JPH0366813B2 - - Google Patents
Info
- Publication number
- JPH0366813B2 JPH0366813B2 JP62312264A JP31226487A JPH0366813B2 JP H0366813 B2 JPH0366813 B2 JP H0366813B2 JP 62312264 A JP62312264 A JP 62312264A JP 31226487 A JP31226487 A JP 31226487A JP H0366813 B2 JPH0366813 B2 JP H0366813B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- layer
- lead frame
- electronic component
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000010949 copper Substances 0.000 description 18
- 229910000765 intermetallic Inorganic materials 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910017091 Fe-Sn Inorganic materials 0.000 description 4
- 229910017142 Fe—Sn Inorganic materials 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 4
- 229910020922 Sn-Pb Inorganic materials 0.000 description 4
- 229910008783 Sn—Pb Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31226487A JPS63158859A (ja) | 1987-12-11 | 1987-12-11 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31226487A JPS63158859A (ja) | 1987-12-11 | 1987-12-11 | 電子部品 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11281383A Division JPS605550A (ja) | 1983-06-24 | 1983-06-24 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63158859A JPS63158859A (ja) | 1988-07-01 |
| JPH0366813B2 true JPH0366813B2 (ko) | 1991-10-18 |
Family
ID=18027148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31226487A Granted JPS63158859A (ja) | 1987-12-11 | 1987-12-11 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63158859A (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58112813A (ja) * | 1981-12-25 | 1983-07-05 | Niigata Eng Co Ltd | 軌道車両における空気タイヤ異常検出方法 |
| JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
-
1987
- 1987-12-11 JP JP31226487A patent/JPS63158859A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58112813A (ja) * | 1981-12-25 | 1983-07-05 | Niigata Eng Co Ltd | 軌道車両における空気タイヤ異常検出方法 |
| JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63158859A (ja) | 1988-07-01 |
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