JPH0365014B2 - - Google Patents

Info

Publication number
JPH0365014B2
JPH0365014B2 JP57081515A JP8151582A JPH0365014B2 JP H0365014 B2 JPH0365014 B2 JP H0365014B2 JP 57081515 A JP57081515 A JP 57081515A JP 8151582 A JP8151582 A JP 8151582A JP H0365014 B2 JPH0365014 B2 JP H0365014B2
Authority
JP
Japan
Prior art keywords
layer
manufacturing
semiconductor device
diffusion
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57081515A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58199541A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57081515A priority Critical patent/JPS58199541A/ja
Publication of JPS58199541A publication Critical patent/JPS58199541A/ja
Publication of JPH0365014B2 publication Critical patent/JPH0365014B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0504—14th Group
    • H01L2924/05042—Si3N4

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Dicing (AREA)
JP57081515A 1982-05-17 1982-05-17 半導体装置の製造方法 Granted JPS58199541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57081515A JPS58199541A (ja) 1982-05-17 1982-05-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57081515A JPS58199541A (ja) 1982-05-17 1982-05-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58199541A JPS58199541A (ja) 1983-11-19
JPH0365014B2 true JPH0365014B2 (enExample) 1991-10-09

Family

ID=13748478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57081515A Granted JPS58199541A (ja) 1982-05-17 1982-05-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58199541A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7741682B2 (ja) * 2021-10-05 2025-09-18 新電元工業株式会社 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019364U (enExample) * 1973-06-15 1975-03-04

Also Published As

Publication number Publication date
JPS58199541A (ja) 1983-11-19

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