactic structure is contained, it is preferable to use a monomer similar to the styrene polymer having a syndiotactic structure. In addition, the content ratio of these compatible resin components is 7
The amount may be 0 to 1% by weight, particularly preferably 50 to 2% by weight. If the content of the compatible resin component exceeds 70% by weight, it is not preferable because the advantages of the syndiotactic styrene polymer, such as heat resistance, will be impaired.
また、非相溶性樹脂としては、例えば、ポリエチレン。Further, examples of the incompatible resin include polyethylene.
ポリプロピレン、ポリブテン、ポリペンテン等のポリオ
レフィン、ポリエチレンテレフタレート。Polyolefins such as polypropylene, polybutene, polypentene, and polyethylene terephthalate.
ポリブチレンテレフタレート、ポリエチレンナフタレー
ト等のポリエステル、ナイロン−6やナイロン6.6等
のボリア旦ド、ポリフェニレンスルフィド等のポリチオ
エーテル、ポリカーボネート。Polyesters such as polybutylene terephthalate and polyethylene naphthalate, boria compounds such as nylon-6 and nylon 6.6, polythioethers such as polyphenylene sulfide, and polycarbonates.
ボリアリレート、ポリスルホン、ポリエーテルエーテル
ケトン、ポリエーテルスルホン、ポリイミド、テフロン
等のハロゲン化ビニル系重合体、ポリメタクリル酸メチ
ル等のアクリル系重合体、ポリビニルアルコール等、上
記相溶性の樹脂以外はすべて相当し、さらに、上記相溶
性の樹脂を含む架橋樹脂が挙げられる。これらの樹脂は
、本発明のシンジオタクチック構造のスチレン系重合体
と非相溶であるため、少量含有する場合、シンジオタク
チック構造のスチレン系重合体中に島のように分散させ
ることができ、延伸後に程良い光沢を与えたり、表面の
すべり性を改良するのに有効である。これら非相溶性樹
脂成分の含有割合は、光沢を目的とする場合は50〜2
重量%、表面性の制御を目的とする場合、0.001〜
5重量%が好ましい。また、製品として使用する温度が
高い場合は、比較的耐熱性のある非相溶性樹脂を用いる
ことが好ましい。Polyarylate, polysulfone, polyether ether ketone, polyether sulfone, polyimide, halogenated vinyl polymers such as Teflon, acrylic polymers such as polymethyl methacrylate, polyvinyl alcohol, etc., all other than the compatible resins listed above are equivalent. Furthermore, crosslinked resins containing the above-mentioned compatible resins can be mentioned. These resins are incompatible with the styrenic polymer having a syndiotactic structure of the present invention, so if they are contained in small amounts, they cannot be dispersed like islands in the styrenic polymer having a syndiotactic structure. It is effective in imparting a suitable gloss after stretching and improving surface slipperiness. The content ratio of these incompatible resin components is 50 to 2 when the purpose is gloss.
Weight%, if the purpose is to control surface properties, 0.001~
5% by weight is preferred. Furthermore, when the temperature at which the product is used is high, it is preferable to use an incompatible resin that is relatively heat resistant.
本発明の磁気記録媒体の基材フィルムを成形するには、
前述した如き方法によればよいが、この際に行う加熱溶
融から熱固定までの操作を具体的に説明すれば、次の通
りである。To form the base film of the magnetic recording medium of the present invention,
The method described above may be used, but the operations from heating and melting to heat setting will be specifically explained as follows.
まず、上述の如き成形素材を通常は押出成形(あるいは
共押出成形)して、延伸用予備成形体(フィルム、シー
トまたはチューブ)とする。この成形にあっては、上記
成形素材の加熱溶融したものを押出成形機にて所定形状
に成形するのが一般的であるが、成形素材を加熱溶融さ
せずに、軟化した状態で成形してもよい。ここで用いる
押出成形機は、−軸押出成形機、二軸押出成形機のいず
れでもよく、またベント付き、ベント無しのいずれでも
よいが、−軸の直列タンデム型が好ましい。なお、押出
機には適当なメツシュを使用すれば、夾雑物や異物を除
去することができる。特に平滑面を有する延伸フィルム
を作成する場合にはメツシュは、100メツシュ以上が
好ましく、とりわけ400メツシュ以上が最適である。First, the above-mentioned molding material is usually extruded (or coextruded) to form a preform for stretching (film, sheet, or tube). In this molding, it is common to heat and melt the above-mentioned molding material and mold it into a predetermined shape using an extrusion molding machine, but the molding material is molded in a softened state without being heated and melted. Good too. The extrusion molding machine used here may be either a -shaft extruder or a twin-screw extruder, and may be either with a vent or without a vent, but a tandem type with a -shaft is preferred. Note that impurities and foreign matter can be removed by using a suitable mesh in the extruder. In particular, when producing a stretched film with a smooth surface, the mesh is preferably 100 meshes or more, most preferably 400 meshes or more.
ここでこれらのメツシュを用いる際には、メツシュその
ものの耐圧9強度を考慮して、上記以下の番手を前後に
入れても良い。またメツシュの形状は、平板状1円筒状
等適当に選定して使用することができる。When using these meshes here, considering the pressure resistance 9 strength of the mesh itself, the above-mentioned or lower counts may be added to the front and back. Moreover, the shape of the mesh can be appropriately selected and used, such as a flat plate or a cylindrical shape.
