JPS61205160U - - Google Patents
Info
- Publication number
- JPS61205160U JPS61205160U JP1986085821U JP8582186U JPS61205160U JP S61205160 U JPS61205160 U JP S61205160U JP 1986085821 U JP1986085821 U JP 1986085821U JP 8582186 U JP8582186 U JP 8582186U JP S61205160 U JPS61205160 U JP S61205160U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- semiconductor light
- optical
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は従来の光半導体装置の説明に供するた
めの要部断面図、第２図は本考案の一実施例を示
す要部断面図である。
図において、１はパツケージ、２は光電変換装
置、３は半導体発光素子、４は光フアイバ、５は
発光素子の光出力のモニタ成分、６はキヤツプ、
８はレンズ、９は光電変換素子、１１はステム、
１９は凹鏡面、２０は貫通孔、２１は樹脂を示す
。
FIG. 1 is a sectional view of a main part for explaining a conventional optical semiconductor device, and FIG. 2 is a sectional view of a main part showing an embodiment of the present invention. In the figure, 1 is a package, 2 is a photoelectric conversion device, 3 is a semiconductor light emitting device, 4 is an optical fiber, 5 is a monitor component of the light output of the light emitting device, 6 is a cap,
8 is a lens, 9 is a photoelectric conversion element, 11 is a stem,
19 is a concave mirror surface, 20 is a through hole, and 21 is a resin.
Claims (1)
体発光素子とパツケージ外部とを光学的に連通さ
せる光フアイバとを具備してなり、且つ前記半導
体発光素子の光出力の一部を光電変換装置の頂部
に設けられたレンズを介し集光し、受光して前記
半導体発光素子の光出力に対応した電気的出力を
得る光電変換装置が一体化されてなる光半導体装
置であつて、前記パツケージのキヤツプ基体内壁
面の一部に前記半導体発光素子の配設位置を略一
方の焦点とする放物鏡を構成し、且つ前記半導体
発光素子から放射され前記放物鏡面において反射
された反射光が進行する光路上に前記レンズ及び
前記光電変換装置が配設されたことを特徴とする
光半導体装置。 A single package includes a semiconductor light emitting element and an optical fiber for optically communicating the semiconductor light emitting element with the outside of the package, and a part of the optical output of the semiconductor light emitting element is transmitted to the top of a photoelectric conversion device. An optical semiconductor device that is integrated with a photoelectric conversion device that collects light through a provided lens, receives the light, and obtains an electrical output corresponding to the optical output of the semiconductor light emitting element, the device being integrated into a cap base of the package. A parabolic mirror is formed on a part of the wall surface, with one focal point approximately at the position where the semiconductor light emitting element is disposed, and on an optical path along which reflected light emitted from the semiconductor light emitting element and reflected on the parabolic mirror surface travels. An optical semiconductor device comprising the lens and the photoelectric conversion device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986085821U JPS61205160U (en) | 1986-06-05 | 1986-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986085821U JPS61205160U (en) | 1986-06-05 | 1986-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205160U true JPS61205160U (en) | 1986-12-24 |
Family
ID=30636562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986085821U Pending JPS61205160U (en) | 1986-06-05 | 1986-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205160U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559785A (en) * | 1978-10-27 | 1980-05-06 | Fujitsu Ltd | Light emitting semiconductor device |
-
1986
- 1986-06-05 JP JP1986085821U patent/JPS61205160U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559785A (en) * | 1978-10-27 | 1980-05-06 | Fujitsu Ltd | Light emitting semiconductor device |
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