JPH0374097U - - Google Patents

Info

Publication number
JPH0374097U
JPH0374097U JP13532389U JP13532389U JPH0374097U JP H0374097 U JPH0374097 U JP H0374097U JP 13532389 U JP13532389 U JP 13532389U JP 13532389 U JP13532389 U JP 13532389U JP H0374097 U JPH0374097 U JP H0374097U
Authority
JP
Japan
Prior art keywords
heat
sensitive
semiconductor element
sleeve
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13532389U
Other languages
English (en)
Other versions
JP2554207Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989135323U priority Critical patent/JP2554207Y2/ja
Publication of JPH0374097U publication Critical patent/JPH0374097U/ja
Application granted granted Critical
Publication of JP2554207Y2 publication Critical patent/JP2554207Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Fire-Detection Mechanisms (AREA)

Description

【図面の簡単な説明】
第1図は本考案要部の実施例の断面図、第2図
は本考案実施例の断面図、第3図はその下面図、
第4図は側面図、第5図は従来の半導体式熱感知
器の一例を示す模式図、第6図は従来の感熱半導
体素子の一例を示す断面図である。 11……本体、21……取付台、22……環状
壁、23……凹部、24,24a……小孔、31
……プリント基板、32,32a……小孔、41
……サーミスタ、42……感熱素子、43……ガ
ラスコーテイング、44,44a……リード線、
45,45a……スリーブ、47……充填剤、5
1……プロテクタ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 感熱半導体素子を本体から露出させて取付
    け、前記感熱半導体素子の温度特性を利用して火
    災の発生を検知する半導体式熱感知器において、 前記感熱半導体素子のリード線の先端部を残し
    て該リード線を樹脂製のスリーブで被覆し、該ス
    リーブの両端部を樹脂等で封止したことを特徴と
    する半導体式熱感知器。 (2) 感熱半導体素子の感熱部と前記スリーブの
    感熱部側とを熱伝導性の良好な樹脂で一体的にコ
    ーテイングしてなる請求項(1)記載の半導体式熱
    感知器。
JP1989135323U 1989-11-24 1989-11-24 半導体式熱感知器 Expired - Fee Related JP2554207Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989135323U JP2554207Y2 (ja) 1989-11-24 1989-11-24 半導体式熱感知器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989135323U JP2554207Y2 (ja) 1989-11-24 1989-11-24 半導体式熱感知器

Publications (2)

Publication Number Publication Date
JPH0374097U true JPH0374097U (ja) 1991-07-25
JP2554207Y2 JP2554207Y2 (ja) 1997-11-17

Family

ID=31682597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989135323U Expired - Fee Related JP2554207Y2 (ja) 1989-11-24 1989-11-24 半導体式熱感知器

Country Status (1)

Country Link
JP (1) JP2554207Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002189010A (ja) * 2000-12-21 2002-07-05 Saginomiya Seisakusho Inc 抵抗率計の電極
JP2016115063A (ja) * 2014-12-12 2016-06-23 新コスモス電機株式会社 光電式煙感知器
JP2019149063A (ja) * 2018-02-28 2019-09-05 能美防災株式会社 熱感知器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155231A (ja) * 1984-01-24 1985-08-15 Toshiba Corp 芳香族ポリエステルアミド共重合体の製造方法
JPS61170045U (ja) * 1985-04-12 1986-10-22
JPS6262936U (ja) * 1985-10-09 1987-04-18

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155231A (ja) * 1984-01-24 1985-08-15 Toshiba Corp 芳香族ポリエステルアミド共重合体の製造方法
JPS61170045U (ja) * 1985-04-12 1986-10-22
JPS6262936U (ja) * 1985-10-09 1987-04-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002189010A (ja) * 2000-12-21 2002-07-05 Saginomiya Seisakusho Inc 抵抗率計の電極
JP4570242B2 (ja) * 2000-12-21 2010-10-27 株式会社鷺宮製作所 抵抗率計の電極
JP2016115063A (ja) * 2014-12-12 2016-06-23 新コスモス電機株式会社 光電式煙感知器
JP2019149063A (ja) * 2018-02-28 2019-09-05 能美防災株式会社 熱感知器

Also Published As

Publication number Publication date
JP2554207Y2 (ja) 1997-11-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees