JPH036653B2 - - Google Patents
Info
- Publication number
- JPH036653B2 JPH036653B2 JP18372884A JP18372884A JPH036653B2 JP H036653 B2 JPH036653 B2 JP H036653B2 JP 18372884 A JP18372884 A JP 18372884A JP 18372884 A JP18372884 A JP 18372884A JP H036653 B2 JPH036653 B2 JP H036653B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate
- thin film
- raw material
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007789 gas Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 34
- 238000000151 deposition Methods 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 19
- 239000002994 raw material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 16
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 14
- -1 chloroethoxytriethoxysilanes Chemical class 0.000 claims description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- 229910000077 silane Inorganic materials 0.000 claims description 9
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims description 8
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 8
- 229910000085 borane Inorganic materials 0.000 claims description 7
- OOCUOKHIVGWCTJ-UHFFFAOYSA-N chloromethyl(trimethyl)silane Chemical class C[Si](C)(C)CCl OOCUOKHIVGWCTJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 125000005234 alkyl aluminium group Chemical group 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- QUZPNFFHZPRKJD-UHFFFAOYSA-N germane Chemical compound [GeH4] QUZPNFFHZPRKJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052986 germanium hydride Inorganic materials 0.000 claims description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910001882 dioxygen Inorganic materials 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 125000000082 organogermanium group Chemical group 0.000 claims 1
- 150000001282 organosilanes Chemical class 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 description 17
- 229910004298 SiO 2 Inorganic materials 0.000 description 12
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 238000010574 gas phase reaction Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000006557 surface reaction Methods 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18372884A JPS6163020A (ja) | 1984-09-04 | 1984-09-04 | 薄膜形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18372884A JPS6163020A (ja) | 1984-09-04 | 1984-09-04 | 薄膜形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6163020A JPS6163020A (ja) | 1986-04-01 |
JPH036653B2 true JPH036653B2 (enrdf_load_stackoverflow) | 1991-01-30 |
Family
ID=16140923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18372884A Granted JPS6163020A (ja) | 1984-09-04 | 1984-09-04 | 薄膜形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6163020A (enrdf_load_stackoverflow) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427824A (en) * | 1986-09-09 | 1995-06-27 | Semiconductor Energy Laboratory Co., Ltd. | CVD apparatus |
KR910003742B1 (ko) * | 1986-09-09 | 1991-06-10 | 세미콘덕터 에너지 라보라터리 캄파니 리미티드 | Cvd장치 |
US4906585A (en) * | 1987-08-04 | 1990-03-06 | Siemens Aktiengesellschaft | Method for manufacturing wells for CMOS transistor circuits separated by insulating trenches |
JP2883333B2 (ja) * | 1988-01-12 | 1999-04-19 | 株式会社東芝 | 半導体装置の製造方法 |
US5013691A (en) * | 1989-07-31 | 1991-05-07 | At&T Bell Laboratories | Anisotropic deposition of silicon dioxide |
DE69107101T2 (de) | 1990-02-06 | 1995-05-24 | Semiconductor Energy Lab | Verfahren zum Herstellen eines Oxydfilms. |
JPH0697158A (ja) * | 1991-09-12 | 1994-04-08 | Semiconductor Energy Lab Co Ltd | 光気相反応方法 |
CN100465742C (zh) | 1992-08-27 | 2009-03-04 | 株式会社半导体能源研究所 | 有源矩阵显示器 |
US7465679B1 (en) | 1993-02-19 | 2008-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film and method of producing semiconductor device |
KR0143873B1 (ko) * | 1993-02-19 | 1998-08-17 | 순페이 야마자끼 | 절연막 및 반도체장치 및 반도체 장치 제조방법 |
JP3637069B2 (ja) | 1993-03-12 | 2005-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
-
1984
- 1984-09-04 JP JP18372884A patent/JPS6163020A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6163020A (ja) | 1986-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |