JPH0360959A - Polishing device - Google Patents
Polishing deviceInfo
- Publication number
- JPH0360959A JPH0360959A JP19376289A JP19376289A JPH0360959A JP H0360959 A JPH0360959 A JP H0360959A JP 19376289 A JP19376289 A JP 19376289A JP 19376289 A JP19376289 A JP 19376289A JP H0360959 A JPH0360959 A JP H0360959A
- Authority
- JP
- Japan
- Prior art keywords
- polished
- polishing
- conveyor
- section
- discharge side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 abstract description 7
- 238000007599 discharging Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract 7
- 238000000926 separation method Methods 0.000 description 14
- 239000012530 fluid Substances 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 5
- 230000007717 exclusion Effects 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、7;ライトコア等の被研摩物を自動研摩する
ための研摩装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polishing apparatus for automatically polishing objects to be polished such as 7. light cores.
(従来の技術及び発明が解決しようとする課題)従来、
7エライトコアの搬入から研摩加工及び搬出に至るまで
を自動的に行う装置は提案されておらず、従来の研摩装
置はフェライトコアの供給、取り出し等に手作業を伴う
煩わしさがあった。(Prior art and problems to be solved by the invention) Conventionally,
No device has been proposed that automatically carries out the process from carrying in, polishing, and carrying out ferrite cores, and conventional polishing devices have had troublesome manual operations such as feeding and taking out ferrite cores.
本発明は、上記の点に鑑み、被研摩物の供給から研摩及
び排出に至る工程を自動的に実行可能な研摩装置を提供
することを目的とする。In view of the above, an object of the present invention is to provide a polishing apparatus that can automatically execute the steps from supplying the object to be polished to polishing and discharging the object.
(課題を解決するための手段)
上記目的を達成するために、本発明は、往復運動を行う
移動テーブルと、該移動テーブル上の被研摩物を研摩す
る回転砥石とを有する研摩部と、被研摩物を移送する供
給側コンベアと、研摩加工後の被研摩物を移送する排出
側コンベアと、前記供給側コンベアより前記移動テーブ
ル上に被研摩物を移載する供給側移載部と、前記移動テ
ーブルより前記排出側コンベア上に研摩加工後の被研摩
物を移載する排出側移載部とを備えたvI戊としている
。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a polishing section having a movable table that performs reciprocating motion, a rotary grindstone that polishes an object to be polished on the movable table, and a supply-side conveyor for transporting the abrasive material; a discharge-side conveyor for transporting the polished object after polishing; a supply-side transfer section for transferring the polishing object from the supply-side conveyor onto the movable table; The vI holder is provided with a discharge side transfer section for transferring the polished object from the movable table onto the discharge side conveyor.
(作用)
本発明の研摩装置においては、被研摩物は供給側コンベ
ア及び供給側移載部を経て研摩部に供給され、研摩部に
て研摩加工された被研摩物は排出側移載部及び排出側コ
ンベアを経て排出されるようになっており、これらの各
工程において手作業を必要としない。従って、極めて効
率的に研摩加工を実行できる。また、研摩部に移載する
前に被研摩物の底面ぼり取り処理を実行しておくこと、
及び研摩部の移動テーブル上に被研摩物を確実に保持し
ておくことにより、高精度の研摩加工ができる。(Function) In the polishing apparatus of the present invention, the object to be polished is supplied to the polishing section via the supply side conveyor and the supply side transfer section, and the object to be polished after being polished in the polishing section is transferred to the discharge side transfer section and the polishing section. It is designed to be discharged via a conveyor on the discharge side, and manual labor is not required in each of these steps. Therefore, polishing can be performed extremely efficiently. In addition, before transferring the object to the polishing section, the bottom surface of the object to be polished should be removed.
By reliably holding the object to be polished on the movable table of the polishing section, highly accurate polishing can be performed.
(実施例)
以下、本発明に係る研摩装置の実施例を図面に従って説
明する。(Example) Hereinafter, an example of the polishing apparatus according to the present invention will be described with reference to the drawings.
第1図乃至第3図は研摩装置の全体構成を示し、研摩装
置は、コ字状や直方体状の7エライトコア等の被研摩物
を研摩する回転砥石を有していて研摩処理を実行する研
摩部1と、被研摩物を移送する供給側コンベア2A、2
Bと、研摩加工後の被研摩物を移送する排出側コンベア
3と、前記供給側コンベア2Bより研摩部1に被研摩物
を移載する供給側移載部4と、前記研摩部1より前記排
出側コンベア3上に研摩加工後の被研摩物を移載する排
出側移載部5と、前記供給側コンベア2A。Figures 1 to 3 show the overall configuration of a polishing device, and the polishing device has a rotating whetstone for polishing an object to be polished, such as a U-shaped or rectangular 7-elite core. section 1, and supply side conveyors 2A and 2 for transporting objects to be polished.
B, a discharge side conveyor 3 that transfers the object to be polished after polishing, a supply side transfer section 4 that transfers the object to be polished from the supply side conveyor 2B to the polishing section 1, and a A discharge side transfer section 5 that transfers the polished object after polishing onto the discharge side conveyor 3, and the supply side conveyor 2A.
2B間に配置されて前記被研摩物のばり取り処理を行う
ばり取り処理部6と、前記研摩部1に研削液を供給する
研削液供給部7とを備えている。2B, a deburring processing section 6 is provided to remove burrs from the object to be polished, and a grinding fluid supply section 7 is provided to supply grinding fluid to the polishing section 1.
前記研摩部1は、基台10に対し水平方向に摺動自在に
配置されていて、一定周期で往復運動を行う移動テーブ
ル11を有している。The polishing section 1 has a movable table 11 that is arranged to be slidable in the horizontal direction with respect to a base 10 and that performs reciprocating motion at a constant period.
また、4本のガイドロッド12が基台10上に垂直に立
設固定され、昇降台13に固定されたボールブツシュ1
4が各ガイドロッド12に摺動自在にはめられている。Further, four guide rods 12 are vertically fixed on the base 10, and a ball bush 1 fixed on the lifting table 13.
4 is slidably fitted on each guide rod 12.
昇降台13には円盤状回転砥石15の回転軸が軸支され
、昇降台13に取り付けられたモータ16で回転砥石1
5は回転駆動されるようになっている。The rotating shaft of a disk-shaped rotating grindstone 15 is supported on the lifting table 13, and the rotating grinding wheel 1 is moved by a motor 16 attached to the lifting table 13.
5 is designed to be rotationally driven.
前記ガイドロッド12の上端には固定台20が固定され
、該固定台20に前記昇降台13の高さを調整するため
の高さ調整機構21が取り付けられている。この調整機
構21は例えば昇降台13側のナツトに螺合するボール
螺子等で構成される。A fixed base 20 is fixed to the upper end of the guide rod 12, and a height adjustment mechanism 21 for adjusting the height of the elevating base 13 is attached to the fixed base 20. This adjustment mechanism 21 is composed of, for example, a ball screw that is screwed into a nut on the lifting table 13 side.
fj44図に示すように、前記昇降台13はリニアスケ
ール25に直結され、該リニアスケール25を見て前記
移動テーブル11とこれに対向している回転砥石15と
の間隔、すなわち研摩量を任意設定する。As shown in FIG. do.
なお、前記円盤状回転砥石15の回転中心細Zは移動テ
ーブル11の上面への垂線に完全に一致させるか、ある
いは第2図の如く微小角度θだけ傾斜させる。角度θは
例えば0’ 1’ 12″程度である。このように傾
斜させる理由は後述する。The center of rotation Z of the disc-shaped rotary grindstone 15 may be made to completely coincide with the perpendicular line to the top surface of the movable table 11, or may be inclined by a small angle θ as shown in FIG. The angle θ is, for example, about 0'1'12''. The reason for inclining in this way will be described later.
供給側コンベア2 A、2 Bはいずれも一般的なベル
トコンベアであり、加工前の被研摩物を研摩部1方向に
移送するものである。各コンベア2A。The supply side conveyors 2A and 2B are both general belt conveyors, and are used to transport objects to be polished before being processed in one direction of the polishing section. Each conveyor 2A.
2Bの先端部には第5図及び第6図に示すような分離チ
ャック31、第1及び第2の光センサ32A、32B及
びストッパ33を具備した被研摩物分離機構30A、3
0Bが配置されている。At the tip of the polishing object separation mechanism 30A, 3, which is equipped with a separation chuck 31, first and second optical sensors 32A, 32B, and a stopper 33, as shown in FIGS.
0B is placed.
前記供給側コンベア2A、2Bは、コ字状や直方体状の
フェライトコア等の被研摩物4oの被研摩面を上にし、
かつ被研摩物長手方向を搬送方向に直角に配置した状態
で次々と被研摩物4oを移送するものであり、前記分離
チャック31はコンベア上の被研摩物40を挟持して被
研摩物の流れをせき止める機能を持つ。The supply side conveyors 2A and 2B are arranged so that the surface to be polished of the object 4o, such as a U-shaped or rectangular parallelepiped ferrite core, is placed upward.
The object to be polished 4o is transferred one after another with the longitudinal direction of the object to be polished perpendicular to the conveyance direction, and the separation chuck 31 clamps the object to be polished 40 on the conveyor and controls the flow of the object to be polished. It has the function of damming up.
ストッパ33は第6図の実線Pのコンベア端上の前進位
置から仮想線Qti−経て仮想aRの後退上昇位置に至
り、逆に仮想aRの後退上昇位置から仮想#!Qを経て
実線Pの前進位置に向かう往復運動を実行するもので、
実線Pの前進位置では分離チャック31を通過してきた
被研摩物40の一群をコンベア端部に止どめておく作用
を果たす。The stopper 33 moves from the forward position on the end of the conveyor indicated by the solid line P in FIG. 6 through the imaginary line Qti- to the retracted and raised position of the imaginary aR, and conversely from the retracted and raised position of the imaginary aR to the imaginary #! It performs a reciprocating motion toward the forward position indicated by the solid line P via Q.
In the forward position indicated by the solid line P, the group of objects 40 to be polished that have passed through the separation chuck 31 is held at the end of the conveyor.
前記第1及び第2の光センサ32A、32Bの両方が被
研摩物有りを検出して所定時間(タイマ設定による)経
過後、前記分離チャック31による被研摩物40の挟持
及びそれ以外の被研摩物のせき止め、ストッパ33のコ
ンベア端部への前進(実#iP位置)による被研摩物4
0の一群の分離、及びぼり取り処理部6又は供給側移載
部4のチャックによるそれらの被研摩物の一群の保持移
送、ストッパ33の後退上昇<Vi想線R)によるチャ
ックされないで残った被研摩物のコンベアからの落とし
、分離チャック31による被研摩物せき止め解除という
一連の動作を実行する。After both the first and second optical sensors 32A and 32B detect the presence of the object to be polished and a predetermined period of time (based on timer settings) has elapsed, the separation chuck 31 clamps the object 40 and polishes the other object. The object to be polished 4 is blocked by blocking the object and moving the stopper 33 toward the end of the conveyor (actual #iP position).
Separation of a group of objects 0, holding and transferring a group of objects to be polished by the chuck of the scraping processing section 6 or the supply side transfer section 4, and remaining unchucked due to the retreating and rising of the stopper 33 <Vi phantom line R) A series of operations including dropping the object to be polished from the conveyor and releasing the dam of the object to be polished by the separation chuck 31 are executed.
なお、研摩加工後の被研摩物を移送する排出側コンベア
3の先端部にも同様の機構を持つ被研摩物分離機構30
Cが配置される。これは、さらに被研摩物の洗浄等を実
行する工程に自動的に移送可能なようにするためである
。Note that there is also a polished object separation mechanism 30 having a similar mechanism at the tip of the discharge side conveyor 3 that transfers the polished objects after polishing.
C is placed. This is to enable automatic transfer to further steps such as cleaning of the object to be polished.
第7図は前記供給側コンベア2 A、28間に配置され
て前記被研摩物のばり取り処理を行うばり取り処理部6
を示す。このばり取り処理部6を設けた百的は、被研摩
物40がフェライトコア等の焼結体である場合に底面に
付着している異物(成形時に付着した0、1〜0.3m
m程度の材料粒子とか、焼成時に被焼成物を載せるトレ
イから出る粉)を除去することにあり、異物が底面に付
着したままで研摩面(底面の反対側の面)を研摩すると
研摩精度がいいかげんなものとなってしまうのを防止す
る。FIG. 7 shows a deburring section 6 disposed between the supply conveyors 2A and 28 for deburring the object to be polished.
shows. The purpose of providing this deburring processing section 6 is that when the object to be polished 40 is a sintered body such as a ferrite core, foreign matter adhering to the bottom surface (0.1 to 0.3 m
The purpose of this process is to remove material particles of about 500 yen (mm) in size, as well as powder that comes out from the tray on which the objects to be fired are placed during firing.If the polished surface (the surface opposite to the bottom surface) is polished with foreign matter still attached to the bottom surface, the polishing accuracy will be reduced. Prevent things from becoming sloppy.
このばり取り処理部6は、コンベア2 A、28間に配
置されるロッドレスシリンダ41と、該ロッドレスシリ
ング41によりコンベア2A先端部からコンベア2B後
端部へ至る水平方向移動及び逆向きの復帰移動を実行す
るチャック42と、ばり取り研摩ディスク(円形のサン
ドベーパー)43と、該研摩ディスクの回転駆動モータ
44とを備えている。This deburring processing section 6 includes a rodless cylinder 41 disposed between the conveyors 2A and 28, and horizontal movement from the tip of the conveyor 2A to the rear end of the conveyor 2B and return in the opposite direction by the rodless cylinder 41. It includes a chuck 42 for performing movement, a deburring abrasive disk (circular sand vapor) 43, and a rotation drive motor 44 for the abrasive disk.
前記被研摩物分離機構3OAでコンベア2A端部におい
て分離された被研摩物40の一群を前記チャック42は
保持してコンベア2A上からコンベア2B方向に移動し
、その途中で被研摩物40の底面を研摩ディスク43に
当てて底面のばりを取った後、それらの被研摩物の一群
をコンベア2B上に移載する。ここで、研摩ディスク軸
Sは垂直軸に対して角度φ(但しφは3〜5°)だけ傾
いている。この傾きにより、コンベア2AL:r)端部
において分離された被研摩物40の一群をチャック42
で挟持する際に、挟持位置にばらつきがあっても(被研
摩物の出入りが生じても)被研摩物底面に研摩ディスク
43が押し当てられるようになっている。The chuck 42 holds a group of objects to be polished 40 separated at the end of the conveyor 2A by the object separation mechanism 3OA and moves from the top of the conveyor 2A toward the conveyor 2B. is applied to the polishing disk 43 to remove burrs from the bottom surface, and then the group of objects to be polished is transferred onto the conveyor 2B. Here, the abrasive disk axis S is inclined with respect to the vertical axis by an angle φ (where φ is 3 to 5 degrees). Due to this inclination, a group of objects to be polished 40 separated at the end of the conveyor 2AL:r) is held in the chuck 42.
When holding the object, the polishing disk 43 is pressed against the bottom surface of the object even if there are variations in the holding position (even if the object moves in and out).
第8図及び第9図は供給側移載部4の構成及び動作を示
すものであり、供給側移載部4、は、前記供給側コンベ
ア2Bの端部において被研摩物分離機構30Bで分離さ
れた被研摩物40の一群を保持して研摩部1の移動テー
ブル11上に移載する機能を持つ。FIG. 8 and FIG. 9 show the structure and operation of the supply side transfer section 4, and the supply side transfer section 4 separates the polished objects at the end of the supply side conveyor 2B by a separation mechanism 30B. It has a function of holding a group of polished objects 40 and transferring them onto the moving table 11 of the polishing section 1.
供給側移載部4は、基台10に対して所定高さで水平方
向に配置固定された固定支持枠50と、該固定支持枠5
0にて水平に軸支されたボール螺子51と、該ボール螺
子51を回転駆動するサーボモータ52と、前記ボール
螺子51に螺合するナツトを持ち当該ボール螺子51の
回転により横移動する横移動枠53と、該横移動枠53
に対して昇降自在に取り付けられた昇降部材54と、該
昇降部材54に取り付けられた2対のチャック55 A
、55 Bとを有している。前記昇降部材54の昇降駆
動は横移動枠53に取り付けられたエアーシリンダ56
で実行され、各チャック55A。The supply side transfer unit 4 includes a fixed support frame 50 arranged and fixed horizontally at a predetermined height with respect to the base 10, and the fixed support frame 5.
0, a servo motor 52 that rotationally drives the ball screw 51, and a nut that is screwed onto the ball screw 51 and moves laterally by the rotation of the ball screw 51. frame 53 and the horizontal movement frame 53
An elevating member 54 is attached to the elevating member 54 so that it can be raised and lowered, and two pairs of chucks 55 A are attached to the elevating member 54.
, 55 B. The lifting member 54 is driven up and down by an air cylinder 56 attached to the horizontal movement frame 53.
and each chuck 55A.
55Bの開閉はそれぞれ昇降部材54側に配置されたエ
アーシリンダ(図示省略)で行なわれ、さらにチャック
55Aと55Bとの相互間隔を別のエアーシリンダで変
化させ得るようになっている。Opening and closing of the chucks 55B are performed by air cylinders (not shown) disposed on the side of the elevating member 54, and furthermore, the mutual distance between the chucks 55A and 55B can be changed using another air cylinder.
さて、コンベア2A、2B上では被研摩物40は1列配
置であるのに対して研摩部1の移動テーブル11上では
被研摩物40は2列配置である。Now, while the objects 40 to be polished are arranged in one row on the conveyors 2A and 2B, the objects 40 to be polished are arranged in two rows on the movable table 11 of the polishing section 1.
このため、左右のチャック55A、55Bのそれぞれを
開いた状態としチャック55Aと55Bの相互間隔も大
きくしておいて供給側移載部4は被研摩物40の到来を
待機し、コンベア2B端部にて分離された被研摩物40
の一群の前半部分を第9図(A)のように左側チャック
55Aで挟持し、その後横移動枠53を所定量移動させ
て被研摩物群の後半部分を同図(B)のように右側チャ
ック55Bで挟持する。このように、供給側移載部4で
2列にして保持された被研摩物40は昇降部材54の上
昇動作及び横移動枠53の横移動動作によって移動テー
ブル11上方に移送され、さらに昇降部材54の下降動
作により同図(C)のように移動テーブル11上に近接
した位置となる。但し、このときはまだチャックの保持
は継続しており、移動テーブル11の中央のガイド用突
条60をはさんで左右に被研摩物40が配置されるよう
にする。For this reason, the left and right chucks 55A and 55B are each opened, the mutual distance between the chucks 55A and 55B is also increased, and the supply side transfer section 4 waits for the object to be polished 40 to arrive, and the end of the conveyor 2B is The object to be polished 40 separated at
The first half of the group of objects to be polished is held by the left chuck 55A as shown in FIG. 9(A), and then the horizontal movement frame 53 is moved by a predetermined amount to move the second half of the group to the right side as shown in FIG. 9(B). It is clamped with a chuck 55B. In this way, the objects to be polished 40 held in two rows in the supply transfer section 4 are transferred above the movable table 11 by the lifting operation of the lifting member 54 and the lateral movement of the lateral movement frame 53, and are then moved upward by the lifting member 54. By the lowering operation of 54, it comes to a position close to the top of the moving table 11 as shown in FIG. 5(C). However, at this time, the chuck is still held, and the objects to be polished 40 are placed on the left and right sides of the guide protrusion 60 at the center of the movable table 11.
その後、チャック55Aと55Bとの間隔を狭めてガイ
ド用突条60に対して左右の被研摩物40を幅寄せして
同図(D)のように当接させ、然る後にチャック55A
、55Bを下降させて移動テーブル11上に2列配置の
被研摩物40を同図(E)のように載置する。Thereafter, the distance between the chucks 55A and 55B is narrowed, and the left and right polished objects 40 are brought closer to each other with respect to the guide protrusion 60 and brought into contact with each other as shown in FIG.
, 55B are lowered, and the objects to be polished 40 arranged in two rows are placed on the moving table 11 as shown in FIG.
移動テーブル11は電磁チャックを構成して゛おり(電
磁石内蔵)、磁性体である被研摩物40を電磁力でテー
ブル上に吸着し、チャック55A、55Bの被研摩物開
放、上昇復帰後、さらに、第9図(F)の如く移動テー
ブル11に設けられたクランプ・アーム61により2列
配置の被研摩物40をガイド用突条60との間で機械的
にはさんでテーブル11に対し機械的に固定する。The movable table 11 constitutes an electromagnetic chuck (with a built-in electromagnet), which attracts the magnetic object 40 to be polished onto the table by electromagnetic force, and after the chucks 55A and 55B release the object to be polished and return to the upward position, further As shown in FIG. 9(F), the objects to be polished 40 arranged in two rows are mechanically sandwiched between the guide ridges 60 by the clamp arm 61 provided on the movable table 11, and mechanically held against the table 11. Fixed to.
なお、前記研摩部1より前記排出側コンベア3上に研摩
加工後の被研摩物40を移載する排出側移載部5の機構
自体は、上述した供給側移載部4と同じであり、その動
作は、移動テーブル11のクランプ・アーム61の開放
及び電磁チャックのオフの後に、第10図(A)の如く
2列配置の被研摩物40の群を2対のチャック55A、
55Bで同時に保持して同図(B)のようにチャック5
5Aと55Bとの間隔を広げながら上昇、横移動して同
図(C)の如く排出側コンベア3上に右側のチャック5
5Bの1列分の被研摩物40を載置し、それから左側の
チャック55Aの1列分の被研摩物40を載置してコン
ベア3上に被研摩物40を1列配置となるように移載す
る。The mechanism itself of the discharge side transfer section 5 that transfers the polished object 40 from the polishing section 1 onto the discharge side conveyor 3 is the same as that of the supply side transfer section 4 described above. In this operation, after the clamp arm 61 of the movable table 11 is opened and the electromagnetic chuck is turned off, the group of objects 40 to be polished arranged in two rows as shown in FIG.
55B at the same time and chuck 5 as shown in the same figure (B).
The chuck 5 on the right side is moved upward and horizontally while widening the gap between 5A and 55B, and the chuck 5 on the right side is placed on the discharge side conveyor 3 as shown in the same figure (C).
5B, and then place one row of the objects 40 on the left chuck 55A so that the objects 40 to be polished are arranged in one row on the conveyor 3. Transfer.
前記研摩部1の供給側移載部の配置側には、第11図及
び第12図に示すようなワイパー8!構65が設けられ
ており、移動テーブル11上をゴム製ワイパー66で拭
き取るようになっている。それらの図において、基台1
0側に固定された支持板67Aに垂直スライドガイド6
7が固定され、該スライドガイド67をスライドロッド
68が垂直方向に摺動自在に貫通している。そして、該
スライドロッド68の下端に取付部材69が固着され、
該取付部材69にゴム製ワイパー66が固定されている
。前記垂直スライドがイド67と取付部材69間にはエ
アーシリング70が設けられ、該エアーシリング70の
線動時はワイパー66は上昇位置、伸動時はワイパー6
6は下降して移動テーブル11上に圧接して所要の拭き
取り動作を行う。前記ワイパー66には前記移動テーブ
ル側のガイド用突条60を避けるための切欠72が形成
されている。このワイパー66の拭き取り動作は、通常
移動テーブル11の供給側移載部4側への移動動作(第
1図矢印X方向の動き)の際に実施される。A wiper 8 as shown in FIGS. 11 and 12 is provided on the side where the supply side transfer section of the polishing section 1 is arranged. A mechanism 65 is provided for wiping the top of the movable table 11 with a rubber wiper 66. In those figures, base 1
The vertical slide guide 6 is attached to the support plate 67A fixed on the 0 side.
7 is fixed, and a slide rod 68 passes through the slide guide 67 in a vertically slidable manner. A mounting member 69 is fixed to the lower end of the slide rod 68,
A rubber wiper 66 is fixed to the mounting member 69. An air cylinder 70 is provided between the vertical slide id 67 and the mounting member 69, and when the air cylinder 70 moves linearly, the wiper 66 is in the raised position, and when it extends, the wiper 66 is in the raised position.
6 descends and comes into pressure contact with the movable table 11 to perform the required wiping operation. A notch 72 is formed in the wiper 66 to avoid the guide protrusion 60 on the movable table side. This wiping operation of the wiper 66 is normally performed when the movable table 11 is moved toward the supply side transfer section 4 (movement in the direction of arrow X in FIG. 1).
なお、ワイパー66の下端近傍には研削液を移動テーブ
ル11上に供給する研削液供給ロア1も設けられている
。Incidentally, a grinding liquid supply lower 1 is also provided near the lower end of the wiper 66 for supplying grinding liquid onto the movable table 11.
