JPS61143111U - - Google Patents

Info

Publication number
JPS61143111U
JPS61143111U JP2749585U JP2749585U JPS61143111U JP S61143111 U JPS61143111 U JP S61143111U JP 2749585 U JP2749585 U JP 2749585U JP 2749585 U JP2749585 U JP 2749585U JP S61143111 U JPS61143111 U JP S61143111U
Authority
JP
Japan
Prior art keywords
semiconductor laser
hole
optical fiber
fixed
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2749585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2749585U priority Critical patent/JPS61143111U/ja
Publication of JPS61143111U publication Critical patent/JPS61143111U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例による半導体レー
ザ・光フアイバ結合装置を示す断面図、第2図は
同斜視図、第3図は従来の半導体レーザ・光フア
イバ結合装置を示す断面図、第4図は同斜視図で
ある。図において1は半導体レーザチツプ、2,
8はチツプキヤリア、8a,8bはチツプキヤリ
アの固定部、3は光フアイバ、4は発光部、5は
半田、6は半導体レーザ出射光、7は半田ゴテ。
尚、同一符号は同一または相当部分を示す。
FIG. 1 is a sectional view showing a semiconductor laser/optical fiber coupling device according to an embodiment of the invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a sectional view showing a conventional semiconductor laser/optical fiber coupling device. Figure 4 is a perspective view of the same. In the figure, 1 is a semiconductor laser chip, 2,
8 is a chip carrier, 8a and 8b are fixed parts of the chip carrier, 3 is an optical fiber, 4 is a light emitting part, 5 is solder, 6 is a semiconductor laser emitted light, and 7 is a soldering iron.
Note that the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】 (1) 半導体レーザチツプを固定したチツプキヤ
リアと、上記半導体レーザチツプの対向位置でか
つ上記チツプキヤリアに貫設された貫通孔と、こ
の貫通孔に充填された半田によつて該貫通孔に固
定された光フアイバとを備えた半導体レーザ・光
フアイバ結合装置。 (2) 光フアイバは貫通孔に充填された半田の略
中心位置で固定されていることを特徴とする実用
新案登録請求の範囲第1項記載の半導体レーザ・
光フアイバ結合装置。
[Scope of Claim for Utility Model Registration] (1) A chip carrier to which a semiconductor laser chip is fixed, a through hole formed through the chip carrier at a position facing the semiconductor laser chip, and solder filled in the through hole. A semiconductor laser/optical fiber coupling device comprising an optical fiber fixed to a through hole. (2) The semiconductor laser according to claim 1, wherein the optical fiber is fixed at a substantially central position of the solder filled in the through hole.
Fiber optic coupling equipment.
JP2749585U 1985-02-26 1985-02-26 Pending JPS61143111U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2749585U JPS61143111U (en) 1985-02-26 1985-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2749585U JPS61143111U (en) 1985-02-26 1985-02-26

Publications (1)

Publication Number Publication Date
JPS61143111U true JPS61143111U (en) 1986-09-04

Family

ID=30524504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2749585U Pending JPS61143111U (en) 1985-02-26 1985-02-26

Country Status (1)

Country Link
JP (1) JPS61143111U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10101547B2 (en) 2012-12-21 2018-10-16 Furukawa Electric Co., Ltd. Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10101547B2 (en) 2012-12-21 2018-10-16 Furukawa Electric Co., Ltd. Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber

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