JPH0379450U - - Google Patents

Info

Publication number
JPH0379450U
JPH0379450U JP1989141354U JP14135489U JPH0379450U JP H0379450 U JPH0379450 U JP H0379450U JP 1989141354 U JP1989141354 U JP 1989141354U JP 14135489 U JP14135489 U JP 14135489U JP H0379450 U JPH0379450 U JP H0379450U
Authority
JP
Japan
Prior art keywords
injection nozzle
heat radiation
radiation surface
electronic component
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989141354U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989141354U priority Critical patent/JPH0379450U/ja
Publication of JPH0379450U publication Critical patent/JPH0379450U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は、本願考案の実施例に係る電子部品の
液冷却装置の構成を示す断面図、第２図は、従来
の電子部品液冷却装置の構成を示す断面図である
。 １……プリント基板、２……ピンコネクタ、３
……ＬＳＩチツプ、３ｂ……放熱面、４……冷却
液流下路、５……ジエツトプレート、６……冷却
液噴射ノズル口、７……冷却液供給室、８……可
撓性プレート、９……伝熱プレート、１０……冷
却液タンク、１１……熱交換器。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱面３ａを有する電子部品３と、該電子部品
    ３の上記放熱面３ａ方向に冷却液ＣＷを噴射する
    冷却液噴射ノズル６とを備えてなる電子部品の液
    冷却装置において、上記電子部品３の放熱面３ａ
    と冷却液噴射ノズル６の間に可撓性プレート８を
    介装するとともに該可撓性プレート８の上記電子
    部品３の放熱面３ａに対応する冷却液噴射ノズル
    ６側面に熱伝導性の良い伝熱プレート９を一体化
    したことを特徴とする電子部品の液冷却装置。
JP1989141354U 1989-12-05 1989-12-05 Pending JPH0379450U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989141354U JPH0379450U (ja) 1989-12-05 1989-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989141354U JPH0379450U (ja) 1989-12-05 1989-12-05

Publications (1)

Publication Number Publication Date
JPH0379450U true JPH0379450U (ja) 1991-08-13

Family

ID=31688258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989141354U Pending JPH0379450U (ja) 1989-12-05 1989-12-05

Country Status (1)

Country Link
JP (1) JPH0379450U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013121237A (ja) * 2011-12-07 2013-06-17 Denso Corp 電気自動車の電力機器冷却装置
JP2019513296A (ja) * 2016-06-16 2019-05-23 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． ハイパワー部品用の作動媒体接触式冷却システム及びその作動方法
JP2019153240A (ja) * 2018-03-06 2019-09-12 株式会社Ｉｄｃフロンティア 冷却装置、データセンター、及び冷却方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013121237A (ja) * 2011-12-07 2013-06-17 Denso Corp 電気自動車の電力機器冷却装置
JP2019513296A (ja) * 2016-06-16 2019-05-23 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． ハイパワー部品用の作動媒体接触式冷却システム及びその作動方法
JP2019153240A (ja) * 2018-03-06 2019-09-12 株式会社Ｉｄｃフロンティア 冷却装置、データセンター、及び冷却方法

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