JPH02114956U

JPH02114956U -

Info

Publication number: JPH02114956U
Application number: JP2356589U
Authority: JP
Priority date: 1989-02-28
Filing date: 1989-02-28
Publication date: 1990-09-14

Description

[Brief explanation of the drawing]

第１図は本考案の実施例にかかる半導体レーザ
光源の概略構成を示す縦断側面図であり、第２図
は従来例にかかる半導体レーザ光源の概略構成を
示す縦断側面図である。図における符号１は半導体レーザチツプ、１ａ
は光ビーム出射面、２はフレネルレンズ、３はレ
ンズ基板、３ａは一方の表面、３ｂは他方の表面
、１１は透明接着剤、Ｂは光ビームである。なお
、図中の同一符号は、互いに同一もしくは相当す
る部品、部分を示している。 FIG. 1 is a longitudinal sectional side view showing a schematic structure of a semiconductor laser light source according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional side view showing a schematic structure of a semiconductor laser light source according to a conventional example. Reference numeral 1 in the figure is a semiconductor laser chip, 1a
2 is a light beam exit surface, 2 is a Fresnel lens, 3 is a lens substrate, 3a is one surface, 3b is the other surface, 11 is a transparent adhesive, and B is a light beam. Note that the same reference numerals in the figures indicate the same or corresponding parts and portions.

Claims

[Claims for Utility Model Registration] A semiconductor laser light source comprising a semiconductor laser chip that emits a light beam and a Fresnel lens disposed on one surface of a lens substrate to collimate the light beam, a light beam exit surface of
The other surface of the lens substrate corresponding to the placement position of the Fresnel lens is disposed to face the other surface, and a transparent adhesive is provided between the light beam exit surface and the other surface of the lens substrate to bond both surfaces to each other. A semiconductor laser light source characterized by being interposed with an agent.