JPH0363225B2 - - Google Patents

Info

Publication number
JPH0363225B2
JPH0363225B2 JP56197843A JP19784381A JPH0363225B2 JP H0363225 B2 JPH0363225 B2 JP H0363225B2 JP 56197843 A JP56197843 A JP 56197843A JP 19784381 A JP19784381 A JP 19784381A JP H0363225 B2 JPH0363225 B2 JP H0363225B2
Authority
JP
Japan
Prior art keywords
melting point
point metal
layer
film
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56197843A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5898968A (ja
Inventor
Kohei Higuchi
Hidekazu Okabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56197843A priority Critical patent/JPS5898968A/ja
Publication of JPS5898968A publication Critical patent/JPS5898968A/ja
Publication of JPH0363225B2 publication Critical patent/JPH0363225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56197843A 1981-12-09 1981-12-09 半導体装置 Granted JPS5898968A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56197843A JPS5898968A (ja) 1981-12-09 1981-12-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56197843A JPS5898968A (ja) 1981-12-09 1981-12-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS5898968A JPS5898968A (ja) 1983-06-13
JPH0363225B2 true JPH0363225B2 (cs) 1991-09-30

Family

ID=16381257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56197843A Granted JPS5898968A (ja) 1981-12-09 1981-12-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS5898968A (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920071A (en) * 1985-03-15 1990-04-24 Fairchild Camera And Instrument Corporation High temperature interconnect system for an integrated circuit
JP2507567B2 (ja) * 1988-11-25 1996-06-12 三菱電機株式会社 絶縁体基板上の半導体層に形成されたｍｏｓ型電界効果トランジスタ
JP3086556B2 (ja) * 1993-02-09 2000-09-11 株式会社神戸製鋼所 半導体ダイヤモンド層上の耐熱性オーミック電極及びその形成方法

Also Published As

Publication number Publication date
JPS5898968A (ja) 1983-06-13

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