JPH0376026B2 - - Google Patents

Info

Publication number
JPH0376026B2
JPH0376026B2 JP57057971A JP5797182A JPH0376026B2 JP H0376026 B2 JPH0376026 B2 JP H0376026B2 JP 57057971 A JP57057971 A JP 57057971A JP 5797182 A JP5797182 A JP 5797182A JP H0376026 B2 JPH0376026 B2 JP H0376026B2
Authority
JP
Japan
Prior art keywords
lid
case
terminals
metal base
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57057971A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57177547A (en
Inventor
Koryumoo Yoran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of JPS57177547A publication Critical patent/JPS57177547A/ja
Publication of JPH0376026B2 publication Critical patent/JPH0376026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W74/114—
    • H10W76/134—
    • H10W72/536—
    • H10W72/5473—
    • H10W72/5475—
    • H10W74/00—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
JP57057971A 1981-04-08 1982-04-07 Case for middle output semiconductor element and method of producing same Granted JPS57177547A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8107035A FR2503932A1 (fr) 1981-04-08 1981-04-08 Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication

Publications (2)

Publication Number Publication Date
JPS57177547A JPS57177547A (en) 1982-11-01
JPH0376026B2 true JPH0376026B2 (enExample) 1991-12-04

Family

ID=9257153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57057971A Granted JPS57177547A (en) 1981-04-08 1982-04-07 Case for middle output semiconductor element and method of producing same

Country Status (5)

Country Link
US (1) US4510677A (enExample)
EP (1) EP0063070B1 (enExample)
JP (1) JPS57177547A (enExample)
DE (1) DE3260696D1 (enExample)
FR (1) FR2503932A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589195A (en) * 1981-02-27 1986-05-20 Motorola, Inc. Method of fabricating a high current package with multi-level leads
FR2553231B1 (fr) * 1983-10-10 1988-07-08 Thomson Csf Commutateur double pour onduleurs, encapsule en boitier a broches exterieures planes
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
JPS60157243A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp 半導体装置
JPS60239051A (ja) * 1984-05-11 1985-11-27 Mitsubishi Electric Corp 半導体装置
JPS62142856U (enExample) * 1986-02-28 1987-09-09
US4792880A (en) * 1986-10-03 1988-12-20 Westinghouse Electric Corp. Terminal module
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
USD364383S (en) 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US5541453A (en) * 1995-04-14 1996-07-30 Abb Semiconductors, Ltd. Power semiconductor module
JPH11317326A (ja) * 1998-03-06 1999-11-16 Rohm Co Ltd 電子部品
US6817905B2 (en) * 2000-06-20 2004-11-16 Medtronic, Inc. Connector assembly for an implantable medical device and process for making
US20070087637A1 (en) * 2004-10-15 2007-04-19 Zart Bryan J Connector assembly for an implantable medical device and process for making
JP3533159B2 (ja) * 2000-08-31 2004-05-31 Ｎｅｃ化合物デバイス株式会社 半導体装置及びその製造方法
DE20020392U1 (de) * 2000-12-01 2001-04-26 TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell Gehäuse für ein elektronisches Überwachungsgerät an Fahrzeugteilen
DE10100882A1 (de) * 2001-01-11 2002-08-01 Bosch Gmbh Robert Verfahren zur Montage eines Halbleiterbauelementes und Halbleiterbauelement
KR20130130770A (ko) * 2010-12-20 2013-12-02 디오데스 제텍스 세미컨덕터즈 리미티드 향상된 스위칭 속도 및 향상된 크로스-오버 제어 및 증가된 출력 전압을 갖는 상보적 달링턴 이미터 팔로워

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1161488A (en) * 1965-11-15 1969-08-13 Lucas Industries Ltd Semiconductor Devices
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
US4386463A (en) * 1981-10-05 1983-06-07 Mostek Corporation Lead frame embedding fixture

Also Published As

Publication number Publication date
DE3260696D1 (en) 1984-10-18
EP0063070B1 (fr) 1984-09-12
US4510677A (en) 1985-04-16
FR2503932A1 (fr) 1982-10-15
JPS57177547A (en) 1982-11-01
FR2503932B1 (enExample) 1983-06-10
EP0063070A1 (fr) 1982-10-20

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