またここで押出条件は、特に制限はなく、様々な状況に
応じて適宜選定すればよいが、好ましくは温度を成形素
材の融点〜分解温度より50℃高い温度の範囲で選定し
、剪断応力を5X106dyne/cn以下とする。用
いるダイはT−ダイ、円環ダイ等をあげることができる
。The extrusion conditions here are not particularly limited and may be appropriately selected depending on various situations, but preferably the temperature is selected within the range of 50°C higher than the melting point of the molding material to the decomposition temperature, and the shear stress is reduced. 5×106 dyne/cn or less. The die used may be a T-die, an annular die, or the like.
上記押出成形後、得られた延伸用予備成形体を冷却固化
する。この際の冷媒は、気体、液体、金属ロール等各種
のものを使用することが!きる。After the above extrusion molding, the obtained preform for stretching is cooled and solidified. Various types of refrigerant can be used in this case, such as gas, liquid, and metal rolls! Wear.
金属ロール等を用いる場合、エアナイフ、エアチャンバ
ー タッチロール、静電印荷等の方法によると厚みムラ
や波うち防止に効果的である。When using a metal roll or the like, methods such as an air knife, air chamber touch roll, and electrostatic printing are effective in preventing thickness unevenness and waviness.
冷却固化の温度は、通常はO″C〜延伸用予備成形体の
ガラス転移温度より30’C高い温度の範囲、好ましく
は20″C〜ガラス転移温度の範囲である。The cooling solidification temperature is usually in the range of 0''C to 30'C higher than the glass transition temperature of the preform for drawing, preferably in the range of 20''C to the glass transition temperature.
また冷却速度は200〜3°C/秒の範囲で適宜選択す
る。Further, the cooling rate is appropriately selected within the range of 200 to 3°C/sec.
次に、この冷却、固化した予備成形体を一軸あるいは二
輪に延伸する。二軸延伸の場合は縦方向及び横方向に同
時に延伸してもよいが、任意の順序で逐次延伸してもよ
い。また延伸は一段で行ってもよく、多段で行ってもよ
い。Next, this cooled and solidified preform is stretched uniaxially or biaxially. In the case of biaxial stretching, it may be stretched simultaneously in the longitudinal and transverse directions, or it may be stretched sequentially in any order. Further, the stretching may be performed in one stage or in multiple stages.
ここで延伸方法としては、テンターによる方法。The stretching method used here is a method using a tenter.
ロール間で延伸する方法、気体圧力を利用してバブリン
グによる方法、圧延による方法など様々であり、これら
を適当に選定あるいは組み合わせて適用すればよい。延
伸温度は、一般には予備成形体のガラス転移温度と融点
の間で設定すればよい。There are various methods such as stretching between rolls, bubbling using gas pressure, and rolling, and these may be appropriately selected or combined. The stretching temperature may generally be set between the glass transition temperature and melting point of the preform.
また延伸速度は、通常は1×10〜lXl0’%/分、
好ましくはI X 103〜1×lOS%/分である。In addition, the stretching speed is usually 1×10 to 1×10’%/min,
Preferably I x 103 to 1 x lOS%/min.
上述の如き条件で延伸して得られた延伸フィルムに、さ
らに高温時の寸法安定性、耐熱性。In addition to the stretched film obtained by stretching under the conditions described above, it also has dimensional stability and heat resistance at high temperatures.
フィルム面内の強度バランスが要求される場合などには
、さらに熱固定を行うことが好ましい。熱固定は、通常
行われている方法で行うことができるが、この延伸フィ
ルムを緊張状態、弛緩状態あるいは制限収縮状態の下で
、該フィルムのガラス転移温度〜融点、好ましくは融点
より100°C低い温度〜融点直前の温度範囲にて、0
.5〜120秒間保持することによって行えばよい。な
お、この熱固定は、上記範囲内で条件を変えて二回以上
行うことも可能である。また、この熱固定はアルゴンガ
ス、窒素ガスなどの不活性ガス雰囲気下で行っても良い
。In cases where in-plane strength balance of the film is required, it is preferable to further heat set the film. Heat setting can be carried out by a commonly used method, and the stretched film is heated under tension, relaxation, or limited shrinkage at a temperature between the glass transition temperature and melting point of the film, preferably 100°C below the melting point. In the temperature range from low temperature to just before the melting point, 0
.. This may be done by holding for 5 to 120 seconds. Note that this heat fixing can be performed two or more times under different conditions within the above range. Moreover, this heat fixation may be performed under an inert gas atmosphere such as argon gas or nitrogen gas.
このようにして得られる本発明の基材フィルムは、線膨
張係数1表面粗さRa及び静摩擦係数μsが前述した範
囲のものとなる。なお、この基材フィルムは、テープ状
、ディスク状、カード状等様々な形態とすることができ
る。The base film of the present invention obtained in this manner has a linear expansion coefficient 1 surface roughness Ra and a static friction coefficient μs within the ranges described above. In addition, this base film can be made into various forms, such as a tape shape, a disk shape, and a card shape.
