JPS63195767U - - Google Patents

Info

Publication number
JPS63195767U
JPS63195767U JP8618987U JP8618987U JPS63195767U JP S63195767 U JPS63195767 U JP S63195767U JP 8618987 U JP8618987 U JP 8618987U JP 8618987 U JP8618987 U JP 8618987U JP S63195767 U JPS63195767 U JP S63195767U
Authority
JP
Japan
Prior art keywords
semiconductor laser
light
receiving element
laser device
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8618987U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8618987U priority Critical patent/JPS63195767U/ja
Publication of JPS63195767U publication Critical patent/JPS63195767U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の半導体レーザ装置の一実施
例を示す正面図、第2図は従来の半導体レーザ装
置を示す正面図である。 11……ステム、13……キヤツプ、14……
光取り出し窓、15……凸凹レンズ、16……半
導体レーザチツプ、17……フオトダイオード。
FIG. 1 is a front view showing an embodiment of the semiconductor laser device of this invention, and FIG. 2 is a front view showing a conventional semiconductor laser device. 11... Stem, 13... Cap, 14...
Light extraction window, 15...Convex/concave lens, 16...Semiconductor laser chip, 17...Photodiode.

Claims (1)

【実用新案登録請求の範囲】 光出力モニタ用の受光素子を半導体レーザチツ
プとともにパツケージに内蔵した半導体レーザ装
置において、 (a) 外側が凸面、内側が凹面の凸凹レンズをパ
ツケージの光取り出し窓に配置し、 (b) かつ、そのレンズの光軸上に半導体レーザ
チツプと受光素子とを直線状に並べて配置したこ
とを特徴とする半導体レーザ装置。
[Scope of Claim for Utility Model Registration] A semiconductor laser device in which a light-receiving element for monitoring optical output is built into a package together with a semiconductor laser chip, in which (a) a convex-concave lens with a convex surface on the outside and a concave surface on the inside is arranged in the light extraction window of the package; (b) A semiconductor laser device, further comprising a semiconductor laser chip and a light receiving element arranged in a straight line on the optical axis of the lens.
JP8618987U 1987-06-04 1987-06-04 Pending JPS63195767U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8618987U JPS63195767U (en) 1987-06-04 1987-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8618987U JPS63195767U (en) 1987-06-04 1987-06-04

Publications (1)

Publication Number Publication Date
JPS63195767U true JPS63195767U (en) 1988-12-16

Family

ID=30942273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8618987U Pending JPS63195767U (en) 1987-06-04 1987-06-04

Country Status (1)

Country Link
JP (1) JPS63195767U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457382A (en) * 1990-06-27 1992-02-25 Nec Home Electron Ltd Laser diode device
JPH1031838A (en) * 1996-04-18 1998-02-03 Samsung Electron Co Ltd Laser diode package having light output monitoring function
JP2013039714A (en) * 2011-08-15 2013-02-28 Ricoh Co Ltd Light source apparatus, light scanning apparatus, and image formation apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457382A (en) * 1990-06-27 1992-02-25 Nec Home Electron Ltd Laser diode device
JPH1031838A (en) * 1996-04-18 1998-02-03 Samsung Electron Co Ltd Laser diode package having light output monitoring function
JP2013039714A (en) * 2011-08-15 2013-02-28 Ricoh Co Ltd Light source apparatus, light scanning apparatus, and image formation apparatus

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