JPS62257752A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS62257752A JPS62257752A JP61101599A JP10159986A JPS62257752A JP S62257752 A JPS62257752 A JP S62257752A JP 61101599 A JP61101599 A JP 61101599A JP 10159986 A JP10159986 A JP 10159986A JP S62257752 A JPS62257752 A JP S62257752A
- Authority
- JP
- Japan
- Prior art keywords
- slags
- glass sleeve
- lead frame
- slug
- sleeves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61101599A JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61101599A JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62257752A true JPS62257752A (ja) | 1987-11-10 |
JPH0368535B2 JPH0368535B2 (enrdf_load_stackoverflow) | 1991-10-28 |
Family
ID=14304852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61101599A Granted JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62257752A (enrdf_load_stackoverflow) |
-
1986
- 1986-04-30 JP JP61101599A patent/JPS62257752A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0368535B2 (enrdf_load_stackoverflow) | 1991-10-28 |
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