JPH0252467U - - Google Patents
Info
- Publication number
- JPH0252467U JPH0252467U JP13276188U JP13276188U JPH0252467U JP H0252467 U JPH0252467 U JP H0252467U JP 13276188 U JP13276188 U JP 13276188U JP 13276188 U JP13276188 U JP 13276188U JP H0252467 U JPH0252467 U JP H0252467U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- semiconductor laser
- coupling efficiency
- laser device
- stem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 239000013307 optical fiber Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第1図aはこの考案の一実施例による半導体レ
ーザ装置を示す断面図、第1図bは第1図aの一
部分を拡大した要部断面図、第2図は従来の半導
体レーザ装置を示す断面図である。図において、
1はLDチツプ、2はレンズ、3は窓ガラス、4
はキヤツプ、5ははんだ材、6はヒートシンク、
7はステム、8は外部電極リード、9は接着剤で
ある。なお、図中、同一符号は同一、又は相当部
分を示す。
FIG. 1a is a sectional view showing a semiconductor laser device according to an embodiment of the invention, FIG. 1b is an enlarged sectional view of a part of FIG. 1a, and FIG. 2 is a conventional semiconductor laser device. FIG. In the figure,
1 is the LD chip, 2 is the lens, 3 is the window glass, 4
is the cap, 5 is the solder material, 6 is the heat sink,
7 is a stem, 8 is an external electrode lead, and 9 is an adhesive. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
を調整するキヤツプ付において、キヤツプにレン
ズを装着、およびキヤツプとステムの上下スライ
ド調整可能とし、結合効率の良好な位置でキヤツ
プを固定することを特徴とする半導体レーザ装置
。 With a cap for adjusting the coupling efficiency between a semiconductor laser device and an optical fiber, a lens can be attached to the cap, and the cap and stem can be slid up and down, and the cap can be fixed at a position where the coupling efficiency is good. Semiconductor laser equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13276188U JPH0252467U (en) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13276188U JPH0252467U (en) | 1988-10-11 | 1988-10-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0252467U true JPH0252467U (en) | 1990-04-16 |
Family
ID=31390024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13276188U Pending JPH0252467U (en) | 1988-10-11 | 1988-10-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0252467U (en) |
-
1988
- 1988-10-11 JP JP13276188U patent/JPH0252467U/ja active Pending
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