JPH0336974U - - Google Patents
Info
- Publication number
- JPH0336974U JPH0336974U JP9874389U JP9874389U JPH0336974U JP H0336974 U JPH0336974 U JP H0336974U JP 9874389 U JP9874389 U JP 9874389U JP 9874389 U JP9874389 U JP 9874389U JP H0336974 U JPH0336974 U JP H0336974U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive layer
- layer formed
- constant temperature
- temperature oven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第1図はこの考案の実施例の一部を示す断面図
、第2図はその他の実施例の一部を示す断面図、
第3図は従来の基板の温度保護構造を示す断面図
である。
、第2図はその他の実施例の一部を示す断面図、
第3図は従来の基板の温度保護構造を示す断面図
である。
Claims (1)
- 【実用新案登録請求の範囲】 恒温槽の開口をほヾ塞ぐように設けられ、電子
部品が実装された基板において、 上記基板に形成された良熱伝導層と、 その良熱伝導層と熱的に接続されて上記基板に
取り付けられ、上記恒温槽の温度による影響を抑
圧する熱を上記良熱伝導層へ供給する発熱体また
は冷却体と、 を具備することを特徴とする電子部品実装基板の
温度保護構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9874389U JPH0712944Y2 (ja) | 1989-08-24 | 1989-08-24 | 電子部品実装基板の温度保護構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9874389U JPH0712944Y2 (ja) | 1989-08-24 | 1989-08-24 | 電子部品実装基板の温度保護構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0336974U true JPH0336974U (ja) | 1991-04-10 |
JPH0712944Y2 JPH0712944Y2 (ja) | 1995-03-29 |
Family
ID=31647828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9874389U Expired - Lifetime JPH0712944Y2 (ja) | 1989-08-24 | 1989-08-24 | 電子部品実装基板の温度保護構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0712944Y2 (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012099557A (ja) * | 2010-10-29 | 2012-05-24 | Aisin Aw Co Ltd | 基板の結露防止構造 |
JP2021530713A (ja) * | 2018-07-24 | 2021-11-11 | マジック リープ, インコーポレイテッドMagic Leap, Inc. | 移動検出デバイスの温度依存較正 |
US11737832B2 (en) | 2019-11-15 | 2023-08-29 | Magic Leap, Inc. | Viewing system for use in a surgical environment |
US11756335B2 (en) | 2015-02-26 | 2023-09-12 | Magic Leap, Inc. | Apparatus for a near-eye display |
US11762222B2 (en) | 2017-12-20 | 2023-09-19 | Magic Leap, Inc. | Insert for augmented reality viewing device |
US11776509B2 (en) | 2018-03-15 | 2023-10-03 | Magic Leap, Inc. | Image correction due to deformation of components of a viewing device |
US11790554B2 (en) | 2016-12-29 | 2023-10-17 | Magic Leap, Inc. | Systems and methods for augmented reality |
US11856479B2 (en) | 2018-07-03 | 2023-12-26 | Magic Leap, Inc. | Systems and methods for virtual and augmented reality along a route with markers |
US11874468B2 (en) | 2016-12-30 | 2024-01-16 | Magic Leap, Inc. | Polychromatic light out-coupling apparatus, near-eye displays comprising the same, and method of out-coupling polychromatic light |
US11885871B2 (en) | 2018-05-31 | 2024-01-30 | Magic Leap, Inc. | Radar head pose localization |
US11927759B2 (en) | 2017-07-26 | 2024-03-12 | Magic Leap, Inc. | Exit pupil expander |
US11953653B2 (en) | 2017-12-10 | 2024-04-09 | Magic Leap, Inc. | Anti-reflective coatings on optical waveguides |
US11960661B2 (en) | 2018-08-03 | 2024-04-16 | Magic Leap, Inc. | Unfused pose-based drift correction of a fused pose of a totem in a user interaction system |
US12001013B2 (en) | 2023-01-09 | 2024-06-04 | Magic Leap, Inc. | Pixel intensity modulation using modifying gain values |
-
1989
- 1989-08-24 JP JP9874389U patent/JPH0712944Y2/ja not_active Expired - Lifetime
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012099557A (ja) * | 2010-10-29 | 2012-05-24 | Aisin Aw Co Ltd | 基板の結露防止構造 |
US11756335B2 (en) | 2015-02-26 | 2023-09-12 | Magic Leap, Inc. | Apparatus for a near-eye display |
US11790554B2 (en) | 2016-12-29 | 2023-10-17 | Magic Leap, Inc. | Systems and methods for augmented reality |
US11874468B2 (en) | 2016-12-30 | 2024-01-16 | Magic Leap, Inc. | Polychromatic light out-coupling apparatus, near-eye displays comprising the same, and method of out-coupling polychromatic light |
US11927759B2 (en) | 2017-07-26 | 2024-03-12 | Magic Leap, Inc. | Exit pupil expander |
US11953653B2 (en) | 2017-12-10 | 2024-04-09 | Magic Leap, Inc. | Anti-reflective coatings on optical waveguides |
US11762222B2 (en) | 2017-12-20 | 2023-09-19 | Magic Leap, Inc. | Insert for augmented reality viewing device |
US11776509B2 (en) | 2018-03-15 | 2023-10-03 | Magic Leap, Inc. | Image correction due to deformation of components of a viewing device |
US11908434B2 (en) | 2018-03-15 | 2024-02-20 | Magic Leap, Inc. | Image correction due to deformation of components of a viewing device |
US11885871B2 (en) | 2018-05-31 | 2024-01-30 | Magic Leap, Inc. | Radar head pose localization |
US11856479B2 (en) | 2018-07-03 | 2023-12-26 | Magic Leap, Inc. | Systems and methods for virtual and augmented reality along a route with markers |
JP2021530713A (ja) * | 2018-07-24 | 2021-11-11 | マジック リープ, インコーポレイテッドMagic Leap, Inc. | 移動検出デバイスの温度依存較正 |
US11960661B2 (en) | 2018-08-03 | 2024-04-16 | Magic Leap, Inc. | Unfused pose-based drift correction of a fused pose of a totem in a user interaction system |
US11737832B2 (en) | 2019-11-15 | 2023-08-29 | Magic Leap, Inc. | Viewing system for use in a surgical environment |
US12001013B2 (en) | 2023-01-09 | 2024-06-04 | Magic Leap, Inc. | Pixel intensity modulation using modifying gain values |
Also Published As
Publication number | Publication date |
---|---|
JPH0712944Y2 (ja) | 1995-03-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |