JPH0276863U - - Google Patents
Info
- Publication number
- JPH0276863U JPH0276863U JP15684488U JP15684488U JPH0276863U JP H0276863 U JPH0276863 U JP H0276863U JP 15684488 U JP15684488 U JP 15684488U JP 15684488 U JP15684488 U JP 15684488U JP H0276863 U JPH0276863 U JP H0276863U
- Authority
- JP
- Japan
- Prior art keywords
- laser diode
- chip carrier
- cap
- receiving element
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 claims 2
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第１図はこの考案の一実施例によるレーザダイ
オードモジユールを示す断面図、第２図は従来の
レーザダイオードモジユールを示す断面図、第３
図は従来の他のレーザダイオードモジユールを示
す断面図、第４図はこの考案の他の実施例による
レーザダイオードモジユールを示す断面図である
。
１はレーザダイオード、２はチツプキヤリア、
３はモニタ用受光素子、４は光フアイバ、５は電
極ピン、６はステム、７はキヤツプ。なお、図中
、同一符号は同一、又は相当部分を示す。
Fig. 1 is a sectional view showing a laser diode module according to an embodiment of the invention, Fig. 2 is a sectional view showing a conventional laser diode module, and Fig. 3 is a sectional view showing a conventional laser diode module.
This figure is a sectional view showing another conventional laser diode module, and FIG. 4 is a sectional view showing a laser diode module according to another embodiment of the invention. 1 is a laser diode, 2 is a chip carrier,
3 is a monitor light receiving element, 4 is an optical fiber, 5 is an electrode pin, 6 is a stem, and 7 is a cap. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
保持するチツプキヤリアと、上記チツプキヤリア
上に固定されたモニタ用受光素子と、気密を保ち
つつ貫通した光フアイバ及び電極ピンを有すると
共に上記チツプキヤリアを保持するステムと、上
記ステムに固定されレーザダイオード及びモニタ
用受光素子を気密封じするキヤツプとを備えたこ
とを特徴とするレーザダイオードモジユール。 A laser diode, a chip carrier holding the laser diode, a monitoring light receiving element fixed on the chip carrier, a stem having an optical fiber and an electrode pin passed through the chip carrier while maintaining airtightness, and holding the chip carrier; 1. A laser diode module comprising: a cap that is fixed to a laser diode and a cap that hermetically seals a laser diode and a monitoring light-receiving element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15684488U JPH0276863U (en) | 1988-12-01 | 1988-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15684488U JPH0276863U (en) | 1988-12-01 | 1988-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276863U true JPH0276863U (en) | 1990-06-13 |
Family
ID=31435752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15684488U Pending JPH0276863U (en) | 1988-12-01 | 1988-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6685482B1 (en) * | 2019-08-06 | 2020-04-22 | 三菱電機株式会社 | Semiconductor laser device |
-
1988
- 1988-12-01 JP JP15684488U patent/JPH0276863U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6685482B1 (en) * | 2019-08-06 | 2020-04-22 | 三菱電機株式会社 | Semiconductor laser device |
| WO2021024371A1 (en) * | 2019-08-06 | 2021-02-11 | 三菱電機株式会社 | Semiconductor laser device |