本発明の磁気記録媒体は、上記基材フィルムに少なくと
も一層の磁性層を形成してなるが、アンダーコート層、
バックコート層あるいはトップコート層を形成すること
もできる。これらの各層は、基材フィルムを中心に両面
あるいは片面の全部あるいは一部に形成される。The magnetic recording medium of the present invention has at least one magnetic layer formed on the base film, and includes an undercoat layer,
A back coat layer or a top coat layer can also be formed. Each of these layers is formed on both sides or all or part of one side of the base film.
また、磁性層の素材となる磁性体は、各種のものがあり
、例えばGo、Co−0、Co−Cr。Furthermore, there are various types of magnetic materials that can be used as materials for the magnetic layer, such as Go, Co-0, and Co-Cr.
Co−V、Co−Ni、Co P、Co−rFezO
x。Co-V, Co-Ni, Co-P, Co-rFezO
x.
Co−N1−P、Co−N1−N、Co−N1−W。Co-N1-P, Co-N1-N, Co-N1-W.
Co−Ni−Pt 、CoN1(Cr)/Cr 、Fe
。Co-Ni-Pt, CoN1(Cr)/Cr, Fe
.
Fe−0,Fe−Ag+ rFezo8.Fe−Co
。Fe-0, Fe-Ag+ rFezo8. Fe-Co
.
Ni、Cragなどを列挙することができる。Ni, Crag, etc. can be listed.
この磁性体を用いて磁性層をベースフィルムに形成する
には、塗布、蒸着、スパッタリング、メツキ等の各種の
方法によればよく、その操作条件等は常法にしたがって
、適宜選定すればよい。To form a magnetic layer on a base film using this magnetic material, various methods such as coating, vapor deposition, sputtering, and plating may be used, and the operating conditions may be appropriately selected according to conventional methods.
なお、磁性層の厚みは特に制限はないが、一般には0.
01〜10μmであり、特に塗布の場合は0.5〜10
μm、蒸着やスパッタリングの場合は0.01〜1μm
1メツキの場合は0.1〜5μmである。The thickness of the magnetic layer is not particularly limited, but is generally 0.
01 to 10 μm, especially in the case of coating 0.5 to 10 μm
μm, 0.01 to 1 μm for vapor deposition and sputtering
In the case of 1 plating, it is 0.1 to 5 μm.
なお、塗布にあたって使用するバインダー用の樹脂とし
ては、例えば塩化ビニル−酢酸ビニル共重合体、塩化ビ
ニル−酢酸ビニル部分ケン化共重合体、塩化ビニル−塩
化ビニリデン共重合体、塩化ビニル−アクリロニトリル
、ビニルブチラール。Examples of binder resins used for coating include vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinyl acetate partially saponified copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile, and vinyl chloride-vinyl acetate copolymer. Butyral.
ビニルホルマール等のビニル共重合系、ニトロセルロー
ス、セルロースアセトブチレート等の繊維素系、飽和ポ
リエステル、ポリウレタンボリアξド、エポキシ等の縮
重合系、ブタジェン・アクリロニトリル共重合体等の合
成ゴム系、ポリホスファゼン等の無機高分子系があげら
れ、イソシアネート化合物等の架橋剤を用いてもよい。Vinyl copolymer systems such as vinyl formal, cellulose systems such as nitrocellulose and cellulose acetobutyrate, condensation polymer systems such as saturated polyester, polyurethane boria ξ-d, and epoxy, synthetic rubber systems such as butadiene-acrylonitrile copolymers, and Examples include inorganic polymers such as phosphazene, and crosslinking agents such as isocyanate compounds may also be used.
このようにして得られた本発明の磁気記録媒体は、磁気
ヘッド摩耗防止等のため表面を研磨しても良い。The surface of the thus obtained magnetic recording medium of the present invention may be polished to prevent wear of the magnetic head.
次に本発明を実施例に基いてさらに詳しく説明する。 Next, the present invention will be explained in more detail based on examples.
参考例1
(1)無機微粒子を含むスチレン系重合体成形用材料(
重合棒組放物)の作成
アルゴン置換した内容積500−のガラス製容器に、硫
酸銅5水塩(CuSOn’ 5H20)17.8g(7
1旦リモル)、トルエン200rd及びトリメチルアル
ミニウム24d(2501リモル)を入れ、40°Cで
8時間反応させた。その後、固体部分を除去して得られ
た溶液から、更に、トルエンを室温下で減圧留去して接
触生成物6.7gを得た。このものの凝固点降下法によ
って測定した分子量は610であった。また、’H−N
MR測定による前述の高磁場成分(即ち、−〇、1〜−
0.5ppm)は43%であった。Reference Example 1 (1) Styrenic polymer molding material containing inorganic fine particles (
17.8 g (7.5 g) of copper sulfate pentahydrate (CuSOn' 5H20) was placed in a glass container with an internal volume of 500 mm and replaced with argon.
1 mol), 200 rd toluene, and 24 d (2501 mol) of trimethylaluminum were added, and the mixture was reacted at 40°C for 8 hours. Thereafter, from the solution obtained by removing the solid portion, toluene was further distilled off under reduced pressure at room temperature to obtain 6.7 g of a contact product. The molecular weight of this product was 610 as measured by freezing point depression method. Also, 'H-N
The above-mentioned high magnetic field component (i.e., −〇, 1 to −
0.5 ppm) was 43%.
