JPH0368777B2 - - Google Patents

Info

Publication number
JPH0368777B2
JPH0368777B2 JP5831986A JP5831986A JPH0368777B2 JP H0368777 B2 JPH0368777 B2 JP H0368777B2 JP 5831986 A JP5831986 A JP 5831986A JP 5831986 A JP5831986 A JP 5831986A JP H0368777 B2 JPH0368777 B2 JP H0368777B2
Authority
JP
Japan
Prior art keywords
solder
electrodes
thermocompression bonding
solder layer
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5831986A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62214867A (ja
Inventor
Hirohito Shiotani
Yoshi Yoshino
Kenichi Ao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP5831986A priority Critical patent/JPS62214867A/ja
Publication of JPS62214867A publication Critical patent/JPS62214867A/ja
Publication of JPH0368777B2 publication Critical patent/JPH0368777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5831986A 1986-03-18 1986-03-18 熱圧着装置 Granted JPS62214867A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5831986A JPS62214867A (ja) 1986-03-18 1986-03-18 熱圧着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5831986A JPS62214867A (ja) 1986-03-18 1986-03-18 熱圧着装置

Publications (2)

Publication Number Publication Date
JPS62214867A JPS62214867A (ja) 1987-09-21
JPH0368777B2 true JPH0368777B2 (enrdf_load_html_response) 1991-10-29

Family

ID=13080951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5831986A Granted JPS62214867A (ja) 1986-03-18 1986-03-18 熱圧着装置

Country Status (1)

Country Link
JP (1) JPS62214867A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2773142B2 (ja) * 1988-07-29 1998-07-09 松下電器産業株式会社 部品実装装置

Also Published As

Publication number Publication date
JPS62214867A (ja) 1987-09-21

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