JPH0467358U - - Google Patents
Info
- Publication number
- JPH0467358U JPH0467358U JP11135790U JP11135790U JPH0467358U JP H0467358 U JPH0467358 U JP H0467358U JP 11135790 U JP11135790 U JP 11135790U JP 11135790 U JP11135790 U JP 11135790U JP H0467358 U JPH0467358 U JP H0467358U
- Authority
- JP
- Japan
- Prior art keywords
- monitor photodiode
- light
- laser device
- semiconductor laser
- convex lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図は本考案の一実施例であるモニタフオト
ダイオードの断面図、第２図は従来の半導体レー
ザ装置の断面図である。
図において、９はＮ形半導体基板、１０はＰ形
領域、１１は受光部、１２は凸レンズを示す。
FIG. 1 is a sectional view of a monitor photodiode which is an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor laser device. In the figure, 9 is an N-type semiconductor substrate, 10 is a P-type region, 11 is a light receiving section, and 12 is a convex lens.
Claims (1)
ザ装置において、前記モニタフオトダイオードの
受光部上に透光性の樹脂を凸レンズ状にして形成
した事を特徴とする半導体レーザ装置。 1. A semiconductor laser device having a built-in monitor photodiode, characterized in that a light-transmitting resin is formed in the shape of a convex lens on a light receiving portion of the monitor photodiode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135790U JPH0467358U (en) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135790U JPH0467358U (en) | 1990-10-23 | 1990-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467358U true JPH0467358U (en) | 1992-06-15 |
Family
ID=31858795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11135790U Pending JPH0467358U (en) | 1990-10-23 | 1990-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467358U (en) |
-
1990
- 1990-10-23 JP JP11135790U patent/JPH0467358U/ja active Pending