JPH036612U - - Google Patents

Info

Publication number
JPH036612U
JPH036612U JP6653889U JP6653889U JPH036612U JP H036612 U JPH036612 U JP H036612U JP 6653889 U JP6653889 U JP 6653889U JP 6653889 U JP6653889 U JP 6653889U JP H036612 U JPH036612 U JP H036612U
Authority
JP
Japan
Prior art keywords
optical fiber
semiconductor laser
seal structure
airtight seal
laser module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6653889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6653889U priority Critical patent/JPH036612U/ja
Publication of JPH036612U publication Critical patent/JPH036612U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例を示す縦断面図、第2
図は従来例を示す縦断面図である。 10……半導体レーザモジユール、11……パ
ツケージ、12……先球光フアイバ、13……光
フアイバ導入孔、14……無機質接着剤、15…
…半導体レーザ素子、16……ナイロンジヤケツ
ト、17……第1の空気穴、18……エポキシ接
着剤、19……カバー、20……第2の空気孔、
21……素線部、30……半導体レーザモジユー
ル、31……半導体レーザ素子、32……先球光
フアイバ、33……パツケージ、34……カバー
、35……光フアイバ導入孔、36……半田、3
7……ナイロンジヤケツト、38……素線部。
Fig. 1 is a vertical sectional view showing an embodiment of the present invention;
The figure is a longitudinal sectional view showing a conventional example. 10...Semiconductor laser module, 11...Package, 12...Top optical fiber, 13...Optical fiber introduction hole, 14...Inorganic adhesive, 15...
...Semiconductor laser element, 16...Nylon jacket, 17...First air hole, 18...Epoxy adhesive, 19...Cover, 20...Second air hole,
21... Wire portion, 30... Semiconductor laser module, 31... Semiconductor laser element, 32... Tip optical fiber, 33... Package, 34... Cover, 35... Optical fiber introduction hole, 36... ...Handa, 3
7...Nylon jacket, 38...Element wire part.

Claims (1)

【実用新案登録請求の範囲】 1 先球光フアイバと半導体レーザ素子とを収納
した半導体レーザモジユールの気密シール構造に
おいて、前記先球光フアイバと前記半導体レーザ
とが結合するよう前記先球光フアイバを導入する
ための光フアイバ導入孔を有し、前記先球光フア
イバの素線部と、前記光フアイバ導入孔とを無機
質接着剤にて固着し気密シールしたことを特徴と
する半導体レーザモジユールの気密シール構造。 2 前記無機質接着剤がアルコールを溶剤とした
室温硬化性のセラミツク系接着剤であることを特
徴とする実用新案登録請求の範囲第1項に記載さ
れた半導体レーザモジユールの気密シール構造。
[Claims for Utility Model Registration] 1. In an airtight seal structure of a semiconductor laser module housing a leading optical fiber and a semiconductor laser element, the leading optical fiber is arranged such that the leading optical fiber and the semiconductor laser are coupled to each other. A semiconductor laser module, characterized in that it has an optical fiber introduction hole for introducing the optical fiber, and the strand of the tip optical fiber and the optical fiber introduction hole are fixed with an inorganic adhesive and hermetically sealed. Airtight seal structure. 2. The airtight seal structure for a semiconductor laser module as set forth in claim 1, wherein the inorganic adhesive is a ceramic adhesive that cures at room temperature using alcohol as a solvent.
JP6653889U 1989-06-06 1989-06-06 Pending JPH036612U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6653889U JPH036612U (en) 1989-06-06 1989-06-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6653889U JPH036612U (en) 1989-06-06 1989-06-06

Publications (1)

Publication Number Publication Date
JPH036612U true JPH036612U (en) 1991-01-23

Family

ID=31599331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6653889U Pending JPH036612U (en) 1989-06-06 1989-06-06

Country Status (1)

Country Link
JP (1) JPH036612U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4937131U (en) * 1972-07-01 1974-04-02
JPS50143723U (en) * 1974-05-11 1975-11-27
JPH10303508A (en) * 1997-04-28 1998-11-13 Hitachi Ltd Package case and semiconductor module
JP2006150012A (en) * 2004-11-30 2006-06-15 Makoto Yafuji Insole
JP2013007854A (en) * 2011-06-23 2013-01-10 Furukawa Electric Co Ltd:The Laser module and manufacturing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4937131U (en) * 1972-07-01 1974-04-02
JPS5147473Y2 (en) * 1972-07-01 1976-11-16
JPS50143723U (en) * 1974-05-11 1975-11-27
JPH10303508A (en) * 1997-04-28 1998-11-13 Hitachi Ltd Package case and semiconductor module
JP2006150012A (en) * 2004-11-30 2006-06-15 Makoto Yafuji Insole
JP4596313B2 (en) * 2004-11-30 2010-12-08 眞 八藤 Insoles
JP2013007854A (en) * 2011-06-23 2013-01-10 Furukawa Electric Co Ltd:The Laser module and manufacturing method

Similar Documents

Publication Publication Date Title
JPH036612U (en)
JPS6257214U (en)
JPS62201706U (en)
JPH0310557U (en)
JPH02131344U (en)
JPH0249154U (en)
JPH02146447U (en)
JPS6444635U (en)
JPS60153538U (en) semiconductor element
JPH0245659U (en)
JPS625644U (en)
JPS6179540U (en)
JPH0375542U (en)
JPH0252467U (en)
JPH0415236U (en)
JPS6186954U (en)
JPH0296739U (en)
JPS62186600U (en)
JPH0276863U (en)
JPH01113345U (en)
JPH0316109U (en)
JPH0178059U (en)
JPH0330448U (en)
JPH0231165U (en)
JPH029430U (en)