JPH0373134B2 - - Google Patents
Info
- Publication number
- JPH0373134B2 JPH0373134B2 JP56079392A JP7939281A JPH0373134B2 JP H0373134 B2 JPH0373134 B2 JP H0373134B2 JP 56079392 A JP56079392 A JP 56079392A JP 7939281 A JP7939281 A JP 7939281A JP H0373134 B2 JPH0373134 B2 JP H0373134B2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- oxygen
- semiconductor wafer
- chamber
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10P72/0436—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/003—Methods of steam generation characterised by form of heating method using combustion of hydrogen with oxygen
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56079392A JPS57194522A (en) | 1981-05-27 | 1981-05-27 | Thermal treatment of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56079392A JPS57194522A (en) | 1981-05-27 | 1981-05-27 | Thermal treatment of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57194522A JPS57194522A (en) | 1982-11-30 |
| JPH0373134B2 true JPH0373134B2 (show.php) | 1991-11-20 |
Family
ID=13688585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56079392A Granted JPS57194522A (en) | 1981-05-27 | 1981-05-27 | Thermal treatment of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57194522A (show.php) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01295425A (ja) * | 1988-02-29 | 1989-11-29 | Tel Sagami Ltd | 酸化装置 |
| JPH01319940A (ja) * | 1988-06-22 | 1989-12-26 | Kimmon Mfg Co Ltd | 外部燃焼酸化装置 |
| DE10119741B4 (de) * | 2001-04-23 | 2012-01-19 | Mattson Thermal Products Gmbh | Verfahren und Vorrichtung zum Behandeln von Halbleitersubstraten |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5749384Y2 (show.php) * | 1977-11-15 | 1982-10-29 |
-
1981
- 1981-05-27 JP JP56079392A patent/JPS57194522A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57194522A (en) | 1982-11-30 |
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