JPH0380435B2 - - Google Patents
Info
- Publication number
- JPH0380435B2 JPH0380435B2 JP59195422A JP19542284A JPH0380435B2 JP H0380435 B2 JPH0380435 B2 JP H0380435B2 JP 59195422 A JP59195422 A JP 59195422A JP 19542284 A JP19542284 A JP 19542284A JP H0380435 B2 JPH0380435 B2 JP H0380435B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat generating
- nickel
- conductor
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 59
- 239000004020 conductor Substances 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005299 abrasion Methods 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 88
- 238000000034 method Methods 0.000 description 20
- 238000005530 etching Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 230000000873 masking effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、例えば複数個の発熱抵抗素子を同一
基板上に直線的に配置し、情報に従いこの発熱抵
抗体素子を通電発熱させて感熱記録紙に発色記録
させ、あるいはインクリボンを介して普通紙に転
写記録させるサーマルヘツドに関する。Detailed Description of the Invention [Field of Application of the Invention] The present invention is directed to, for example, arranging a plurality of heat-generating resistor elements linearly on the same substrate, and energizing the heat-generating resistor elements according to information to generate heat to produce thermal recording paper. This invention relates to a thermal head that performs color recording on paper or transfers and records onto plain paper via an ink ribbon.
従来のサーマルヘツドは、例えば第６図に示す
ように、電気絶縁性のアルミナ基板１の上に薄く
グレーズ層２を設け、その上にTa2Ｎなどからな
り発熱して感熱記録紙等に発色エネルギーを与え
る発熱抵抗体層３と、その発熱抵抗体層３に接続
されて情報に応じて電流を通じるAl，Niなどか
らなる導体層４，５（Ni層５は第７図を参照さ
れたい）と、SiO2などからなり前記発熱抵抗体
層３を酸化による劣化から保護する耐酸化層６
と、Ta1O5などからなり感熱記録紙との接触によ
る摩耗から前記発熱抵抗体層３および導体層４お
よび耐熱酸化層６を保護するための耐摩耗層７と
を順次積層した構造を有する。そして前記導体層
４，５に電流を通じたとき、導体層４の一部が取
除かれて一段下つて形成された発熱部８が発熱し
て、感熱記録紙等に発色記録エネルギーを与える
ようになつている。第７図に示すように上記サー
マルヘツドは発熱部８の両側に、共通電極ライン
９とそれぞれの個別電極ライン１０ａ〜１０ｇと
が設けられている。そして、共通および個別の電
極ラインの両者は、図中、画成線Ｂにより画成さ
れた下側の端子部１１の範囲域で、第９図に示す
ように半田層１３がニツケル層５を覆つて予備半
田付されている。この半田層１３は、外部回路
と、半田付により接続されるようになつている。
第７図中、画成線Ｂにより画成された下側の端子
部１１以外の上側のヘツド面１２は、耐酸化層６
および耐摩耗層７によつて覆われ保護されてい
る。なお第６図は第７図のＡ−A′線に沿つて切
断した断面図である。
A conventional thermal head, for example, as shown in Figure 6, has a thin glaze layer 2 on an electrically insulating alumina substrate 1, and is made of Ta 2 N or the like on top of the glaze layer 2, which generates heat and colors the thermal recording paper. A heating resistor layer 3 that gives energy, and conductor layers 4 and 5 made of Al, Ni, etc. connected to the heating resistor layer 3 and conducting current according to information (for the Ni layer 5, see FIG. 7). ), and an oxidation-resistant layer 6 made of SiO 2 or the like and protecting the heating resistor layer 3 from deterioration due to oxidation.
and a wear-resistant layer 7 made of Ta 1 O 5 or the like and used to protect the heat-generating resistor layer 3, conductor layer 4, and heat-resistant oxidation layer 6 from wear caused by contact with thermal recording paper. . When a current is passed through the conductor layers 4 and 5, a part of the conductor layer 4 is removed and a heat-generating portion 8 formed one step below generates heat, giving color recording energy to the thermal recording paper or the like. It's summery. As shown in FIG. 7, the thermal head is provided with a common electrode line 9 and individual electrode lines 10a to 10g on both sides of the heat generating part 8. Both the common and individual electrode lines are located in the area of the lower terminal portion 11 defined by the demarcation line B in the figure, where the solder layer 13 covers the nickel layer 5 as shown in FIG. It is covered and pre-soldered. This solder layer 13 is connected to an external circuit by soldering.
