JPH0410691Y2 - - Google Patents

Info

Publication number
JPH0410691Y2
JPH0410691Y2 JP18048187U JP18048187U JPH0410691Y2 JP H0410691 Y2 JPH0410691 Y2 JP H0410691Y2 JP 18048187 U JP18048187 U JP 18048187U JP 18048187 U JP18048187 U JP 18048187U JP H0410691 Y2 JPH0410691 Y2 JP H0410691Y2
Authority
JP
Japan
Prior art keywords
jig
lead
slug
glass sleeve
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18048187U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0184441U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18048187U priority Critical patent/JPH0410691Y2/ja
Publication of JPH0184441U publication Critical patent/JPH0184441U/ja
Application granted granted Critical
Publication of JPH0410691Y2 publication Critical patent/JPH0410691Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP18048187U 1987-11-26 1987-11-26 Expired JPH0410691Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18048187U JPH0410691Y2 (enrdf_load_stackoverflow) 1987-11-26 1987-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18048187U JPH0410691Y2 (enrdf_load_stackoverflow) 1987-11-26 1987-11-26

Publications (2)

Publication Number Publication Date
JPH0184441U JPH0184441U (enrdf_load_stackoverflow) 1989-06-05
JPH0410691Y2 true JPH0410691Y2 (enrdf_load_stackoverflow) 1992-03-17

Family

ID=31471999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18048187U Expired JPH0410691Y2 (enrdf_load_stackoverflow) 1987-11-26 1987-11-26

Country Status (1)

Country Link
JP (1) JPH0410691Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927542B1 (ja) * 2020-12-11 2021-09-01 公立大学法人 富山県立大学 ピン移載装置、ピン移載方法及び処理装置

Also Published As

Publication number Publication date
JPH0184441U (enrdf_load_stackoverflow) 1989-06-05

Similar Documents

Publication Publication Date Title
JPH0333369U (enrdf_load_stackoverflow)
JPH0410691Y2 (enrdf_load_stackoverflow)
US4545761A (en) Method and apparatus for securing articles in place on a substrate
US3204327A (en) Method for making semiconductor devices employing a hollow, slotted cylindrical jig and vertical mounting posts
CN209572245U (zh) 一种用于大尺寸图像传感器组件封装的治具
CN111081789A (zh) 一种红外感测器真空封装方法
CN207615930U (zh) 一种提高焊接系统热均匀性的装置
JPH0258229A (ja) 半田バンプ型電極の製造方法
JPS62231213A (ja) 液晶セルの液晶注入方法
JPH04177889A (ja) 予備半田付け方法
JPS63158855A (ja) 半導体装置の封止治具
JPS62207615A (ja) 樹脂封止用金型
JP2515883Y2 (ja) 基板予熱装置
JPS5839149Y2 (ja) 真空断熱瓶
JPH075640Y2 (ja) 電子部品の封着治具
JPH0727624Y2 (ja) 加熱治具
JPS6074653A (ja) 半導体装置用容器の封止治具
JPH0368535B2 (enrdf_load_stackoverflow)
JPH0428476A (ja) リード付表面実装部品のはんだ付け方法
JPH0351113Y2 (enrdf_load_stackoverflow)
JPS567445A (en) Bonding head
JPH01262647A (ja) 電子部品の製造方法および装置
JPS581140U (ja) 加熱炉
JPH0516222Y2 (enrdf_load_stackoverflow)
JPH03289151A (ja) 熱圧着用ボンディングヘッド