JPH0249154U - - Google Patents
Info
- Publication number
- JPH0249154U JPH0249154U JP1988127143U JP12714388U JPH0249154U JP H0249154 U JPH0249154 U JP H0249154U JP 1988127143 U JP1988127143 U JP 1988127143U JP 12714388 U JP12714388 U JP 12714388U JP H0249154 U JPH0249154 U JP H0249154U
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- output
- stem
- helium gas
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000013307 optical fiber Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
図は本考案の一実施例を示す光半導体パツケー
ジの断面図である。
1……半導体レーザ、2……サブマウント、3
……ヒートシンク、4……ステム、5……気密端
子、6……リード、7……リード、8……キヤツ
プ、9……気密窓、10……ヘリウムガス。
The figure is a sectional view of an optical semiconductor package showing an embodiment of the present invention. 1...Semiconductor laser, 2...Submount, 3
... heat sink, 4 ... stem, 5 ... airtight terminal, 6 ... lead, 7 ... lead, 8 ... cap, 9 ... airtight window, 10 ... helium gas.
Claims (1)
ースと出力用気密窓あるいは出力用光フアイバを
備えた気密シール用キヤツプとから成る気密パツ
ケージ内にヘリウムガスを封入充填したことを特
徴とする光半導体パツケージ。 An optical semiconductor package characterized in that helium gas is sealed and filled in an airtight package consisting of a stem or case on which a semiconductor light emitting element is mounted and an airtight sealing cap equipped with an output airtight window or an output optical fiber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988127143U JPH0249154U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988127143U JPH0249154U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0249154U true JPH0249154U (en) | 1990-04-05 |
Family
ID=31379302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988127143U Pending JPH0249154U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249154U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005333029A (en) * | 2004-05-20 | 2005-12-02 | Sumitomo Electric Ind Ltd | Optical semiconductor device and optical module |
-
1988
- 1988-09-30 JP JP1988127143U patent/JPH0249154U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005333029A (en) * | 2004-05-20 | 2005-12-02 | Sumitomo Electric Ind Ltd | Optical semiconductor device and optical module |
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