JP2542534Y2 - Lead wire soldering guide - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering guide for soldering a lead wire to a printed circuit board, and particularly to a lead wire soldering method suitable for soldering a lead wire to a printed circuit board pattern having a narrow pattern interval. About the guide.

[0002]

2. Description of the Related Art Conventionally, many soldering methods for connecting lead wires to a printed circuit board pattern are shown in the perspective view of FIG. In the figure, reference numeral 3 denotes a lead wire connected to the pattern 10a of the printed board 10, and the core wire 3a of the lead wire 3 is connected by soldering on the pattern 10a of the printed board 10. Reference numeral 4 denotes a soldered portion soldered on the pattern 10a.

[0003]

However, since the conventional soldering of the lead wire 3 is directly connected to the pattern 10a of the printed circuit board 10 by soldering, the vibration or movement of the lead wire 3 causes the pattern 10a to be soldered. However, there was a drawback that peeling was easy to occur and the strength was weak.

Further, when soldering the lead wire 3, the soldering work is performed because the soldering operation is performed while holding the lead wire 3, and the lead wire 3 is sufficiently adhered on the pattern 10a of the printed circuit board 10. Could not be soldered. In addition, when the space between the patterns 10a of the printed circuit board 10 is narrow, there is a drawback that the patterns come into contact with each other by soldering during the soldering operation.

The present invention has been made in view of the above points, and has as its object to solve the disadvantages of the prior art and to form a substantially box-like shape by pressing a lead wire on a printed circuit board pattern and surrounding the pattern. The present invention is to provide a lead wire soldering guide which can fix the soldering guide formed on the printed circuit board to a printed circuit board and solder it.

[0006]

The lead wire soldering guide of the present invention is provided in a substantially box-shaped soldering guide for pressing lead wires to be wired on a printed circuit board pattern, and provided on the top surface of the soldering guide. A first opening, a second opening for inserting the lead wire into the side surface of the soldering guide, and a plurality of locking portions provided so that the soldering guide is fixed to the printed circuit board; A plurality of locking holes provided at predetermined positions in the vicinity of the pattern of the printed circuit board, and a plurality of locking portions of the soldering guide are locked in the locking holes to fix a lead wire; The lead wire is soldered to the printed circuit board pattern from the first opening of the attachment guide.

[0007]

According to the invention, a lead wire is inserted into a second opening provided on a side surface of a soldering guide formed in a substantially box shape,
With the lead wire inserted, the locking portion of the soldering guide is inserted into a locking hole provided in the vicinity of the pattern on the printed circuit board and locked, so that the soldering guide can be fixed to the printed circuit board.

The lead wire inserted into the second opening of the soldering guide is temporarily fixed by pressing the lead wire at the pressing portion of the soldering guide by fixing the soldering guide to the printed circuit board. The core wire of the fixed lead wire can be styled so as to be in close contact with the printed circuit board pattern, and the core wire can be soldered onto the pattern from a first opening provided on the top surface of the soldering guide. .

In the soldering of the core wire, since the lead wire is temporarily fixed by a soldering guide, it can be easily and reliably soldered, and the soldering strength can be maintained, and peeling of the pattern can be prevented. Can be. Further, at the time of the above-mentioned soldering, since the pattern is surrounded by the substantially box-shaped soldering guide, it does not come into contact with the adjacent pattern by soldering, and the soldering operation can be easily performed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a lead wire soldering guide according to the present invention will be described with reference to FIGS. The same parts as those in the conventional example are denoted by the same reference numerals, and description thereof is omitted. FIG.
FIG. 2 is an exploded perspective view showing a printed circuit board and a soldering guide, and FIG. 2 is a sectional view when a lead wire is soldered.

In the drawing, reference numeral 1 denotes a soldering guide formed in a substantially box shape. A pressing portion 1a for pressing a lead wire is formed on the top surface of the soldering guide 1, and further, the top surface of the soldering guide 1 is formed. The soldering guide 1 is provided with a first opening 1b and a second opening 1c on one side surface, and a plurality of, in the figure, three locking portions 1d formed on the other three side surfaces of the soldering guide 1. is there.

