FR2503932A1 - Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication - Google Patents

Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication Download PDF

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Publication number
FR2503932A1
FR2503932A1 FR8107035A FR8107035A FR2503932A1 FR 2503932 A1 FR2503932 A1 FR 2503932A1 FR 8107035 A FR8107035 A FR 8107035A FR 8107035 A FR8107035 A FR 8107035A FR 2503932 A1 FR2503932 A1 FR 2503932A1
Authority
FR
France
Prior art keywords
base
block
sides
parallel
legs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8107035A
Other languages
English (en)
French (fr)
Other versions
FR2503932B1 (enExample
Inventor
Yoland Collumeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8107035A priority Critical patent/FR2503932A1/fr
Priority to DE8282400558T priority patent/DE3260696D1/de
Priority to EP82400558A priority patent/EP0063070B1/fr
Priority to US06/364,207 priority patent/US4510677A/en
Priority to JP57057971A priority patent/JPS57177547A/ja
Publication of FR2503932A1 publication Critical patent/FR2503932A1/fr
Application granted granted Critical
Publication of FR2503932B1 publication Critical patent/FR2503932B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
FR8107035A 1981-04-08 1981-04-08 Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication Granted FR2503932A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8107035A FR2503932A1 (fr) 1981-04-08 1981-04-08 Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication
DE8282400558T DE3260696D1 (en) 1981-04-08 1982-03-26 Packages with flat terminals for medium-power semiconductor components, and method for their manufacture
EP82400558A EP0063070B1 (fr) 1981-04-08 1982-03-26 Boîtiers à cosses plates pour composants semiconducteurs de moyenne puissance, et procédé de fabrication
US06/364,207 US4510677A (en) 1981-04-08 1982-04-01 Cases with flat terminal lugs for medium power semi-conductor components and a process for manufacturing same
JP57057971A JPS57177547A (en) 1981-04-08 1982-04-07 Case for middle output semiconductor element and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8107035A FR2503932A1 (fr) 1981-04-08 1981-04-08 Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication

Publications (2)

Publication Number Publication Date
FR2503932A1 true FR2503932A1 (fr) 1982-10-15
FR2503932B1 FR2503932B1 (enExample) 1983-06-10

Family

ID=9257153

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8107035A Granted FR2503932A1 (fr) 1981-04-08 1981-04-08 Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication

Country Status (5)

Country Link
US (1) US4510677A (enExample)
EP (1) EP0063070B1 (enExample)
JP (1) JPS57177547A (enExample)
DE (1) DE3260696D1 (enExample)
FR (1) FR2503932A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19529785A1 (de) * 1995-04-14 1996-10-17 Abb Management Ag Leistungshalbleitermodul

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589195A (en) * 1981-02-27 1986-05-20 Motorola, Inc. Method of fabricating a high current package with multi-level leads
FR2553231B1 (fr) * 1983-10-10 1988-07-08 Thomson Csf Commutateur double pour onduleurs, encapsule en boitier a broches exterieures planes
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
JPS60157243A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp 半導体装置
JPS60239051A (ja) * 1984-05-11 1985-11-27 Mitsubishi Electric Corp 半導体装置
JPS62142856U (enExample) * 1986-02-28 1987-09-09
US4792880A (en) * 1986-10-03 1988-12-20 Westinghouse Electric Corp. Terminal module
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
USD364383S (en) 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
JPH11317326A (ja) * 1998-03-06 1999-11-16 Rohm Co Ltd 電子部品
US20070087637A1 (en) * 2004-10-15 2007-04-19 Zart Bryan J Connector assembly for an implantable medical device and process for making
US6817905B2 (en) * 2000-06-20 2004-11-16 Medtronic, Inc. Connector assembly for an implantable medical device and process for making
JP3533159B2 (ja) * 2000-08-31 2004-05-31 Ｎｅｃ化合物デバイス株式会社 半導体装置及びその製造方法
DE20020392U1 (de) * 2000-12-01 2001-04-26 TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell Gehäuse für ein elektronisches Überwachungsgerät an Fahrzeugteilen
DE10100882A1 (de) * 2001-01-11 2002-08-01 Bosch Gmbh Robert Verfahren zur Montage eines Halbleiterbauelementes und Halbleiterbauelement
EP2656387B1 (en) * 2010-12-20 2014-07-30 Diodes Zetex Semiconductors Limited Complementary darlington emitter follower with improved switching speed and improved cross-over control and increased output voltage

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1161488A (en) * 1965-11-15 1969-08-13 Lucas Industries Ltd Semiconductor Devices
FR2188305A1 (enExample) * 1972-06-03 1974-01-18 Ates Componenti Elettron

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
US4386463A (en) * 1981-10-05 1983-06-07 Mostek Corporation Lead frame embedding fixture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1161488A (en) * 1965-11-15 1969-08-13 Lucas Industries Ltd Semiconductor Devices
FR2188305A1 (enExample) * 1972-06-03 1974-01-18 Ates Componenti Elettron

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/80 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19529785A1 (de) * 1995-04-14 1996-10-17 Abb Management Ag Leistungshalbleitermodul

Also Published As

Publication number Publication date
DE3260696D1 (en) 1984-10-18
JPS57177547A (en) 1982-11-01
EP0063070B1 (fr) 1984-09-12
US4510677A (en) 1985-04-16
JPH0376026B2 (enExample) 1991-12-04
EP0063070A1 (fr) 1982-10-20
FR2503932B1 (enExample) 1983-06-10

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