一方、精製スチレンモノマー100部に乾式法シリカ(
デグツサ■製アニロジルTT−600(1次粒子の直径
40mμのもの))を0.4部添加し、T、 Kホモミ
キサーL型(特殊機化工業製)を用いて、円筒容器の中
で混合攪拌してスチレン混合物を得た。なおこの際、ス
テアリン酸カルシウムを0.05重量部加えた。On the other hand, 100 parts of purified styrene monomer was added with dry process silica (
Add 0.4 part of Anilosyl TT-600 (primary particle diameter: 40 mμ) manufactured by Degutsusa ■ and mix in a cylindrical container using a T, K homomixer L type (manufactured by Tokushu Kika Kogyo). Stirring resulted in a styrene mixture. At this time, 0.05 parts by weight of calcium stearate was added.
内容積2j2の反応容器に、上述の如く調製したスチレ
ン混合物11、上述の如く得られた接触生成物をアルミ
ニウム原子として5ミリモル、トリイソブチルアルミニ
ウムを5ミリモル、ペンタメチルシクロペンタジェニル
チタントリメトキシド0.025ミリモルを用いて90
℃で5時間重合反応を行った。反応終了後、生成物を水
酸化ナトリウムのメタノール溶液で触媒成分を分解後、
メタノールで繰返し洗浄後、乾燥して重合体308gを
得た。In a reaction vessel with an internal volume of 2j2, the styrene mixture 11 prepared as described above, 5 mmol of the contact product obtained as described above as aluminum atoms, 5 mmol of triisobutylaluminum, and pentamethylcyclopentadienyl titanium trimethoxide. 90 using 0.025 mmol
The polymerization reaction was carried out at ℃ for 5 hours. After the reaction is complete, the product is decomposed with a methanol solution of sodium hydroxide to decompose the catalyst component.
After repeated washing with methanol, it was dried to obtain 308 g of a polymer.
この重合体の重量平均分子量を、1,2.4−トリクロ
ロベンゼンを溶媒として、135°Cでゲルパーミニ−
ジョンクロマトグラフィーにて測定したところ389,
000であり、また重量平均。The weight average molecular weight of this polymer was determined by gel perminication at 135°C using 1,2.4-trichlorobenzene as a solvent.
As measured by John chromatography, it was 389,
000 and weighted average.
分子量/数平均分子量は2.64であった。また、融点
及びI3C−NMR測定により、この重合体はシンジオ
タクチック構造のポリスチレンであることを確認した。The molecular weight/number average molecular weight was 2.64. Furthermore, it was confirmed by melting point and I3C-NMR measurements that this polymer was polystyrene with a syndiotactic structure.
この重合体を130 ’Cで1.2.4−)リクロロベ
ンゼンに溶解し、濾別し、重合体中のシリカ含量を調べ
たところ0.4wt%であった。また、この溶液をスラ
イドガラス上に滴下し、顕微鏡で観察し、シリカの平均
粒径を調べたところ0.08μmであった。This polymer was dissolved in 1.2.4-)lichlorobenzene at 130'C, filtered, and the silica content in the polymer was determined to be 0.4 wt%. Further, this solution was dropped onto a glass slide and observed under a microscope to find out the average particle size of the silica, which was 0.08 μm.
さらに、このスチレン系重合体を150°Cで2時間、
減圧乾燥した。得られたパウダーを、ベント付き二軸押
出機の先端にキャピラリーを持つ装置で300℃にて押
出し、冷却後、カットしペレットとした。このペレット
を熱風により攪拌しながら結晶化させた。このペレット
は、結晶化度35%でスチレンモノマーを700ppm
含んでいた。Furthermore, this styrene polymer was heated at 150°C for 2 hours.
Dry under reduced pressure. The obtained powder was extruded at 300° C. using a vented twin-screw extruder with a capillary at the tip, cooled, and then cut into pellets. The pellets were crystallized while stirring with hot air. The pellets contain 700 ppm of styrene monomer with a crystallinity of 35%.
It contained.
(2)無機微粒子を含まないスチレン系重合体成形用材
料の作成
乾式シリカを含まないスチレンモノマーを用いて、上記
(1)と同様にしてスチレン系重合体を製造した。得ら
れた重合体は、重量平均分子量が417.000.重量
平均分子量/数平均分子量が2.54.1!含量が75
ppm+、Ti含量が2 ppm+であった。(2) Preparation of styrenic polymer molding material containing no inorganic particles A styrenic polymer was produced in the same manner as in (1) above using a styrene monomer containing no dry silica. The obtained polymer had a weight average molecular weight of 417.000. Weight average molecular weight/number average molecular weight is 2.54.1! Content is 75
ppm+, and the Ti content was 2 ppm+.
このスチレン系重合体を上記(1)と同様にペレットと
した。このペレットの結晶化度は30%であり、スチレ
ンモノマー含量は800ppm+であった。This styrene polymer was made into pellets in the same manner as in (1) above. The crystallinity of the pellets was 30% and the styrene monomer content was 800 ppm+.
