JPS61274963A - Preparation of head for current conduction transfer recording - Google Patents

Abstract

PURPOSE:To form a head equipped with electrodes having high accuracy and excellent abrasion resistance and heat resistance, by boring windows through a ceramic substrate only at the positions of electrode wiring patterns after the surface of said substrate was masked by a photoresist and applying a metal to the interior of each window to form electrode wiring and subsequently applying a metal only to the contact part on each electrode wiring in the same way. CONSTITUTION:The surface of a substrate 1 is masked by a photoresist 3 and windows are bored through the substrate 1 only at the positions of electrode wiring patterns. A metal is applied to the interiors of the windows by electroless plating to form electrode wirings 2. The surface of the substrate 1 is again masked by the photoresist 7 and windows 8 are bored at electrode forming scheduled positions on the electrode wirings 2 and a metal is applied to the interiors of the windows 8 by electroless plating. By this method, electrodes 6 are formed on the electrode wirings 2. Thereafter, the photoresist 7 is removed and a proper protective layer is allowed to cover the surface.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a method of manufacturing a current transfer recording head.

(Prior Art) As is well known, in electrical transfer recording, a recording medium and a current transfer film are placed one on top of the other, and the current transfer film is energized to melt and transfer ink onto the recording medium. This is what I did. The details are explained with reference to Fig. 7.
is a film for electrical transfer, and has a resistive layer 12. Conductor layer 13.
15 is a recording medium such as paper.

The energization transfer film 11 and the paper 15 are stacked, and a pulse voltage is applied from a pulse power source 18 from a recording head 16 toward a return electrode 17 via a conductive layer 13 of the film 11. Then, the resistance layer 12 under the electrode of the head 16
generates heat, which melts the underlying ink layer 14 and transfers it to the paper 15.

Conventionally, this type of electrode is usually manufactured by arranging a large number of wires and fixing them with resin or the like (see Japanese Patent Laid-Open No. 58-63472).

However, such a structure has disadvantages in that the wire has poor abrasion resistance and poor manufacturing precision, and the resin is sensitive to heat, so it lacks heat resistance and is easily deformed.

(Problems to be solved by the invention) This invention achieves high precision and wear resistance using a simple method.
The purpose is to manufacture a head equipped with electrodes with excellent heat resistance.

(Means for Solving the Problem) This invention masks the surface of a ceramic substrate with photoresist, opens a window only for the electrode wiring pattern, and attaches metal to the window by plating to form the electrode wiring. After masking the surface of the substrate with photoresist again, a window is opened only in the contact area on the electrode wiring, metal is applied by plating in this window, and this metal is used as an electrode for current transfer recording. It is characterized by being designed to be used as

(Example) An example of the present invention will be described with reference to the drawings. 1 is a ceramic substrate, which is used as the main body of the rad. First, electrode wiring 2 is formed on the surface of this substrate 1. To do this, mask the surface of the substrate 1 with a photoresist 3,
A window is opened only for the electrode wiring pattern. 4 indicates the window (see Figure 1).

Then, metal is applied inside this window 4 by electroless plating. As a result, electrode wiring 2 is formed (Fig. 2,
(See FIG. 5), and examples of the metal of this electrode wiring 2 include Cu, Ni, and Ni-P.

N1-B etc. can be used. The thickness of this electrode wiring 2 is, for example, about 5 μm.

Next, an electrode 6 for recording electricity is formed on a part of the surface of the electrode wiring 2. For this purpose, the surface of the substrate 1 is again masked with a photoresist 7, and the electrode 6 is formed on a part of the surface of the electrode wiring 2.
A window 8 is opened at the position where the electrode is to be formed (see FIGS. 3 and 6).

Then, metal is applied inside this window 8 by electroless plating. As a result, the electrode 6 is formed on the electrode wiring 2 (see FIG. 4).

The metal of the electrode 6 is a metal with high hardness, such as Ni or N.
1-P, N1-B, etc. are used. The thickness of this electrode 6 is, for example, about 40 μm. Thereafter, the photoresist may be removed and one surface coated with a suitable protective layer.

In order to increase the hardness of the electrode 6 and improve its wear resistance, it is recommended to heat treat it. For example, when N1-P has a Vickers hardness of 600 and is heat treated at 400°C, it has been confirmed that the Vickers hardness increases to 1100. It is being

When forming the electrodes 6, there is a method of depositing metal thickly over the entire surface of the substrate and then etching it, but this method has the inconvenience of not being able to reduce the distance between the electrodes 6.

On the other hand, when electroless plating is used as in the present invention, the electrode spacing can be formed sufficiently narrow, which is extremely convenient.

(Effects of the Invention) As detailed above, according to the present invention, since the electrode for current recording is formed by electrolytic plating of a highly hard metal,
In addition to obtaining wear-resistant electrodes, since they are formed using the photoresist method, they can be manufactured with high precision.Furthermore, since the electrodes are formed in a raised manner, they can be easily and reliably contacted with the film for electrical transfer. This brings about the effect that energization recording can be facilitated.

[Brief explanation of the drawing]

1 to 4 are cross-sectional views showing the implementation steps of this invention,
FIGS. 5 and 6 are plan views in each step, and FIG. 7 is a sectional view showing an energization recording mode. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Electrode wiring, 3, 7... Photoresist, 4, 8... Window, 6... Electrode,

Claims (1)

[Claims] After masking the surface of the ceramic substrate with photoresist, only the electrode wiring pattern is opened, metal is applied by plating to form electrode wiring, and then the surface of the substrate is masked with photoresist again. , a window is opened in the upper part of the electrode wiring at the position where the electrode for current transfer is planned to be formed, and a hard metal is applied by plating in a heaping manner on top of the electrode wiring, and the electrode for current transfer is formed using the metal. A method of manufacturing a current transfer recording head formed by forming the head.