JPH0368947B2 - - Google Patents
Info
- Publication number
- JPH0368947B2 JPH0368947B2 JP60066166A JP6616685A JPH0368947B2 JP H0368947 B2 JPH0368947 B2 JP H0368947B2 JP 60066166 A JP60066166 A JP 60066166A JP 6616685 A JP6616685 A JP 6616685A JP H0368947 B2 JPH0368947 B2 JP H0368947B2
- Authority
- JP
- Japan
- Prior art keywords
- bismuth
- target
- sputtering
- backing plate
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6616685A JPS61227166A (ja) | 1985-03-29 | 1985-03-29 | スパツタリング用ビスマスまたはビスマス含有タ−ゲツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6616685A JPS61227166A (ja) | 1985-03-29 | 1985-03-29 | スパツタリング用ビスマスまたはビスマス含有タ−ゲツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61227166A JPS61227166A (ja) | 1986-10-09 |
| JPH0368947B2 true JPH0368947B2 (OSRAM) | 1991-10-30 |
Family
ID=13307990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6616685A Granted JPS61227166A (ja) | 1985-03-29 | 1985-03-29 | スパツタリング用ビスマスまたはビスマス含有タ−ゲツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61227166A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02267261A (ja) * | 1989-04-06 | 1990-11-01 | Kojundo Chem Lab Co Ltd | スパッタリングターゲットの製造方法 |
| JP5026611B1 (ja) * | 2011-09-21 | 2012-09-12 | Jx日鉱日石金属株式会社 | 積層構造体及びその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2933835C2 (de) * | 1979-08-21 | 1987-02-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Befestigen von in Scheiben- oder Plattenform vorliegenden Targetmaterialien auf Kühlteller für Aufstäubanlagen |
-
1985
- 1985-03-29 JP JP6616685A patent/JPS61227166A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61227166A (ja) | 1986-10-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |