JPH0369230U - - Google Patents
Info
- Publication number
- JPH0369230U JPH0369230U JP1989131168U JP13116889U JPH0369230U JP H0369230 U JPH0369230 U JP H0369230U JP 1989131168 U JP1989131168 U JP 1989131168U JP 13116889 U JP13116889 U JP 13116889U JP H0369230 U JPH0369230 U JP H0369230U
- Authority
- JP
- Japan
- Prior art keywords
- group
- semiconductor
- semiconductor substrate
- solder bump
- connection areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/012—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131168U JPH0369230U (enExample) | 1989-11-10 | 1989-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131168U JPH0369230U (enExample) | 1989-11-10 | 1989-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369230U true JPH0369230U (enExample) | 1991-07-09 |
Family
ID=31678691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989131168U Pending JPH0369230U (enExample) | 1989-11-10 | 1989-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369230U (enExample) |
-
1989
- 1989-11-10 JP JP1989131168U patent/JPH0369230U/ja active Pending