JPH0368777B2 - - Google Patents
Info
- Publication number
- JPH0368777B2 JPH0368777B2 JP5831986A JP5831986A JPH0368777B2 JP H0368777 B2 JPH0368777 B2 JP H0368777B2 JP 5831986 A JP5831986 A JP 5831986A JP 5831986 A JP5831986 A JP 5831986A JP H0368777 B2 JPH0368777 B2 JP H0368777B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electrodes
- thermocompression bonding
- solder layer
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 238000002788 crimping Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5831986A JPS62214867A (ja) | 1986-03-18 | 1986-03-18 | 熱圧着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5831986A JPS62214867A (ja) | 1986-03-18 | 1986-03-18 | 熱圧着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62214867A JPS62214867A (ja) | 1987-09-21 |
| JPH0368777B2 true JPH0368777B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-10-29 |
Family
ID=13080951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5831986A Granted JPS62214867A (ja) | 1986-03-18 | 1986-03-18 | 熱圧着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62214867A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2773142B2 (ja) * | 1988-07-29 | 1998-07-09 | 松下電器産業株式会社 | 部品実装装置 |
-
1986
- 1986-03-18 JP JP5831986A patent/JPS62214867A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62214867A (ja) | 1987-09-21 |