JPH0336974U - - Google Patents

Info

Publication number
JPH0336974U
JPH0336974U JP9874389U JP9874389U JPH0336974U JP H0336974 U JPH0336974 U JP H0336974U JP 9874389 U JP9874389 U JP 9874389U JP 9874389 U JP9874389 U JP 9874389U JP H0336974 U JPH0336974 U JP H0336974U
Authority
JP
Japan
Prior art keywords
substrate
conductive layer
layer formed
constant temperature
temperature oven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9874389U
Other languages
English (en)
Other versions
JPH0712944Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9874389U priority Critical patent/JPH0712944Y2/ja
Publication of JPH0336974U publication Critical patent/JPH0336974U/ja
Application granted granted Critical
Publication of JPH0712944Y2 publication Critical patent/JPH0712944Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の実施例の一部を示す断面図
、第2図はその他の実施例の一部を示す断面図、
第3図は従来の基板の温度保護構造を示す断面図
である。

Claims (1)

  1. 【実用新案登録請求の範囲】 恒温槽の開口をほヾ塞ぐように設けられ、電子
    部品が実装された基板において、 上記基板に形成された良熱伝導層と、 その良熱伝導層と熱的に接続されて上記基板に
    取り付けられ、上記恒温槽の温度による影響を抑
    圧する熱を上記良熱伝導層へ供給する発熱体また
    は冷却体と、 を具備することを特徴とする電子部品実装基板の
    温度保護構造。
JP9874389U 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造 Expired - Lifetime JPH0712944Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9874389U JPH0712944Y2 (ja) 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9874389U JPH0712944Y2 (ja) 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造

Publications (2)

Publication Number Publication Date
JPH0336974U true JPH0336974U (ja) 1991-04-10
JPH0712944Y2 JPH0712944Y2 (ja) 1995-03-29

Family

ID=31647828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9874389U Expired - Lifetime JPH0712944Y2 (ja) 1989-08-24 1989-08-24 電子部品実装基板の温度保護構造

Country Status (1)

Country Link
JP (1) JPH0712944Y2 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012099557A (ja) * 2010-10-29 2012-05-24 Aisin Aw Co Ltd 基板の結露防止構造
JP2021530713A (ja) * 2018-07-24 2021-11-11 マジック リープ, インコーポレイテッドMagic Leap, Inc. 移動検出デバイスの温度依存較正
US11737832B2 (en) 2019-11-15 2023-08-29 Magic Leap, Inc. Viewing system for use in a surgical environment
US11756335B2 (en) 2015-02-26 2023-09-12 Magic Leap, Inc. Apparatus for a near-eye display
US11762222B2 (en) 2017-12-20 2023-09-19 Magic Leap, Inc. Insert for augmented reality viewing device
US11776509B2 (en) 2018-03-15 2023-10-03 Magic Leap, Inc. Image correction due to deformation of components of a viewing device
US11790554B2 (en) 2016-12-29 2023-10-17 Magic Leap, Inc. Systems and methods for augmented reality
US11856479B2 (en) 2018-07-03 2023-12-26 Magic Leap, Inc. Systems and methods for virtual and augmented reality along a route with markers
US11874468B2 (en) 2016-12-30 2024-01-16 Magic Leap, Inc. Polychromatic light out-coupling apparatus, near-eye displays comprising the same, and method of out-coupling polychromatic light
US11885871B2 (en) 2018-05-31 2024-01-30 Magic Leap, Inc. Radar head pose localization
US11927759B2 (en) 2017-07-26 2024-03-12 Magic Leap, Inc. Exit pupil expander
US11953653B2 (en) 2017-12-10 2024-04-09 Magic Leap, Inc. Anti-reflective coatings on optical waveguides
US11960661B2 (en) 2018-08-03 2024-04-16 Magic Leap, Inc. Unfused pose-based drift correction of a fused pose of a totem in a user interaction system
US12001013B2 (en) 2023-01-09 2024-06-04 Magic Leap, Inc. Pixel intensity modulation using modifying gain values

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012099557A (ja) * 2010-10-29 2012-05-24 Aisin Aw Co Ltd 基板の結露防止構造
US11756335B2 (en) 2015-02-26 2023-09-12 Magic Leap, Inc. Apparatus for a near-eye display
US11790554B2 (en) 2016-12-29 2023-10-17 Magic Leap, Inc. Systems and methods for augmented reality
US11874468B2 (en) 2016-12-30 2024-01-16 Magic Leap, Inc. Polychromatic light out-coupling apparatus, near-eye displays comprising the same, and method of out-coupling polychromatic light
US11927759B2 (en) 2017-07-26 2024-03-12 Magic Leap, Inc. Exit pupil expander
US11953653B2 (en) 2017-12-10 2024-04-09 Magic Leap, Inc. Anti-reflective coatings on optical waveguides
US11762222B2 (en) 2017-12-20 2023-09-19 Magic Leap, Inc. Insert for augmented reality viewing device
US11776509B2 (en) 2018-03-15 2023-10-03 Magic Leap, Inc. Image correction due to deformation of components of a viewing device
US11908434B2 (en) 2018-03-15 2024-02-20 Magic Leap, Inc. Image correction due to deformation of components of a viewing device
US11885871B2 (en) 2018-05-31 2024-01-30 Magic Leap, Inc. Radar head pose localization
US11856479B2 (en) 2018-07-03 2023-12-26 Magic Leap, Inc. Systems and methods for virtual and augmented reality along a route with markers
JP2021530713A (ja) * 2018-07-24 2021-11-11 マジック リープ, インコーポレイテッドMagic Leap, Inc. 移動検出デバイスの温度依存較正
US11960661B2 (en) 2018-08-03 2024-04-16 Magic Leap, Inc. Unfused pose-based drift correction of a fused pose of a totem in a user interaction system
US11737832B2 (en) 2019-11-15 2023-08-29 Magic Leap, Inc. Viewing system for use in a surgical environment
US12001013B2 (en) 2023-01-09 2024-06-04 Magic Leap, Inc. Pixel intensity modulation using modifying gain values

Also Published As

Publication number Publication date
JPH0712944Y2 (ja) 1995-03-29

Similar Documents

Publication Publication Date Title
JPH0336974U (ja)
JPS61177812U (ja)
JPH0448797A (ja) 冷却構造
JPH0181512U (ja)
JPS6290551U (ja)
JPH0181513U (ja)
JPS63108658U (ja)
JPH02118942U (ja)
JPH0338693U (ja)
JPS61138192U (ja)
JPH0371695U (ja)
JPS6398141U (ja)
JPH045686U (ja)
JPS58169694U (ja) 遠赤外線放射板
JPS61151392U (ja)
JPS62131450U (ja)
JPH0164445U (ja)
JPS61162924U (ja)
JPH0186546U (ja)
JPS59181754U (ja) サ−マルプリンタヘツド
JPS6249249U (ja)
JPS62134742U (ja)
JPH0240540U (ja)
JPH01106237U (ja)
JPH0480001U (ja)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term