JPH0376783B2 - - Google Patents

Info

Publication number
JPH0376783B2
JPH0376783B2 JP60015709A JP1570985A JPH0376783B2 JP H0376783 B2 JPH0376783 B2 JP H0376783B2 JP 60015709 A JP60015709 A JP 60015709A JP 1570985 A JP1570985 A JP 1570985A JP H0376783 B2 JPH0376783 B2 JP H0376783B2
Authority
JP
Japan
Prior art keywords
mold
lead frame
resin
parts
optical sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60015709A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61174729A (ja
Inventor
Kunio Sato
Juji Hashiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1570985A priority Critical patent/JPS61174729A/ja
Publication of JPS61174729A publication Critical patent/JPS61174729A/ja
Publication of JPH0376783B2 publication Critical patent/JPH0376783B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1570985A 1985-01-30 1985-01-30 樹脂封止形半導体装置の封止状態検出方法 Granted JPS61174729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1570985A JPS61174729A (ja) 1985-01-30 1985-01-30 樹脂封止形半導体装置の封止状態検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1570985A JPS61174729A (ja) 1985-01-30 1985-01-30 樹脂封止形半導体装置の封止状態検出方法

Publications (2)

Publication Number Publication Date
JPS61174729A JPS61174729A (ja) 1986-08-06
JPH0376783B2 true JPH0376783B2 (ar) 1991-12-06

Family

ID=11896293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1570985A Granted JPS61174729A (ja) 1985-01-30 1985-01-30 樹脂封止形半導体装置の封止状態検出方法

Country Status (1)

Country Link
JP (1) JPS61174729A (ar)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105550A (ja) * 1988-10-14 1990-04-18 Nec Corp 半導体装置の製造装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59228727A (ja) * 1983-06-10 1984-12-22 Hitachi Ltd 検査装置
JPS6250055U (ar) * 1985-09-19 1987-03-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59228727A (ja) * 1983-06-10 1984-12-22 Hitachi Ltd 検査装置
JPS6250055U (ar) * 1985-09-19 1987-03-27

Also Published As

Publication number Publication date
JPS61174729A (ja) 1986-08-06

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