さらに、前記研摩部1の排出側移載部の配置側には、前
記排出側移載部5で取り残した研摩加工後の被研摩物4
0を前記移動テーブル11の往復運動を利用して除去す
る被研摩物排除手段75が設けられている。この被研摩
物排除手段75は、第13図に示すように、基台10側
に固定された支持板76に垂直スライドガイド77が固
定され、該スライドがイド77をスライドロッド78が
垂直方向に摺動自在に貫通している。そして、該スライ
ドロッド78の下端に金属製排除部材79が固着されて
いる。該排除部材79には移動テーブル側の〃イド用突
条60を避けるための切欠80が形成されている。前記
垂直スライドガイド77と排除部材79間にはエアーシ
リング81が設けられ、該エアーシリンダ81の線動時
は排除部材79は上昇位置、伸動時は排除部材79は下
降して移動テーブル11上面に近接状態となって排出側
移載部5が取り残した被研摩物40を移動テーブル11
の供給側移載部4側への移動動作(第1図矢印X方向)
の際に当該テーブル上から落下させる作用を果たす。Further, on the side where the discharge side transfer section of the polishing section 1 is arranged, there is provided an object to be polished 4 left behind by the discharge side transfer section 5 after the polishing process.
A polished object removing means 75 is provided which removes the 0 using the reciprocating motion of the moving table 11. As shown in FIG. 13, this polished object removing means 75 has a vertical slide guide 77 fixed to a support plate 76 fixed to the base 10 side, and the slide guide 77 moves the id 77 in the vertical direction. It is slidably penetrated. A metal exclusion member 79 is fixed to the lower end of the slide rod 78. A notch 80 is formed in the exclusion member 79 to avoid the id protrusion 60 on the movable table side. An air cylinder 81 is provided between the vertical slide guide 77 and the exclusion member 79, and when the air cylinder 81 moves linearly, the exclusion member 79 is in the raised position, and when it is extended, the exclusion member 79 is lowered to the upper surface of the movable table 11. The object to be polished 40 left behind by the discharge side transfer section 5 is transferred to the moving table 11.
Moving operation toward the supply side transfer section 4 side (arrow X direction in Figure 1)
It functions to cause the table to fall from the table.
前記研削液供給部7は、PIS1図に示すように、クリ
ーンタンク90、ダーティ−タンク91及び遠心分離機
92を有している。クリーンタンク90より研摩部1の
回転砥石15やワイパー66の部分に供給された清浄な
研削液は、回転砥石15等を冷却しかつ被研摩物40や
移動テーブル11上の汚れを流して汚れた研削液となっ
て移動テーブル11側よりグーティータンク91に回収
される。グーティータンク91内の研削液は遠心分離機
92に送られ、ここでろ過されて清浄な研削液となって
クリーンタンク90に供給される。The grinding fluid supply section 7 has a clean tank 90, a dirty tank 91, and a centrifugal separator 92, as shown in PIS 1. The clean grinding fluid supplied from the clean tank 90 to the rotary grindstone 15 and the wiper 66 of the polishing section 1 cools the rotary grindstone 15, etc., and washes away dirt on the object to be polished 40 and the movable table 11. The grinding fluid is collected from the movable table 11 side into the gooty tank 91. The grinding fluid in the gooty tank 91 is sent to a centrifuge 92, where it is filtered to become clean grinding fluid and supplied to the clean tank 90.
次に上記実施例の全体的な動作説明を行う。Next, the overall operation of the above embodiment will be explained.
供給側コンベア2Aで1列配列で移送されてきた被研摩
物40はコンベア2A先端部で被研摩物分離機構3OA
により一群の被研摩物40に分離され、これらがぼり取
り処理部6のチャック42で保持されてコンベア2B方
向に移送される途中において研摩ディスク43による底
面のばり取り処理を受ける。前記チャック42で取り残
した被研摩物40は、分B磯構3OAのストッパ33の
第6図仮想線Q位置への後退上昇位置への動きによりコ
ンベア2Aの走行に伴いコンベア先端側から落下する。The objects to be polished 40 transferred in a single row on the supply side conveyor 2A are transferred to the object separation mechanism 3OA at the tip of the conveyor 2A.
The objects 40 to be polished are separated into a group of objects 40, held by the chuck 42 of the deburring processing section 6, and subjected to a deburring process on the bottom surface by a polishing disk 43 while being transported toward the conveyor 2B. The object to be polished 40 left behind by the chuck 42 falls from the tip side of the conveyor as the conveyor 2A travels due to the movement of the stopper 33 of the block B isostructure 3OA to the position of the imaginary line Q in FIG.
前記チャック42で保持されて底面のばり取り処理を受
けた一群の被研摩物40はコンベア2B上に移載され、
コンベア2Bの搬送動作によりコンベア2B先端部に達
し、被研摩物分離機構30Bにより一群の被研摩物40
に分離される。これらは、供給側移載部4の左右のチャ
ック55A。The group of objects 40 to be polished held by the chuck 42 and subjected to the deburring process on the bottom surface is transferred onto the conveyor 2B,
The conveyance operation of the conveyor 2B reaches the tip of the conveyor 2B, and the object separation mechanism 30B collects a group of objects 40 to be polished.
separated into These are the left and right chucks 55A of the supply side transfer section 4.
