JPH0368535B2 - - Google Patents
Info
- Publication number
- JPH0368535B2 JPH0368535B2 JP61101599A JP10159986A JPH0368535B2 JP H0368535 B2 JPH0368535 B2 JP H0368535B2 JP 61101599 A JP61101599 A JP 61101599A JP 10159986 A JP10159986 A JP 10159986A JP H0368535 B2 JPH0368535 B2 JP H0368535B2
- Authority
- JP
- Japan
- Prior art keywords
- slug
- glass sleeve
- lead
- glass
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 241000237858 Gastropoda Species 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 239000002893 slag Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000013067 intermediate product Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61101599A JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61101599A JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62257752A JPS62257752A (ja) | 1987-11-10 |
| JPH0368535B2 true JPH0368535B2 (enrdf_load_stackoverflow) | 1991-10-28 |
Family
ID=14304852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61101599A Granted JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62257752A (enrdf_load_stackoverflow) |
-
1986
- 1986-04-30 JP JP61101599A patent/JPS62257752A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62257752A (ja) | 1987-11-10 |
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