参考例2(スチレン系重合体延伸フィルムの製造)(1
)参考例1(1)のようにして得られた成形材料を用い
、直列型タンデム押出機の先端にT−ダイを取りつけた
装置で330″Cで溶融押出した。Reference example 2 (manufacture of styrenic polymer stretched film) (1
) The molding material obtained as in Reference Example 1 (1) was melt-extruded at 330''C using an in-line tandem extruder equipped with a T-die at the tip.
この時の剪断応力は、1.5 X 10 ’dyne/
aiであった。この溶融押出したシートを静電印荷によ
り63℃の冷却ロールに密着させ、冷却固化させた。The shear stress at this time is 1.5 x 10'dyne/
It was ai. This melt-extruded sheet was brought into close contact with a cooling roll at 63° C. by electrostatic charging, and cooled and solidified.
この時の冷却速度は平均55℃/秒で130μmの延伸
用シートを得た。このシートをロール間で、それぞれの
ロールの周速度を変化させ縦方向に、110°C2延伸
速度6000%/分で3倍に延伸した。続いて、横方向
にテンターを用いて120℃、延伸速度6000%/分
で3倍に延伸した。The cooling rate at this time was an average of 55° C./sec to obtain a stretched sheet of 130 μm. This sheet was stretched 3 times between rolls in the longitudinal direction at 110°C2 at a stretching speed of 6000%/min while changing the circumferential speed of each roll. Subsequently, the film was stretched 3 times in the transverse direction using a tenter at 120° C. and at a stretching rate of 6000%/min.
更に横方向にテンターで固定したまま、縦方向に、13
0℃、2000%/分で1.5倍に再延伸した。このフ
ィルムを、テンターに固定し若干弛緩させ、255℃で
10秒熱処理した。Furthermore, while fixing it horizontally with a tenter, vertically, 13
It was re-stretched to 1.5 times at 0° C. and 2000%/min. This film was fixed in a tenter, slightly relaxed, and heat-treated at 255° C. for 10 seconds.
得られたフィルムは厚さ12μmであった。このフィル
ムの線膨張係数を0°C〜90℃にて測定した。さらに
表面粗さをJIS B−0601に準拠し、カットオ
フ値0.08mmで、また、静摩擦係数をASTM D
−1984Bに準拠して測定した。得られたフィルムの
性質を表に示す。The resulting film had a thickness of 12 μm. The linear expansion coefficient of this film was measured at 0°C to 90°C. Furthermore, the surface roughness was determined according to JIS B-0601 with a cutoff value of 0.08 mm, and the static friction coefficient was determined according to ASTM D.
-1984B. The properties of the obtained film are shown in the table.
(2)T−ダイのリップ開度を4倍とし、再延伸倍率を
1.3倍としたことの他は、参考例2(1)と同様にし
た。得られたフィルムの性質を表に示す。(2) The same procedure as in Reference Example 2 (1) was carried out except that the lip opening degree of the T-die was 4 times and the re-stretching ratio was 1.3 times. The properties of the obtained film are shown in the table.
(3)参考例1(1)及び参考例1(2)の結晶化させ
たスチレン系重合体ペレットを用いて、押出機の先端に
T−ダイを取りつけた装置で330°Cで熔融共押出し
たことの他は、参考例2(1)と同様にした。得られた
フィルムの性質を表に示す。なお、この時、参考例1(
2)のスチレン系重合体ペレットを50/150/40
0/150150メツシユを入れた主押出機の直列型タ
ンデム単軸押出機で、また参考例1 (1)のスチレン
系重合体ペレットを複押出機で溶融押出した。(3) Using the crystallized styrenic polymer pellets of Reference Example 1 (1) and Reference Example 1 (2), melt coextrusion was performed at 330°C using a device equipped with a T-die at the tip of the extruder. Other than the above, the same procedure as in Reference Example 2(1) was carried out. The properties of the obtained film are shown in the table. In addition, at this time, reference example 1 (
2) Styrenic polymer pellets 50/150/40
The styrenic polymer pellets of Reference Example 1 (1) were melt-extruded using an in-line tandem single-screw extruder as the main extruder containing a 0/150150 mesh, and a double extruder.
(4)6考例1(2)のスチレン系重合体ペレットを用
いて、押出機中に50/150/400/150150
メツシユを入れたことの他は、参考例2(1)と同様に
延伸フィルムを作成した。このフィルムをコロナ処理し
た。次に、特開平1−95113号公報の実施例1で得
られたシンジオタクチック構造のスチレン−ジビニルベ
ンゼン共重合体(ジビニルベンゼン単位9.4モル%、
エチルベンゼン単位5.0モル%1重量平均分子量36
0.000 >の0.5wt%クロロホルム溶液を作り
、この溶液にスチレン−ジビニルベンゼン共重合体に対
して0.5 wt%の乾式法シリカ(テグツサ■製アエ
ロジル7T−600ニー次粒子の粒径40mμのもの)
を添加し、ホモ主キサーL型(特殊機化工梁部)を用い
て円筒容器で均一に混合し、スラリー溶液とした。この
スラリー溶液を上記フィルムにバーコーターにて塗布し
、250 ”Cで10秒乾燥した。得られたフィルムの
性質を表に示す。(4) 6 Using the styrene polymer pellets of Example 1 (2), 50/150/400/150150 was added to the extruder.
