JPS63100834U - - Google Patents

Info

Publication number
JPS63100834U
JPS63100834U JP1986195655U JP19565586U JPS63100834U JP S63100834 U JPS63100834 U JP S63100834U JP 1986195655 U JP1986195655 U JP 1986195655U JP 19565586 U JP19565586 U JP 19565586U JP S63100834 U JPS63100834 U JP S63100834U
Authority
JP
Japan
Prior art keywords
bonding
lead
preheating
gigantic
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986195655U
Other languages
Japanese (ja)
Other versions
JPH056660Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986195655U priority Critical patent/JPH056660Y2/ja
Publication of JPS63100834U publication Critical patent/JPS63100834U/ja
Application granted granted Critical
Publication of JPH056660Y2 publication Critical patent/JPH056660Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例１を示す図、第２図は
同平面図、第３図は本考案の実施例２を示す図、
第４図は従来のギヤングボンデイング装置を示す
図である。 １……半導体ペレツト、２……リード、３……
フイルムキヤリア、４……ボンデイングツール、
５……光源、６……ミラー、７……集光レンズ。 FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a plan view of the same, and FIG. 3 is a diagram showing a second embodiment of the present invention.
FIG. 4 is a diagram showing a conventional gigantic bonding device. 1... Semiconductor pellet, 2... Lead, 3...
Film carrier, 4...bonding tool,
5...Light source, 6...Mirror, 7...Condensing lens.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] テープ状のフイルムキヤリアに予め取付けられ
たリードと半導体ペレツトとをボンデイングツー
ルにて熱圧着する装置において、リード先端を予
熱する予熱装置を具備したことを特徴とするギヤ
ングボンデイング装置。 A gigantic bonding device for thermocompression-bonding a semiconductor pellet with a lead pre-attached to a tape-like film carrier using a bonding tool, the device being equipped with a preheating device for preheating the tip of the lead.
JP1986195655U 1986-12-19 1986-12-19 Expired - Lifetime JPH056660Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986195655U JPH056660Y2 (en) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986195655U JPH056660Y2 (en) 1986-12-19 1986-12-19

Publications (2)

Publication Number Publication Date
JPS63100834U true JPS63100834U (en) 1988-06-30
JPH056660Y2 JPH056660Y2 (en) 1993-02-19

Family

ID=31153738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986195655U Expired - Lifetime JPH056660Y2 (en) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPH056660Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205334A (en) * 1989-02-03 1990-08-15 Orient Watch Co Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205334A (en) * 1989-02-03 1990-08-15 Orient Watch Co Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPH056660Y2 (en) 1993-02-19

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