JPH0385636U - - Google Patents

Info

Publication number
JPH0385636U
JPH0385636U JP1989146661U JP14666189U JPH0385636U JP H0385636 U JPH0385636 U JP H0385636U JP 1989146661 U JP1989146661 U JP 1989146661U JP 14666189 U JP14666189 U JP 14666189U JP H0385636 U JPH0385636 U JP H0385636U
Authority
JP
Japan
Prior art keywords
bonding
pattern
integrated circuit
circuit chip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989146661U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989146661U priority Critical patent/JPH0385636U/ja
Publication of JPH0385636U publication Critical patent/JPH0385636U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/884

Landscapes

  • Die Bonding (AREA)
JP1989146661U 1989-12-20 1989-12-20 Pending JPH0385636U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989146661U JPH0385636U (enExample) 1989-12-20 1989-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989146661U JPH0385636U (enExample) 1989-12-20 1989-12-20

Publications (1)

Publication Number Publication Date
JPH0385636U true JPH0385636U (enExample) 1991-08-29

Family

ID=31693212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989146661U Pending JPH0385636U (enExample) 1989-12-20 1989-12-20

Country Status (1)

Country Link
JP (1) JPH0385636U (enExample)

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