In FIG. 7, the upper head surface 12 other than the lower terminal portion 11 defined by the demarcation line B is covered with an oxidation-resistant layer 6.
and is covered and protected by a wear-resistant layer 7. Note that FIG. 6 is a sectional view taken along line A-A' in FIG. 7.
このような従来のサーマルヘツドにおいて、ニ
ツケル（Ni）から成る導体層５を設けるのは、
Alが半田付性に劣り、サーマルヘツドの端子と
して外部回路と半田付によつて接続する事に適さ
ないため、半田付けされやすいNiをAlの上に蒸
着して、外部回路との容易な接続を可能とするた
めである。導体層４，５は、従来、発熱抵抗体層
３の上にまずAl導体層４を蒸着し、その上にNi
導体層５を蒸着してホトリソ技術で２回のマスキ
ングにより順にNi→Al→Ta2Ｎ→Alとパターン
ニングしてヘツド面にて電極部と発熱部を形成
し、ヘツド面にて保護層６，７を被覆すればサー
マルヘツドとなる。しかし、この場合Al層より
上のNiと耐酸化層６のSiO2の密着性が悪いため
一般に保護層６，７を被覆するヘツド面１２の導
体層は第７図に示すようにNi層をエツチング除
去してAlのみとしている。このため第８図のよ
うに従来のフオトプロセスは、Ta2Ｎエツチング
の後、次のAlエツチングの前に、Niエツチング
のためのレジストコートからレジスト剥離の工程
を要し、反復３回マスキングすることになり計23
工程と多大の時間を要し、著しくコスト高となる
欠点があつた。なお、第８図中、レジストコー
ト、プリベーク（溶剤蒸発）アライメント（マス
クと基板の位置合せ）・露光、現象・リンス、ポ
ストベーク（レジストの密着性を上げる工程）、
エツチングおよびレジスト剥離工程は、通常のマ
スキングで行われている技術を示す。
In such a conventional thermal head, the conductor layer 5 made of nickel (Ni) is provided because:
Since Al has poor solderability and is not suitable for connecting to an external circuit by soldering as a thermal head terminal, Ni, which is easy to solder, is vapor-deposited on Al to facilitate easy connection to an external circuit. This is to make it possible. Conventionally, the conductor layers 4 and 5 are formed by first depositing an Al conductor layer 4 on the heating resistor layer 3, and then depositing Ni on top of the Al conductor layer 4.
A conductor layer 5 is deposited and patterned in the order of Ni→Al→Ta 2 N→Al by photolithography twice by masking to form an electrode part and a heat generating part on the head surface, and a protective layer 6 is formed on the head surface. , 7, it becomes a thermal head. However, in this case, since the adhesion between the Ni above the Al layer and the SiO 2 of the oxidation-resistant layer 6 is poor, the conductor layer on the head surface 12 that covers the protective layers 6 and 7 is generally made of a Ni layer as shown in FIG. Etching has been removed to leave only Al. For this reason, as shown in Figure 8, the conventional photo process requires a step of removing the resist from the resist coat for Ni etching after Ta 2 N etching and before the next Al etching, and repeating masking three times. So a total of 23
The drawback was that it required a large amount of time and process, and was extremely costly. In addition, in FIG. 8, resist coating, pre-bake (solvent evaporation), alignment (alignment of mask and substrate), exposure, phenomenon, rinsing, post-bake (process to improve resist adhesion),
The etching and resist stripping steps represent techniques commonly used in masking.
しかも、サーマルヘツドの保護層６，７を被覆
しないヘツド端子部１１において、ホトエツチン
グされた端子部の断面を見ると、第９図に示すよ
うに下にAl、上にNiが積層された２層構造とな
つている。このためイオン化傾向順位の大きく異
なるAlとNiの接合部が外気に触れていることか
ら、湿気等により腐食が発生して導体抵抗が上昇
しやすく、防湿性の良いプラスチツク接着剤等を
選定して湿気を封ずるようなパシベーシヨンが不
可欠であるなど信頼性に欠けるものであつた。 Furthermore, when looking at the cross section of the photoetched terminal section of the head terminal section 11 that does not cover the protective layers 6 and 7 of the thermal head, as shown in FIG. It has a structure. For this reason, since the joint between Al and Ni, which have significantly different ionization tendency rankings, is exposed to the outside air, corrosion is likely to occur due to moisture etc. and the conductor resistance increases, so a plastic adhesive with good moisture resistance should be selected. It lacked reliability, requiring passivation to seal out moisture.
