JPH036854U - - Google Patents
Info
- Publication number
- JPH036854U JPH036854U JP6650889U JP6650889U JPH036854U JP H036854 U JPH036854 U JP H036854U JP 6650889 U JP6650889 U JP 6650889U JP 6650889 U JP6650889 U JP 6650889U JP H036854 U JPH036854 U JP H036854U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flat package
- corners
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例の平面図、第２図は本
考案の一実施例においてプリント配線板からフラ
ツトパツケージを取り外す状態の正面図、第３図
は第２図の治具７の斜視図、第４図は従来のプリ
ント配線板からフラツトパツケージを取り外す作
業の斜視図である。
１……プリント配線板、２……ＱＦＰ搭載位置
、３……穴、４……ハンダゴテ、５……ＱＦＰ、
６……プリント配線板、７……治具、８……作業
台、９……治具、１０……ピン、１１……ピンホ
ルダ、１２……プリント配線板、１３……ハンダ
ゴテ、１４……ピンセツト。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a front view of a state in which a flat package is removed from a printed wiring board in an embodiment of the present invention, and Fig. 3 is a view of the jig 7 shown in Fig. 2. FIG. 4 is a perspective view of a conventional process for removing a flat package from a printed wiring board. 1...Printed wiring board, 2...QFP mounting position, 3...hole, 4...soldering iron, 5...QFP,
6...Printed wiring board, 7...Jig, 8...Workbench, 9...Jig, 10...Pin, 11...Pin holder, 12...Printed wiring board, 13...Soldering iron, 14... Tweezers.
Claims (1)
において、フラツトパツケージを実装する領域に
おける端子に囲まれた内側部分の端子部分の角部
に、中心対称に配置された複数個の穴を有するこ
とを特徴とするプリント配線板。 A printed wiring board on which a flat package is mounted is characterized by having a plurality of holes centrally arranged at the corners of the terminal part of the inner part surrounded by the terminals in the area where the flat package is mounted. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6650889U JPH036854U (en) | 1989-06-06 | 1989-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6650889U JPH036854U (en) | 1989-06-06 | 1989-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036854U true JPH036854U (en) | 1991-01-23 |
Family
ID=31599295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6650889U Pending JPH036854U (en) | 1989-06-06 | 1989-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036854U (en) |
-
1989
- 1989-06-06 JP JP6650889U patent/JPH036854U/ja active Pending
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