A stretched film was prepared in the same manner as in Reference Example 2(1) except that a mesh was added. This film was corona treated. Next, a styrene-divinylbenzene copolymer with a syndiotactic structure obtained in Example 1 of JP-A-1-95113 (9.4 mol% divinylbenzene units,
Ethylbenzene unit 5.0 mol% 1 weight average molecular weight 36
A 0.5 wt% chloroform solution of 0.000> was prepared, and 0.5 wt% of dry method silica (particle size of Aerosil 7T-600 secondary particles manufactured by Tegutsusa ■) was added to this solution based on the styrene-divinylbenzene copolymer. 40mμ)
was added and mixed uniformly in a cylindrical container using a Homojiki Kisser L type (Tokushu Kika Kogyobu) to obtain a slurry solution. This slurry solution was applied to the above film using a bar coater and dried at 250"C for 10 seconds. The properties of the obtained film are shown in the table.
(5)熱処理を施さなかったことの他は、参考例2(1
)と同様にした。(5) Reference example 2 (1) except that no heat treatment was performed.
).
(6)用いた無機微粒子を、平均粒径4μmのシリカ(
水理化学工業■製ジルトンAMT−40)としたことの
他は、参考例1 (1)と同様にしてスチレン系重合体
を作成した後、参考例2(1)と同様にした。(6) The inorganic fine particles used were silica (silica) with an average particle size of 4 μm (
A styrenic polymer was prepared in the same manner as in Reference Example 1 (1), except that it was used as Jiruton AMT-40 (manufactured by Suirikagaku Kogyo ■), and then in the same manner as in Reference Example 2 (1).
(7)参考例1(2)のスチレン系重合体材料より参考
例2(1)と同様にしてフィルムを作成した。(7) A film was prepared from the styrene polymer material of Reference Example 1 (2) in the same manner as in Reference Example 2 (1).
実施例1
参考例2(1)と同様にして得られたベースフィルムの
片面にコロナ放電処理を施し、続いてC。Example 1 One side of the base film obtained in the same manner as in Reference Example 2 (1) was subjected to corona discharge treatment, and then C.
80重量%、Ni2O重量%からなるターゲットを作成
し、このターゲットによってRFスパッタ法で、約30
00大の厚さのCo−Ni系の磁性薄膜を形成した。A target consisting of 80% by weight and 80% by weight of Ni2O was created, and by using this target, approximately 30
A Co--Ni magnetic thin film having a thickness of 0.00 mm was formed.
この時、ターゲ・ントとフィルムの間の距離は60μm
、プレート電圧!、 9 k V、プレート電流160
mA、アルゴン圧1. I X I O−”tmHgで
あった。At this time, the distance between the target and the film is 60 μm.
, plate voltage! , 9 kV, plate current 160
mA, argon pressure 1. IXIO-”tmHg.
このテープをVH3−ビデオテープと同幅に注意深くス
リットし、市販テープを分解し、テープのみ入れかえ、
ビデオカセットを作成した。Carefully slit this tape to the same width as the VH3 video tape, disassemble the commercially available tape, and replace only the tape.
Created a videocassette.
このテープの静摩擦係数より、すべり性を評価した。こ
のテープの静摩擦係数はベースフィルムと同等で良好で
あった。The slipperiness of this tape was evaluated based on the coefficient of static friction. The coefficient of static friction of this tape was good and equal to that of the base film.
また作成したVH3−ビデオカセットテープを家庭用ビ
デオ録画装置で録画再生した。なお、この時信頼性の指
標として室温条件と85℃、75%RHの高温多湿条件
での録画再往状態を観察したが、両方の条件下でほとん
ど変化なく、画像の乱れはなく良好であった。Further, the VH3-video cassette tape produced was recorded and played back using a home video recording device. At this time, as an indicator of reliability, we observed the recording and repeating conditions under room temperature conditions and under high temperature and humidity conditions of 85°C and 75% RH. Under both conditions, there was almost no change, and the image was in good condition with no disturbance. Ta.
実施例2
参考例2(1)と同様にして得られたベースフィルムの
片面にコロナ放電処理を施し、磁性塗料を塗布した。な
お、この磁性塗料の組成は、γ−F e O3磁性粉末
45重量部、塩化ビニル−酢酸ビニル共重合体(U、C
,C,社製 VAGH)17重量部、アクリロニトリル
−ブタジェン共重合体(日本ゼオン社製 N 143
2J)3.5重量部、ポリイソシアネート(日本ポリウ
レタン製 コロネートL)1.5重量部、メチルイソブ
チルケトン50重量部、トルエン50重量部、カーボン
ブラック4重量部である。乾燥後の磁性層の厚みは3μ
mであった。Example 2 One side of a base film obtained in the same manner as in Reference Example 2 (1) was subjected to corona discharge treatment and coated with a magnetic paint. The composition of this magnetic paint is 45 parts by weight of γ-F e O3 magnetic powder, vinyl chloride-vinyl acetate copolymer (U, C
, C, manufactured by VAGH) 17 parts by weight, acrylonitrile-butadiene copolymer (N 143 manufactured by Nippon Zeon Co., Ltd.)
