JPH0327062U - - Google Patents
Info
- Publication number
- JPH0327062U JPH0327062U JP8751689U JP8751689U JPH0327062U JP H0327062 U JPH0327062 U JP H0327062U JP 8751689 U JP8751689 U JP 8751689U JP 8751689 U JP8751689 U JP 8751689U JP H0327062 U JPH0327062 U JP H0327062U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- light
- emitting device
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Description
第１図は本考案の一実施例の要部側面図、第２
図は従来装置の一部側面図である。
１……レーザダイオード、２……ヒートシンク
、３……受光素子、４……ステム。
Figure 1 is a side view of the main parts of one embodiment of the present invention, Figure 2
The figure is a partial side view of a conventional device. 1... Laser diode, 2... Heat sink, 3... Light receiving element, 4... Stem.
Claims (1)
することにより、光出力をモニターする半導体発
光装置において、前記発光素子がマウントされて
いるヒートシンク又はステムと受光素子間の発光
素子接着面以外の面が発光素子接着面よりも低く
なつている事を特徴とする半導体発光装置。 In a semiconductor light emitting device that monitors light output by receiving backward emitted light from a light emitting element with a photodiode, the surface other than the light emitting element bonding surface between the heat sink or stem on which the light emitting element is mounted and the light receiving element is the light emitting element. A semiconductor light emitting device characterized by being lower than the adhesive surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8751689U JPH0327062U (en) | 1989-07-25 | 1989-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8751689U JPH0327062U (en) | 1989-07-25 | 1989-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327062U true JPH0327062U (en) | 1991-03-19 |
Family
ID=31637160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8751689U Pending JPH0327062U (en) | 1989-07-25 | 1989-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327062U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105579756A (en) * | 2013-08-08 | 2016-05-11 | 株式会社水道技术开发机构 | Extending/contracting flexible pipe and method for assembling extending/contracting flexible pipe |
-
1989
- 1989-07-25 JP JP8751689U patent/JPH0327062U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105579756A (en) * | 2013-08-08 | 2016-05-11 | 株式会社水道技术开发机构 | Extending/contracting flexible pipe and method for assembling extending/contracting flexible pipe |