55Bで2列に分けて保持されて研摩部1の移動テーブ
ル11(第1図実線のように右側に移動した状態となっ
ている)上に移載される。その際、チャック55A、5
5Bで保持されずに残った被研摩物40は、分離tiM
1130Bのストッパ33の後退上昇位置への動きによ
りコンベア2Bの走行に伴いコンベア先端側から落下す
る。55B, and are held in two rows and transferred onto the moving table 11 of the polishing section 1 (which has been moved to the right as shown by the solid line in FIG. 1). At that time, chucks 55A, 5
The object to be polished 40 remaining without being held by 5B is separated tiM
Due to the movement of the stopper 33 of 1130B to the retracted and raised position, the stopper 33 falls from the conveyor tip side as the conveyor 2B runs.
研摩部1の移動テーブル11上に移載された2列配置の
被研摩物40は、研摩面が上となった状態で移動テーブ
ル11の電磁チャック及び機械的なりランプ・アーム6
1にて吸着固定され、移動テーブル11の排出側移載部
5側への移動動作(第円盤状回転砥石15の第2図に示
した回転中心軸Zが移動テーブル11の上面への垂線に
完全に一致している場合、被研摩物40の研摩面は第1
4図(A)のようにあやめ状態となり、回、転中心軸Z
を僅かに傾けた場合は同図(B)のようにあやめ・状態
とはならない。The objects 40 to be polished arranged in two rows are transferred onto the movable table 11 of the polishing section 1, and the objects 40 to be polished are placed in the electromagnetic chuck and mechanical ramp arm 6 of the movable table 11 with their polished surfaces facing up.
1, and the movable table 11 is moved toward the discharge side transfer section 5 (the rotation center axis Z of the disc-shaped rotary grindstone 15 shown in FIG. 2 is perpendicular to the top surface of the movable table 11). If they match perfectly, the polished surface of the object to be polished 40 is the first
As shown in Fig. 4 (A), it becomes a iris state, and the center axis of rotation Z
If it is tilted slightly, the iris state will not occur as shown in Figure (B).
移動テーブル11の矢印AX方向の移動が完了してテー
ブル上の総ての被研摩物4oが研摩を受けた後、排出側
移載部5の2対のチャックにより2列配置で被研摩物4
oは挟持され、排出側コンベア3に1列配置で移載され
る。そして、排出側コンベア3の搬送動作により先端側
に送出される。After the movement of the moving table 11 in the direction of the arrow AX is completed and all the objects 4o on the table have been polished, the objects 4o to be polished are arranged in two rows by the two pairs of chucks of the discharge side transfer section 5.
o are pinched and transferred to the discharge side conveyor 3 in a single row arrangement. Then, by the conveying operation of the discharge side conveyor 3, it is delivered to the leading end side.
なお、排出側移載部5のチャックで保持されないで残っ
た被研摩物4oは、被研摩物排除手段75の排除部材7
9を移動テーブル11に近接した下降位置とすることに
より、移動テーブル11の矢印X方向の移動によってテ
ーブルがら落下する。Note that the object to be polished 4o remaining without being held by the chuck of the discharge side transfer section 5 is removed by the removal member 7 of the object to be polished removal means 75.
9 is set at a lowered position close to the movable table 11, the table falls as the movable table 11 moves in the direction of the arrow X.
(発明の効果)
以上説明したように、本発明の研摩装置によれば、被研
摩物の供給から、研摩及び排出に至るまでの各工程を自
動的に実行でき、省力化及び研摩作業の効率化を図るこ
とができる。さらに、テーブルに対して被研摩物を確実
かつ正確に保持でき、被研摩物の底面ぼり取り処理等を
研摩前に実行したりすることで、高精度の研摩加工を実
現できる。(Effects of the Invention) As explained above, according to the polishing apparatus of the present invention, each process from supplying the object to be polished to polishing and discharging can be automatically executed, resulting in labor saving and efficiency of polishing work. It is possible to aim for Furthermore, the object to be polished can be held against the table reliably and accurately, and by performing processing such as removing the bottom surface of the object before polishing, highly accurate polishing can be achieved.
#1図は本発明に係る研摩装置の実施例を示す平面図、
第2図は同正面図、第3図は同側面図、第4図は実施例
における研摩部のリニアスケール部分を示す側面図、第
5図は被研摩物分離機構部分を示す平面図、第6図は同
正面図、第7図はば9取り処理部の正面図、!@8図は
供給側移載部を示す側面図、第9図は供給側移載部の動
作説明図、第10図は排出側移載部の動作説明図、第1
1図はワイパー磯v1部分を示す正面図、第12図は同
側面図、第13図は被研摩物排除手段部分を示す正面図
、第14図は被研摩物の研摩面の状態を示す説明図であ
る。
1・・・研摩部、2A、2B・・・供給側コンベア、3
・・・排出側コンベア、4・・・供給側移載部、−5・
・・排出側移載部、6・・・ばり取り処理部、7・・・
研削液処理部、11・・・移動テーブル、15・・・円
盤状回転砥石、16.44,52・・・モータ、25・
・・リニアスケール、30 A、30 B、30 C・
・・被研摩物分離FIs、構、31・・・分離チャック
、33・・・ストッパ、40・・・被研摩物、41 ・
・・ロッドレスシリング、42.55A、55B・・・
チャック、43・・・研摩ディスク、56,70.81
・・・エアーシリンダ、60・・・ガイド用突条、65
・・・ワイパー機構、75・・・被研摩物排除機構。#1 is a plan view showing an embodiment of the polishing device according to the present invention;
FIG. 2 is a front view of the same, FIG. 3 is a side view of the same, FIG. 4 is a side view showing a linear scale portion of the polishing section in the embodiment, FIG. Figure 6 is a front view of the same, Figure 7 is a front view of the burr 9 removal processing section,! @ Figure 8 is a side view showing the supply side transfer unit, Figure 9 is an explanatory diagram of the operation of the supply side transfer unit, Figure 10 is an explanatory diagram of the operation of the discharge side transfer unit, and Figure 1
Fig. 1 is a front view showing the wiper rock v1 portion, Fig. 12 is a side view of the same, Fig. 13 is a front view showing the object removal means portion, and Fig. 14 is an explanation showing the state of the polished surface of the object to be polished. It is a diagram. 1... Polishing section, 2A, 2B... Supply side conveyor, 3
... Discharge side conveyor, 4... Supply side transfer section, -5.