2J) 3.5 parts by weight, 1.5 parts by weight of polyisocyanate (Coronate L manufactured by Nippon Polyurethane), 50 parts by weight of methyl isobutyl ketone, 50 parts by weight of toluene, and 4 parts by weight of carbon black. The thickness of the magnetic layer after drying is 3μ
It was m.
このテープを用いて実施例1と同様にした。結果を表に
示す。The same procedure as in Example 1 was carried out using this tape. The results are shown in the table.
実施例3
参考例2(2)と同様にして得られたベースフィルムの
両面にコロナ放電処理した後、実施例1と同様にして両
面に磁性層を設けた。このフィルムの両面を適度に研磨
した後、市販の5インチフロッピーと同じサイズに切り
抜いた。さらにこの円盤を市販のフロッピーのシャケシ
トに入れ、フロッピーディクを作成した。磁性層をもつ
フィルムの静摩擦係数を実施例1と同様に調べた。また
作成したフロッピーを用いて、5AVEとLOADの状
態をNECPC−9801Fを用いて、室温条件と高温
高温条件下で調べたところいずれも良好であった。Example 3 After corona discharge treatment was applied to both sides of the base film obtained in the same manner as in Reference Example 2 (2), magnetic layers were provided on both sides in the same manner as in Example 1. After appropriately polishing both sides of this film, it was cut out to the same size as a commercially available 5-inch floppy disk. Furthermore, this disk was placed in a commercially available floppy disk to create a floppy disk. The static friction coefficient of the film with the magnetic layer was investigated in the same manner as in Example 1. Further, using the prepared floppy disk, the 5AVE and LOAD conditions were examined using NECPC-9801F under room temperature conditions and high temperature conditions, and both were found to be good.
実施例4
参考例2(3)と同様にして得たフィルムの平滑面側に
磁性層を設けることの他は、実施例1と同様にした。結
果を表に示す。Example 4 The same procedure as in Example 1 was carried out except that a magnetic layer was provided on the smooth side of the film obtained in the same manner as in Reference Example 2 (3). The results are shown in the table.
実施例5
参考例2(4)と同様にして得たフィルムの平滑面側に
磁性層を設けることの他は、実施例1と同様にした。結
果を表に示す。Example 5 The same procedure as in Example 1 was carried out except that a magnetic layer was provided on the smooth side of the film obtained in the same manner as in Reference Example 2 (4). The results are shown in the table.
比較例1
参考例2(5)と同様にして得たフィルムの片面に磁性
層を設けることの他は、実施例1と同様にした。結果を
表に示す。Comparative Example 1 The same procedure as in Example 1 was carried out except that a magnetic layer was provided on one side of the film obtained in the same manner as in Reference Example 2 (5). The results are shown in the table.
比較例2
参考例2(6)と同様にして得たーフィルムの片面に磁
性層を設けることの他は、実施例1と同様にした。結果
を表に示す。Comparative Example 2 A film obtained in the same manner as in Reference Example 2 (6) was prepared in the same manner as in Example 1, except that a magnetic layer was provided on one side of the film. The results are shown in the table.
比較例3
参考例2(7)と同様にして得たフィルムの片面に磁性
層を設けることの他は、実施例1と同様にした。結果を
表に示す。Comparative Example 3 The same procedure as in Example 1 was carried out except that a magnetic layer was provided on one side of the film obtained in the same manner as in Reference Example 2 (7). The results are shown in the table.
比較例4
ポリエチレンレフタレート(PET)フィルム(ティジ
ン製テトロンN512μm)を用いたことの他は、実施
例1と同様にした。結果を表に示す。Comparative Example 4 The same procedure as Example 1 was carried out except that a polyethylene phthalate (PET) film (Tetron N512 μm manufactured by Tijin Co., Ltd.) was used. The results are shown in the table.
(以下余白)
〔発明の効果〕
畝上の如く得られる本発明の磁気記録媒体は、すべり性
及び平滑性にすぐれ、また温度、湿度に対する寸法安定
性にもすぐれたものである。(Hereinafter in the margin) [Effects of the Invention] The magnetic recording medium of the present invention obtained in a ridged manner has excellent slip properties and smoothness, and also has excellent dimensional stability against temperature and humidity.
したがって、本発明の磁気記録媒体は、各種の磁気テー
プ、磁気ディスク、M!気トドラム磁気カード等に好適
に利用することができる。Therefore, the magnetic recording medium of the present invention can be applied to various magnetic tapes, magnetic disks, M! It can be suitably used for magnetic drum cards and the like.
Claims (4)
ン系重合体又はその組成物の延伸フィルムあるいは該延
伸フィルムを含む積層フィルムであって、線膨張係数が
5×10^−^5/℃以下及び静摩擦係数が0.3以上
1.0以下である基材フィルムの少なくとも片面に磁性
層を有する磁気記録媒体。(1) A stretched film of a styrenic polymer or its composition mainly having a syndiotactic structure, or a laminated film containing the stretched film, with a coefficient of linear expansion of 5 x 10^-^5/°C or less and a coefficient of static friction. 1. A magnetic recording medium having a magnetic layer on at least one side of a base film in which the ratio is 0.3 or more and 1.0 or less.
ンジオタクチック構造のスチレン系重合体組成物からな
る請求項1記載の磁気記録媒体。(2) The magnetic recording medium according to claim 1, wherein the stretched film is composed of a styrenic polymer composition mainly having a syndiotactic structure and containing inorganic fine particles.
