JPH0378784B2 - - Google Patents

Info

Publication number
JPH0378784B2
JPH0378784B2 JP10855788A JP10855788A JPH0378784B2 JP H0378784 B2 JPH0378784 B2 JP H0378784B2 JP 10855788 A JP10855788 A JP 10855788A JP 10855788 A JP10855788 A JP 10855788A JP H0378784 B2 JPH0378784 B2 JP H0378784B2
Authority
JP
Japan
Prior art keywords
electrode
cap
contact
welding
contact area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10855788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01278753A (ja
Inventor
Susumu Aono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP10855788A priority Critical patent/JPH01278753A/ja
Publication of JPH01278753A publication Critical patent/JPH01278753A/ja
Publication of JPH0378784B2 publication Critical patent/JPH0378784B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP10855788A 1988-04-30 1988-04-30 半導体装置の気密封止方法 Granted JPH01278753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10855788A JPH01278753A (ja) 1988-04-30 1988-04-30 半導体装置の気密封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10855788A JPH01278753A (ja) 1988-04-30 1988-04-30 半導体装置の気密封止方法

Publications (2)

Publication Number Publication Date
JPH01278753A JPH01278753A (ja) 1989-11-09
JPH0378784B2 true JPH0378784B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-12-16

Family

ID=14487848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10855788A Granted JPH01278753A (ja) 1988-04-30 1988-04-30 半導体装置の気密封止方法

Country Status (1)

Country Link
JP (1) JPH01278753A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH01278753A (ja) 1989-11-09

Similar Documents

Publication Publication Date Title
JPH0378784B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH08212987A (ja) 二次電池容器およびその製法
JPH0378783B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3109261B2 (ja) レーザ溶接ユニット
JPH0221907B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP0661738B1 (en) Cavity down mounting seam welding ceramic package for semiconductor device and method of seam welding
JP2003001428A (ja) パッケージ封止におけるリッドの仮付け装置
JP2638413B2 (ja) 抵抗溶接方法
JPH06312263A (ja) アークセンサー
JPH09108843A (ja) タンクのシーム溶接方法
JP3678778B2 (ja) タブ端子の位置制御装置
JP2745951B2 (ja) 片面溶接における裏ビード制御方法
JPS6250227B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0982440A (ja) スリップリング
JPS61114560A (ja) 半導体装置
JPH0547699Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS59145545A (ja) 半導体装置用容器の気密封止法
JPH02122714A (ja) 圧電振動子
JP3189618B2 (ja) 揺動高速回転アーク溶接方法
JPS5982752A (ja) シ−ムウエルド装置
JPS6052581B2 (ja) 半導体装置用容器の気密封止方法
JPH0645469A (ja) ハンダ付スペーサーの製造装置
JPH0611352U (ja) シーム接合の仮止め用電極装置
JPS606280A (ja) シ−ム熔接方法
JPS6310545A (ja) 半導体装置の気密封止方法

Legal Events

Date Code Title Description
S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081216

Year of fee payment: 17

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081216

Year of fee payment: 17