本発明は前記従来技術の問題点に鑑みてなされ
たものであり、その目的とするところは導体端子
部の製造方法を変更することにより、サーマルヘ
ツド製造プロセスの導体層成膜工数及びフオトプ
ロセスの工数を削減しコスト低減をはかるととも
に、端子部Alの全面をNiで被覆して異種の金属
の接合部が外気に触れないものとし耐蝕効果を増
し信頼性の高いサーマルヘツドを提供することに
ある。
The present invention has been made in view of the problems of the prior art, and its purpose is to reduce the number of steps required for forming a conductor layer in the thermal head manufacturing process and the photo process by changing the manufacturing method of the conductor terminal portion. The aim is to provide a thermal head that reduces man-hours and costs, and also coats the entire surface of the terminal Al with Ni to prevent the joints of dissimilar metals from coming into contact with the outside air, increasing corrosion resistance and providing a highly reliable thermal head. .
かかる目的を達成するため、本発明のサーマル
ヘツドは、絶縁性基板上にグレース層を設け、そ
の上に発熱抵抗体層そしてアルミニウムまたはア
ルミニウム合金から成る導体層を順次積層した
後、所定のパターンニングを行つて複数の発熱
部、これら各発熱部に接続される電極部および外
部回路と接続される端子部を形成し、その後、こ
の端子部をマスクして成膜を行うことにより前記
発熱部および前記電極部に耐酸化層および耐磨耗
層を順に積層して対象紙面に圧接されるヘツド面
を構成し、一方前記端子部の導体層に無電解メツ
キを行うことにより該導体層の上面および両側面
を包囲してニツケル層を鍍着し、さらに該ニツケ
ル層上に半田層を形成して構成したことを特徴と
する。
In order to achieve such an object, the thermal head of the present invention provides a grace layer on an insulating substrate, a heating resistor layer and a conductor layer made of aluminum or aluminum alloy are sequentially laminated thereon, and then a predetermined patterning process is performed. to form a plurality of heat generating parts, an electrode part connected to each of these heat generating parts, and a terminal part connected to an external circuit, and then forming a film with the terminal parts masked to form a plurality of heat generating parts and An oxidation-resistant layer and an abrasion-resistant layer are sequentially laminated on the electrode portion to form a head surface that is pressed against the target paper surface, and electroless plating is performed on the conductor layer of the terminal portion to form a top surface and a wear-resistant layer of the conductor layer. It is characterized in that a nickel layer is plated to surround both sides, and a solder layer is further formed on the nickel layer.
上記絶縁基板、グレーズ層および発熱抵抗体層
は従来公知の材料例えば基板にアルミナ、グレー
ズにガラス、抵抗体にTa2Ｎ等を使用しうるが、
その材料と同一機能を持つ材料を用いることがで
きることはいうまでもない。グレース層、発熱抵
抗体層およびアルミニウムまたはアルミニウム合
金例えばアルミニウムとシリコンの合金から成る
導体層、従来法を用いて所定膜厚に形成する。 The insulating substrate, glaze layer and heating resistor layer may be made of conventionally known materials such as alumina for the substrate, glass for the glaze, Ta 2 N for the resistor, etc.
It goes without saying that a material having the same function as that material can be used. A grace layer, a heating resistor layer, and a conductor layer made of aluminum or an aluminum alloy, such as an alloy of aluminum and silicon, are formed to a predetermined thickness using a conventional method.
ヘツド面における導体層の導電パターンを作る
には、ホトリソ技術で２回の慣用マスキング反復
により作る。例えば後述する実施例のように行
う。耐酸化層および耐摩耗層も、従来公知の材料
例えば耐酸化層にSiO2、耐摩耗層にはTa2O5等を
使用しうるが、その材料と同一機能を持つ材料を
用いることができることはいうまでもない。これ
らの層の成膜も従来法例えばスパツタリングによ
り所望の膜厚に形成して行う。 The conductive pattern of the conductor layer on the head surface is produced by two conventional masking iterations using photolithographic techniques. For example, it is performed as in the embodiment described later. For the oxidation-resistant layer and the wear-resistant layer, conventionally known materials such as SiO 2 for the oxidation-resistant layer and Ta 2 O 5 for the wear-resistant layer can be used, but materials having the same functions as those materials can be used. Needless to say. These layers are also formed to a desired thickness by conventional methods such as sputtering.