Reference numeral 2 denotes a printed circuit board, on which a plurality of patterns 2a (two patterns in the figure) for connecting lead wires are formed as shown in FIG.
A locking hole 2b is provided near the soldering guide 1 so that the locking portion 1d of the soldering guide 1 can be locked. Reference numeral 3 denotes a lead wire connected to the pattern 2a of the printed circuit board 2. The core wire 3a of the wire 3 can be soldered to the pattern 2a. Reference numeral 4 denotes a soldered portion.

A lead 3 connected to the pattern 2a of the printed circuit board 2 by soldering is connected to a second opening of the soldering guide 1.
1c, fix the soldering guide 1 by inserting the locking portion 1d of the soldering guide 1 into the locking hole 2b of the printed circuit board 2 while styling the core wire 3a of the lead wire 3 so as to be in close contact with the pattern 2a. I do. The locking portion 1d of the soldering guide 1 is formed in a stopper shape as shown in the figure, and can be securely locked in the locking hole 2b.

When the soldering guide 1 is fixed, the pressing portion 1a of the soldering guide 1 presses down the lead wire 3 and fixes the lead wire 3 so that the core wire 3a extends from the first opening 1b of the soldering guide 1. Can be soldered onto the pattern 2a. In this soldering, since the lead wire 3 is fixed by the soldering guide 1, the soldering operation can be easily performed, and the core wire 3a
Is soldered in close contact with the pattern 2a, so that the soldering strength can be maintained.

Further, the soldering of the lead wires 3 is performed inside a substantially box-shaped soldering guide 1, and a wall is formed on each of the patterns 2a with respect to the adjacent pattern 2a by the soldering guide 1, respectively. It is possible to prevent solder contact with the adjacent pattern 2a due to work.

As described above, the soldering guide 1 fixes and presses the lead wire 3 in the wiring of the lead wire 3, further simplifies the soldering work, and can perform reliable soldering.

[0017]

[Effect of the Invention] As described above, the lead wire soldering guide according to the present invention can temporarily fix the wiring lead wire with the soldering guide, hold down the lead wire, and solder the lead wire, thereby simplifying the styling of the lead wire. Easy soldering work,
In addition, it is possible to eliminate problems such as the wire material being securely soldered and the wire material being lifted, and to maintain the soldering strength of the soldered lead wire.

Also, there is an effect that the solder contact with the adjacent pattern due to the soldering can be eliminated.

In addition, it has excellent features such as simple structure and easy implementation because it can be constructed at low cost.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a lead wire soldering guide of the present invention.

FIG. 2 is a cross-sectional view when a lead wire is soldered to a pattern.

FIG. 3 is a perspective view showing a conventional example in which lead wires are wired to a pattern.

[Explanation of symbols]

 1 Soldering guide 1a Pressing part provided on top of soldering guide 1b First opening provided on top of soldering guide 1c Second opening provided on side of soldering guide 1d Soldering guide Locking part provided 2 Printed circuit board 2a Pattern of printed circuit board 2b Locking hole provided on printed circuit board 3 Lead wire 3a Core wire of lead wire 4 Soldering part

Claims (1)

(57) [Scope of request for utility model registration] 1. A soldering guide formed in a substantially box shape for holding a lead wire to be wired to a printed board pattern, a first opening provided on a top surface of the soldering guide, and a side face of the soldering guide. A second opening into which the lead wire is inserted, and a plurality of locking portions provided so that the soldering guide is fixed to the printed circuit board, while being provided at a predetermined position near a pattern on the printed circuit board. A plurality of locking holes are provided, and a plurality of locking portions of the soldering guide are locked in the locking holes to fix a lead wire, and a lead wire is printed from a first opening of the soldering guide. A lead wire soldering guide, which is configured to be soldered to a substrate pattern.