JPH0249154U - - Google Patents

Info

Publication number
JPH0249154U
JPH0249154U JP1988127143U JP12714388U JPH0249154U JP H0249154 U JPH0249154 U JP H0249154U JP 1988127143 U JP1988127143 U JP 1988127143U JP 12714388 U JP12714388 U JP 12714388U JP H0249154 U JPH0249154 U JP H0249154U
Authority
JP
Japan
Prior art keywords
airtight
output
stem
helium gas
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988127143U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988127143U priority Critical patent/JPH0249154U/ja
Publication of JPH0249154U publication Critical patent/JPH0249154U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は本考案の一実施例を示す光半導体パツケー
ジの断面図である。 1……半導体レーザ、2……サブマウント、3
……ヒートシンク、4……ステム、5……気密端
子、6……リード、7……リード、8……キヤツ
プ、9……気密窓、10……ヘリウムガス。
The figure is a sectional view of an optical semiconductor package showing an embodiment of the present invention. 1...Semiconductor laser, 2...Submount, 3
... heat sink, 4 ... stem, 5 ... airtight terminal, 6 ... lead, 7 ... lead, 8 ... cap, 9 ... airtight window, 10 ... helium gas.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体発光素子の搭載されたステムあるいはケ
ースと出力用気密窓あるいは出力用光フアイバを
備えた気密シール用キヤツプとから成る気密パツ
ケージ内にヘリウムガスを封入充填したことを特
徴とする光半導体パツケージ。
An optical semiconductor package characterized in that helium gas is sealed and filled in an airtight package consisting of a stem or case on which a semiconductor light emitting element is mounted and an airtight sealing cap equipped with an output airtight window or an output optical fiber.
JP1988127143U 1988-09-30 1988-09-30 Pending JPH0249154U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988127143U JPH0249154U (en) 1988-09-30 1988-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988127143U JPH0249154U (en) 1988-09-30 1988-09-30

Publications (1)

Publication Number Publication Date
JPH0249154U true JPH0249154U (en) 1990-04-05

Family

ID=31379302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988127143U Pending JPH0249154U (en) 1988-09-30 1988-09-30

Country Status (1)

Country Link
JP (1) JPH0249154U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005333029A (en) * 2004-05-20 2005-12-02 Sumitomo Electric Ind Ltd Optical semiconductor device and optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005333029A (en) * 2004-05-20 2005-12-02 Sumitomo Electric Ind Ltd Optical semiconductor device and optical module

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