端子部における導体層の導電パターンは、ヘツ
ド面での導電パターン形成時に形成される。そし
てニツケル層は、メツキ処理を行うことにより作
られるが、その厚さは、ニツケル層のピンホール
対策上約2μm以上が好ましい。半田層は、予備半
田付により形成する。その層厚は２〜５が望まし
い。 The conductive pattern of the conductor layer in the terminal portion is formed when the conductive pattern is formed on the head surface. The nickel layer is formed by plating, and its thickness is preferably about 2 μm or more in order to prevent pinholes in the nickel layer. The solder layer is formed by preliminary soldering. The layer thickness is preferably 2 to 5.
以下本発明の一実施例を第１図ないし第５図に
従つて説明する。なお、図中、第６図、第７図お
よび第９図と同一構成要素には、同一符号が付し
てある。第１図に示すように、絶縁性基板１の表
面を薄いグレーズ層２で覆つたグレーズドアルミ
ナ基板上に、TaをArとN2ガスのリアクテイブス
パツタリング法により0.05〜0.2μmの厚みでTa2
Ｎから成る発熱抵抗体層３を形成し、次に約2μm
の厚みでAl導体層４を形成する。そして第３図
に示すように図中矢印進行方向の工程を行いホト
リソ技術で２回の慣用マスキング反覆により順に
レジスコート プリベーク、アライメント・露
光、現像・リンス、ポストベーク、Alエツチン
グ、Ta2Ｎエツチング、レジスト剥離を行い、再
びレジスコート、プリベーク、アライメント・露
光、現像・リンス、ポストベーク、Alエツチン
グそしてレジスト剥離を順に行う。よつて15工程
で電極部と発熱部パターンを形成する。次に端子
部１１をメタルマスクで覆つた後約2μmの厚みの
SiO2膜よりなる耐酸化層６および約5μmの厚み
のTa2O5よりなる耐摩耗層７をスパツタリングに
より形成することにより、ヘツド面１２は作製さ
れる。
An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. In the figure, the same components as in FIGS. 6, 7, and 9 are designated by the same reference numerals. As shown in Fig. 1, Ta is deposited to a thickness of 0.05 to 0.2 μm on a glazed alumina substrate, in which the surface of an insulating substrate 1 is covered with a thin glaze layer 2, by reactive sputtering using Ar and N2 gas. Ta 2
A heating resistor layer 3 made of N is formed, and then a thickness of about 2 μm is formed.
The Al conductor layer 4 is formed to a thickness of . Then, as shown in Fig. 3, the process in the direction of the arrow in the figure is carried out by repeating conventional masking twice using photolithography technology to sequentially apply resist coating, pre-bake, alignment/exposure, development/rinsing, post-bake, Al etching, and Ta 2 N etching. , resist stripping is performed, and resist coating, pre-bake, alignment/exposure, development/rinsing, post-bake, Al etching, and resist stripping are performed again in this order. Therefore, the electrode part and the heat generating part pattern are formed in 15 steps. Next, after covering the terminal part 11 with a metal mask,
The head surface 12 is fabricated by forming by sputtering an oxidation-resistant layer 6 made of a SiO 2 film and a wear-resistant layer 7 made of Ta 2 O 5 with a thickness of about 5 μm.
次に第４図に示す工程で端子部１１の範囲域で
のアルミ層（第２図および第５図参照）に選択的
に無電解メツキして、ニツケル層１４を約2μmの
厚みで第５図のように端子全面に被覆し、そして
半田層１５をニツケル層１４を覆つて予備半田付
により形成して第１図および第２図の端子部１６
作製した後外部外路との接続を行うものである。 Next, in the process shown in FIG. 4, the aluminum layer (see FIGS. 2 and 5) in the area of the terminal portion 11 is selectively electrolessly plated to form a nickel layer 14 with a thickness of approximately 2 μm. The entire surface of the terminal is coated as shown in the figure, and a solder layer 15 is formed by preliminary soldering to cover the nickel layer 14.
After it is fabricated, it is connected to an external circuit.
