JPH0385636U - - Google Patents
Info
- Publication number
- JPH0385636U JPH0385636U JP1989146661U JP14666189U JPH0385636U JP H0385636 U JPH0385636 U JP H0385636U JP 1989146661 U JP1989146661 U JP 1989146661U JP 14666189 U JP14666189 U JP 14666189U JP H0385636 U JPH0385636 U JP H0385636U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- pattern
- integrated circuit
- circuit chip
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989146661U JPH0385636U (enExample) | 1989-12-20 | 1989-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989146661U JPH0385636U (enExample) | 1989-12-20 | 1989-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385636U true JPH0385636U (enExample) | 1991-08-29 |
Family
ID=31693212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989146661U Pending JPH0385636U (enExample) | 1989-12-20 | 1989-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385636U (enExample) |
-
1989
- 1989-12-20 JP JP1989146661U patent/JPH0385636U/ja active Pending
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