JPH0368799B2 - - Google Patents

Info

Publication number
JPH0368799B2
JPH0368799B2 JP60084231A JP8423185A JPH0368799B2 JP H0368799 B2 JPH0368799 B2 JP H0368799B2 JP 60084231 A JP60084231 A JP 60084231A JP 8423185 A JP8423185 A JP 8423185A JP H0368799 B2 JPH0368799 B2 JP H0368799B2
Authority
JP
Japan
Prior art keywords
brazing
oxygen
brazing filler
filler metal
free copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60084231A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61242786A (ja
Inventor
Akira Mori
Hideaki Yoshida
Masaki Morikawa
Tadaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP8423185A priority Critical patent/JPS61242786A/ja
Publication of JPS61242786A publication Critical patent/JPS61242786A/ja
Publication of JPH0368799B2 publication Critical patent/JPH0368799B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP8423185A 1985-04-19 1985-04-19 表面被覆Ｃｕ―Ａｇ―Ｓｉ系合金ろう材 Granted JPS61242786A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8423185A JPS61242786A (ja) 1985-04-19 1985-04-19 表面被覆Ｃｕ―Ａｇ―Ｓｉ系合金ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8423185A JPS61242786A (ja) 1985-04-19 1985-04-19 表面被覆Ｃｕ―Ａｇ―Ｓｉ系合金ろう材

Publications (2)

Publication Number Publication Date
JPS61242786A JPS61242786A (ja) 1986-10-29
JPH0368799B2 true JPH0368799B2 (enrdf_load_stackoverflow) 1991-10-29

Family

ID=13824700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8423185A Granted JPS61242786A (ja) 1985-04-19 1985-04-19 表面被覆Ｃｕ―Ａｇ―Ｓｉ系合金ろう材

Country Status (1)

Country Link
JP (1) JPS61242786A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114346516B (zh) * 2021-12-31 2022-12-09 西安理工大学 增强低碳钢表面性能的药芯焊丝及方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58163569A (ja) * 1982-03-25 1983-09-28 Toshiba Corp クラツド板及びその製造法

Also Published As

Publication number Publication date
JPS61242786A (ja) 1986-10-29

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