本例によれば、ヘツド面１２の導体層４をその
上にNi層を一旦形成する過程を経ずにAlまたは
Al合金の単層とするためその成膜材料、成膜時
間、メンテナンス時間の削減とフオトプロセスに
おけるマスキングとエツチングの反復回数の削減
がはかられ、従来多大の時間を要してした工程が
上記の分著しく時間短縮された。また上述した従
来のサーマルヘツドの製造過程にはなかつた端子
部の無電解ニツケルメツキの処理は、第４図に示
すように順にアルカリ脱脂、酸洗、Zn置換、無
電解Niメツキ、フレオン乾燥を行う工程から成
り、多数枚の基板を同時に処理できる上、その工
程は約15分サイクルとなり、マスキングとエツチ
ングの一工程に費す時間に比べて大巾に短かいた
め、サーマルヘツド製造工程の時間短縮効果は大
きい。また無電解ニツケルメツキは、メツキ液に
接するAlの全面に一様にNi膜を被覆して、Alと
Ni接合部が外気に接触しなくなるため、Alの防
蝕効果がある。 According to this example, the conductor layer 4 on the head surface 12 can be formed using Al or Al without first forming a Ni layer thereon.
Since it is a single layer of Al alloy, it is possible to reduce the deposition material, deposition time, and maintenance time, as well as the number of repetitions of masking and etching in the photo process. The time was significantly reduced. In addition, the electroless nickel plating of the terminals, which was not included in the conventional thermal head manufacturing process mentioned above, is performed in the following order: alkaline degreasing, pickling, Zn replacement, electroless nickel plating, and Freon drying, as shown in Figure 4. The process consists of several steps and can process many substrates at the same time, and the process takes about a 15 minute cycle, which is much shorter than the time required for one process of masking and etching, thus reducing the time required for the thermal head manufacturing process. The effect is great. In addition, electroless nickel plating involves coating the entire surface of Al in contact with the plating solution with a Ni film.
Since the Ni joints are no longer in contact with the outside air, there is an anti-corrosion effect of Al.
従つて本発明のサーマルヘツドによれば、ヘツ
ド面の導体層をアルミニウムまたはアルミニウム
合金層の上にニツケル層を一旦形成する過程を経
ずにアルミニウムまたはアルミニウム合金の単層
とし、かつ端子部にはアルミニウムまたはアルミ
ニウム合金の導体層の上面および両側面を包囲す
るようにニツケルメツキ層およびさらにその上に
半田層を形成した構成とされるので、絶縁基板上
のアルミニウムまたはアルミニウム合金導体層上
に一旦ニツケル層を形成した後、ヘツド面のニツ
ケル層を除去することにより形成された従来のサ
ーマルヘツドに比べて、ニツケル層の成膜材料、
導体層成膜工数およびフオトプロセスの工数を大
巾に削減して、その分コストの低減を容易に達成
することができる。
Therefore, according to the thermal head of the present invention, the conductor layer on the head surface is made of a single layer of aluminum or aluminum alloy without going through the process of once forming a nickel layer on the aluminum or aluminum alloy layer, and the terminal portion is made of a single layer of aluminum or aluminum alloy. Since the structure is such that a nickel plating layer and a solder layer are further formed on the top surface and both sides of the aluminum or aluminum alloy conductor layer, the nickel layer is once formed on the aluminum or aluminum alloy conductor layer on the insulating substrate. Compared to conventional thermal heads, which are formed by removing the nickel layer on the head surface after forming the nickel layer,
The number of man-hours for forming a conductor layer and the number of photo-processing steps can be greatly reduced, and cost reduction can be easily achieved accordingly.
しかも、本発明のサーマルヘツドでは、端子部
のアルミニウム（アルミニウム合金）導体層の全
面がニツケルで被覆されることになるので、アル
ミニウム（アルミニウム合金）とニツケルとの金
属接合部が外気に触れることにより発生する腐食
を防止することができ、サーマルヘツドを信頼性
の高いものとすることができる。 Moreover, in the thermal head of the present invention, the entire surface of the aluminum (aluminum alloy) conductor layer in the terminal portion is coated with nickel, so that the metal joint between aluminum (aluminum alloy) and nickel is exposed to the outside air. Corrosion that occurs can be prevented, and the thermal head can be made highly reliable.
第１図は第２図のＣ−C′線に沿つて切断した本
発明のサーマルヘツドの１実施例を示す断面図、
第２図は第１図のものを示す平面図、第３図は第
１図および第２図の導電パターンを作るためのフ
オトプロセスの示す工程図、第４図は第１図およ
び第２図のもののニツケル層を形成するための無
電解Niメツキ工程を示す図、第５図は第１図、
第２図のものの端子部を示す断面図、第６図は第
７図のＡ−A′線に沿つて切つた従来のサーマル
ヘツドを示す断面図、第７図は第６図のものを示
す平面図、第８図は第６図および第７図のものの
導電パターンを作るためのフオトプロセスを示す
工程図、第９図は第６図および第７図のものの端
子部を示す断面図である。
１……絶縁性基板、２……グレーズ層、３……
発熱抵抗体層、４……導体層、６……耐酸化層、
７……耐摩耗層、１２……ヘツド面、１４……ニ
ツケル層、１５……半田層、１６……端子部。
FIG. 1 is a sectional view showing one embodiment of the thermal head of the present invention taken along line C-C' in FIG.
Fig. 2 is a plan view of the one shown in Fig. 1, Fig. 3 is a process diagram showing the photo process for making the conductive patterns shown in Figs. 1 and 2, and Fig. 4 is a plan view of the one shown in Figs. A diagram showing the electroless Ni plating process for forming a nickel layer on objects, Figure 5 is similar to Figure 1,
Figure 6 is a cross-sectional view of the conventional thermal head taken along the line A-A' in Figure 7, and Figure 7 is the same as that shown in Figure 6. A plan view, FIG. 8 is a process diagram showing the photo process for making the conductive pattern of the one shown in FIGS. 6 and 7, and FIG. 9 is a sectional view showing the terminal part of the one shown in FIGS. 6 and 7. . 1... Insulating substrate, 2... Glaze layer, 3...
heating resistor layer, 4... conductor layer, 6... oxidation resistant layer,
7... Wear-resistant layer, 12... Head surface, 14... Nickel layer, 15... Solder layer, 16... Terminal portion.
Claims (1)
発熱抵抗体層そしてアルミニウムまたはアルミニ
ウム合金から成る導体層を順次積層した後、所定
のパターンニングを行つて複数の発熱部、これら
各発熱部に接続される電極部および外部回路と接
続される端子部を形成し、その後、この端子部を
マスクして成膜を行うことにより前記発熱部およ
び前記電極部に耐酸化層および耐磨耗層を順に積
層して対象紙面に圧接されるヘツド面を構成し、
一方前記端子部の導体層に無電解メツキを行うこ
とにより該導体層の上面および両側面を包囲して
ニツケル層を鍍着し、さらに該ニツケル層上に半
田層を形成して構成したことを特徴とするサーマ
ルヘツド。1 A glaze layer is provided on an insulating substrate, a heat generating resistor layer and a conductor layer made of aluminum or aluminum alloy are sequentially laminated on the glaze layer, and then a predetermined patterning is performed to form a plurality of heat generating parts and each of these heat generating parts. An electrode part to be connected and a terminal part to be connected to an external circuit are formed, and then the terminal part is masked and film is formed to form an oxidation-resistant layer and an abrasion-resistant layer on the heat generating part and the electrode part. They are laminated in order to form the head surface that is pressed against the target paper surface.
On the other hand, electroless plating is performed on the conductor layer of the terminal portion to cover the upper surface and both side surfaces of the conductor layer, and a nickel layer is plated, and a solder layer is further formed on the nickel layer. Features a thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59195422A JPS6172560A (en) | 1984-09-18 | 1984-09-18 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59195422A JPS6172560A (en) | 1984-09-18 | 1984-09-18 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6172560A JPS6172560A (en) | 1986-04-14 |
| JPH0380435B2 true JPH0380435B2 (en) | 1991-12-24 |
Family
ID=16340811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59195422A Granted JPS6172560A (en) | 1984-09-18 | 1984-09-18 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172560A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103982A (en) * | 1979-02-01 | 1980-08-08 | Matsushita Electric Ind Co Ltd | Thermal printing head and preparation therefor |
| JPS56135081A (en) * | 1980-03-26 | 1981-10-22 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS56159178A (en) * | 1980-05-14 | 1981-12-08 | Ricoh Co Ltd | Thermal head |
-
1984
- 1984-09-18 JP JP59195422A patent/JPS6172560A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103982A (en) * | 1979-02-01 | 1980-08-08 | Matsushita Electric Ind Co Ltd | Thermal printing head and preparation therefor |
| JPS56135081A (en) * | 1980-03-26 | 1981-10-22 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS56159178A (en) * | 1980-05-14 | 1981-12-08 | Ricoh Co Ltd | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6172560A (en) | 1986-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |