JPS61143111U - - Google Patents
Info
- Publication number
- JPS61143111U JPS61143111U JP2749585U JP2749585U JPS61143111U JP S61143111 U JPS61143111 U JP S61143111U JP 2749585 U JP2749585 U JP 2749585U JP 2749585 U JP2749585 U JP 2749585U JP S61143111 U JPS61143111 U JP S61143111U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- hole
- optical fiber
- fixed
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第1図はこの考案の一実施例による半導体レー
ザ・光フアイバ結合装置を示す断面図、第2図は
同斜視図、第3図は従来の半導体レーザ・光フア
イバ結合装置を示す断面図、第4図は同斜視図で
ある。図において1は半導体レーザチツプ、2,
8はチツプキヤリア、8a,8bはチツプキヤリ
アの固定部、3は光フアイバ、4は発光部、5は
半田、6は半導体レーザ出射光、7は半田ゴテ。
尚、同一符号は同一または相当部分を示す。
FIG. 1 is a sectional view showing a semiconductor laser/optical fiber coupling device according to an embodiment of the invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a sectional view showing a conventional semiconductor laser/optical fiber coupling device. Figure 4 is a perspective view of the same. In the figure, 1 is a semiconductor laser chip, 2,
8 is a chip carrier, 8a and 8b are fixed parts of the chip carrier, 3 is an optical fiber, 4 is a light emitting part, 5 is solder, 6 is a semiconductor laser emitted light, and 7 is a soldering iron.
Note that the same reference numerals indicate the same or equivalent parts.
Claims (1)
リアと、上記半導体レーザチツプの対向位置でか
つ上記チツプキヤリアに貫設された貫通孔と、こ
の貫通孔に充填された半田によつて該貫通孔に固
定された光フアイバとを備えた半導体レーザ・光
フアイバ結合装置。 (2) 光フアイバは貫通孔に充填された半田の略
中心位置で固定されていることを特徴とする実用
新案登録請求の範囲第1項記載の半導体レーザ・
光フアイバ結合装置。[Scope of Claim for Utility Model Registration] (1) A chip carrier to which a semiconductor laser chip is fixed, a through hole formed through the chip carrier at a position facing the semiconductor laser chip, and solder filled in the through hole. A semiconductor laser/optical fiber coupling device comprising an optical fiber fixed to a through hole. (2) The semiconductor laser according to claim 1, wherein the optical fiber is fixed at a substantially central position of the solder filled in the through hole.
Fiber optic coupling equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2749585U JPS61143111U (en) | 1985-02-26 | 1985-02-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2749585U JPS61143111U (en) | 1985-02-26 | 1985-02-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61143111U true JPS61143111U (en) | 1986-09-04 |
Family
ID=30524504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2749585U Pending JPS61143111U (en) | 1985-02-26 | 1985-02-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61143111U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10101547B2 (en) | 2012-12-21 | 2018-10-16 | Furukawa Electric Co., Ltd. | Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber |
-
1985
- 1985-02-26 JP JP2749585U patent/JPS61143111U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10101547B2 (en) | 2012-12-21 | 2018-10-16 | Furukawa Electric Co., Ltd. | Fixing structure for optical fiber, semiconductor laser module, and fixing method for optical fiber |
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