...Discharge side transfer section, 6...Deburring processing section, 7...
Grinding fluid processing unit, 11... Moving table, 15... Disc-shaped rotating grindstone, 16.44, 52... Motor, 25.
・Linear scale, 30 A, 30 B, 30 C・
... Polished object separation FIs, structure, 31... Separation chuck, 33... Stopper, 40... Polished object, 41 ・
...Rodless Schilling, 42.55A, 55B...
Chuck, 43... Polishing disk, 56, 70.81
... Air cylinder, 60 ... Guide protrusion, 65
... Wiper mechanism, 75... Polished object removal mechanism.
Claims (7)
上の被研摩物を研摩する回転砥石とを有する研摩部と、
被研摩物を移送する供給側コンベアと、研摩加工後の被
研摩物を移送する排出側コンベアと、前記供給側コンベ
アより前記移動テーブル上に被研摩物を移載する供給側
移載部と、前記移動テーブルより前記排出側コンベア上
に研摩加工後の被研摩物を移載する排出側移載部とを備
えたことを特徴とする研摩装置。(1) A polishing section having a movable table that performs reciprocating motion and a rotary grindstone that polishes the object to be polished on the movable table;
a supply side conveyor that transfers the object to be polished; a discharge side conveyor that transfers the object to be polished after polishing; a supply side transfer section that transfers the object to be polished from the supply side conveyor onto the moving table; A polishing apparatus comprising: a discharge side transfer section for transferring a polished object from the movable table onto the discharge side conveyor.
理部を前記供給側コンベアの途中に設けた請求項1記載
の研摩装置。(2) The polishing apparatus according to claim 1, further comprising a deburring section for deburring the bottom surface of the object to be polished, provided in the middle of the supply conveyor.
いる請求項1記載の研摩装置。(3) The polishing apparatus according to claim 1, wherein the movable table has a guide protrusion on its upper surface.
ランプ手段が前記移動テーブルに設けられている請求項
3記載の研摩装置。(4) The polishing apparatus according to claim 3, wherein the movable table is provided with clamp means for clamping the object to be polished between the guide protrusions.
請求項1記載の研摩装置。(5) The polishing apparatus according to claim 1, wherein the movable table constitutes an electromagnetic chuck.
る少なくとも1個のチャックを有している請求項1記載
の研摩装置。(6) The polishing apparatus according to claim 1, wherein the supply side and discharge side transfer parts have at least one chuck for holding the object to be polished.
研摩物を前記移動テーブルの動きを利用して除去する排
除手段が昇降自在に設けられている請求項1記載の研摩
装置。(7) The polishing apparatus according to claim 1, wherein the polishing section is provided with a removing means that is movable up and down for removing the object to be polished left behind by the discharge side transfer section using the movement of the moving table.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1193762A JP2649846B2 (en) | 1989-07-26 | 1989-07-26 | Polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1193762A JP2649846B2 (en) | 1989-07-26 | 1989-07-26 | Polishing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0360959A true JPH0360959A (en) | 1991-03-15 |
JP2649846B2 JP2649846B2 (en) | 1997-09-03 |
Family
ID=16313387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1193762A Expired - Fee Related JP2649846B2 (en) | 1989-07-26 | 1989-07-26 | Polishing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2649846B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100370864B1 (en) * | 1998-12-02 | 2003-02-19 | 한국전기초자 주식회사 | Adhesive Device for Polishing Tools |
JP2008062321A (en) * | 2006-09-05 | 2008-03-21 | Taihei Seisakusho:Kk | Through-feed grinding method and apparatus |
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JPS60114458A (en) * | 1983-11-26 | 1985-06-20 | Nippon Kogaku Kk <Nikon> | Spherical face forming grinder for lens |
JPS6158269A (en) * | 1984-08-30 | 1986-03-25 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor device |
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KR100370864B1 (en) * | 1998-12-02 | 2003-02-19 | 한국전기초자 주식회사 | Adhesive Device for Polishing Tools |
JP2008062321A (en) * | 2006-09-05 | 2008-03-21 | Taihei Seisakusho:Kk | Through-feed grinding method and apparatus |
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JP2649846B2 (en) | 1997-09-03 |
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