、0.001μm以上0.05μm以下である請求項1
又は2記載の磁気記録媒体。(3) Claim 1 wherein the surface roughness Ra of at least one side of the base film is 0.001 μm or more and 0.05 μm or less.
Or the magnetic recording medium according to 2.
シンジオタクチック構造のスチレン系重合体組成物から
なる層と無機微粒子を含有しない主としてシンジオタク
チック構造のスチレン系重合体又はその組成物からなる
層を有する積層体である請求項1〜3のいずれかに記載
の磁気記録媒体。(4) The base film consists of a layer consisting of a styrenic polymer composition with a mainly syndiotactic structure containing inorganic fine particles and a styrenic polymer composition with a mainly syndiotactic structure containing no inorganic fine particles or a composition thereof. The magnetic recording medium according to any one of claims 1 to 3, which is a laminate having layers.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22318489A JP2866673B2 (en) | 1989-08-31 | 1989-08-31 | Magnetic recording media |
EP19900912858 EP0440817B1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
CA002039161A CA2039161A1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
DE69032926T DE69032926T2 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
PCT/JP1990/001104 WO1991003810A1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
DE69027763T DE69027763T2 (en) | 1989-08-31 | 1990-08-30 | MAGNETIC RECORDING MEDIUM |
AT95109896T ATE176354T1 (en) | 1989-08-31 | 1990-08-30 | MAGNETIC RECORDING MEDIUM |
US07/651,262 US5374462A (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
EP95109896A EP0682340B1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
AT90912858T ATE140334T1 (en) | 1989-08-31 | 1990-08-30 | MAGNETIC RECORDING MEDIUM |
KR1019910700426A KR960005449B1 (en) | 1989-08-31 | 1991-04-29 | Magnetic recording medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22318489A JP2866673B2 (en) | 1989-08-31 | 1989-08-31 | Magnetic recording media |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0386706A true JPH0386706A (en) | 1991-04-11 |
JP2866673B2 JP2866673B2 (en) | 1999-03-08 |
Family
ID=16794122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22318489A Expired - Fee Related JP2866673B2 (en) | 1989-08-31 | 1989-08-31 | Magnetic recording media |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2866673B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0691750A (en) * | 1992-09-11 | 1994-04-05 | Toyobo Co Ltd | Syndiotactic polystyrene biaxially drawn film |
JPH0699485A (en) * | 1992-09-21 | 1994-04-12 | Toyobo Co Ltd | Syndiotactic polystyrenic biaxially stretched film |
JPH06100711A (en) * | 1992-09-21 | 1994-04-12 | Toyobo Co Ltd | Syndiotactic polystyrenic biaxially oriented film |
JPH06106616A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Syndiotactic polystyrenr biaxially oriented film |
JPH06107812A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Biaxially oriented syndiotactic polystyrene film |
JPH06107813A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Biaxially oriented syndiotactic polystyrene film |
JPH0724911A (en) * | 1993-07-08 | 1995-01-27 | Toyobo Co Ltd | Syndyotactic polystyrene film |
JP2006001275A (en) * | 2004-05-17 | 2006-01-05 | Teijin Dupont Films Japan Ltd | Biaxially oriented laminated film and magnetic recording medium |
DE112008002591T5 (en) | 2007-09-28 | 2010-07-22 | Anritsu Corp., Atsugi | Jitter generating device, device testing system using the same, and jitter generating method |
US8067105B2 (en) | 2004-01-29 | 2011-11-29 | Teijin Dupont Films Japan Limited | Biaxially oriented film |
-
1989
- 1989-08-31 JP JP22318489A patent/JP2866673B2/en not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0691750A (en) * | 1992-09-11 | 1994-04-05 | Toyobo Co Ltd | Syndiotactic polystyrene biaxially drawn film |
JPH0699485A (en) * | 1992-09-21 | 1994-04-12 | Toyobo Co Ltd | Syndiotactic polystyrenic biaxially stretched film |
JPH06100711A (en) * | 1992-09-21 | 1994-04-12 | Toyobo Co Ltd | Syndiotactic polystyrenic biaxially oriented film |
JPH06106616A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Syndiotactic polystyrenr biaxially oriented film |
JPH06107812A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Biaxially oriented syndiotactic polystyrene film |
JPH06107813A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Biaxially oriented syndiotactic polystyrene film |
JPH0724911A (en) * | 1993-07-08 | 1995-01-27 | Toyobo Co Ltd | Syndyotactic polystyrene film |
US8067105B2 (en) | 2004-01-29 | 2011-11-29 | Teijin Dupont Films Japan Limited | Biaxially oriented film |
US8367199B2 (en) | 2004-01-29 | 2013-02-05 | Teijin Dupont Films Japan Limited | Biaxially oriented film |
JP2006001275A (en) * | 2004-05-17 | 2006-01-05 | Teijin Dupont Films Japan Ltd | Biaxially oriented laminated film and magnetic recording medium |
DE112008002591T5 (en) | 2007-09-28 | 2010-07-22 | Anritsu Corp., Atsugi | Jitter generating device, device testing system using the same, and jitter generating method |
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---|---|
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