JPH0360959A - Polishing device - Google Patents

Abstract

PURPOSE:To automate respective process from the feeding to the polishing of objective and the discharging by providing a transfer part on the feed side transfer a substance to be polished from a conveyor on the feed side to a moving table and a transfer part on the discharge side to transfer the substance to be polished, polishing of which is completed, from the moving table to a conveyor on the discharge side. CONSTITUTION:A substance to be polished is fed to a polishing part 1 through a conveyor 2A on the feed side and a transfer part 4 on the feed side, and the substance to be polished polishing of which is completed at a polishing part 1 is discharged through a transfer part 5 on the discharge side and a conveyor 3 on the discharge side. As a result, no manual work is needed at each process. Thus, an extremely effective polishing work can be executed. Further, by executing removal of bottom burr of the substance to be polished by means of a processing part 6 before the substance to be polished is transferred to the polishing part 1 and reliably holding the substance to be polished on a moving table 11 of the polishing part 1, a high precise polishing work can be effected.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polishing apparatus for automatically polishing objects to be polished such as 7. light cores.

(Prior art and problems to be solved by the invention) Conventionally,
No device has been proposed that automatically carries out the process from carrying in, polishing, and carrying out ferrite cores, and conventional polishing devices have had troublesome manual operations such as feeding and taking out ferrite cores.

In view of the above, an object of the present invention is to provide a polishing apparatus that can automatically execute the steps from supplying the object to be polished to polishing and discharging the object.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a polishing section having a movable table that performs reciprocating motion, a rotary grindstone that polishes an object to be polished on the movable table, and a supply-side conveyor for transporting the abrasive material; a discharge-side conveyor for transporting the polished object after polishing; a supply-side transfer section for transferring the polishing object from the supply-side conveyor onto the movable table; The vI holder is provided with a discharge side transfer section for transferring the polished object from the movable table onto the discharge side conveyor.

(Function) In the polishing apparatus of the present invention, the object to be polished is supplied to the polishing section via the supply side conveyor and the supply side transfer section, and the object to be polished after being polished in the polishing section is transferred to the discharge side transfer section and the polishing section. It is designed to be discharged via a conveyor on the discharge side, and manual labor is not required in each of these steps. Therefore, polishing can be performed extremely efficiently. In addition, before transferring the object to the polishing section, the bottom surface of the object to be polished should be removed.
By reliably holding the object to be polished on the movable table of the polishing section, highly accurate polishing can be performed.

(Example) Hereinafter, an example of the polishing apparatus according to the present invention will be described with reference to the drawings.

Figures 1 to 3 show the overall configuration of a polishing device, and the polishing device has a rotating whetstone for polishing an object to be polished, such as a U-shaped or rectangular 7-elite core. section 1, and supply side conveyors 2A and 2 for transporting objects to be polished.
B, a discharge side conveyor 3 that transfers the object to be polished after polishing, a supply side transfer section 4 that transfers the object to be polished from the supply side conveyor 2B to the polishing section 1, and a A discharge side transfer section 5 that transfers the polished object after polishing onto the discharge side conveyor 3, and the supply side conveyor 2A.

2B, a deburring processing section 6 is provided to remove burrs from the object to be polished, and a grinding fluid supply section 7 is provided to supply grinding fluid to the polishing section 1.

The polishing section 1 has a movable table 11 that is arranged to be slidable in the horizontal direction with respect to a base 10 and that performs reciprocating motion at a constant period.

Further, four guide rods 12 are vertically fixed on the base 10, and a ball bush 1 fixed on the lifting table 13.
4 is slidably fitted on each guide rod 12.

The rotating shaft of a disk-shaped rotating grindstone 15 is supported on the lifting table 13, and the rotating grinding wheel 1 is moved by a motor 16 attached to the lifting table 13.
5 is designed to be rotationally driven.

A fixed base 20 is fixed to the upper end of the guide rod 12, and a height adjustment mechanism 21 for adjusting the height of the elevating base 13 is attached to the fixed base 20. This adjustment mechanism 21 is composed of, for example, a ball screw that is screwed into a nut on the lifting table 13 side.

As shown in FIG. do.

The center of rotation Z of the disc-shaped rotary grindstone 15 may be made to completely coincide with the perpendicular line to the top surface of the movable table 11, or may be inclined by a small angle θ as shown in FIG. The angle θ is, for example, about 0'1'12''. The reason for inclining in this way will be described later.

The supply side conveyors 2A and 2B are both general belt conveyors, and are used to transport objects to be polished before being processed in one direction of the polishing section. Each conveyor 2A.

At the tip of the polishing object separation mechanism 30A, 3, which is equipped with a separation chuck 31, first and second optical sensors 32A, 32B, and a stopper 33, as shown in FIGS.
0B is placed.

The supply side conveyors 2A and 2B are arranged so that the surface to be polished of the object 4o, such as a U-shaped or rectangular parallelepiped ferrite core, is placed upward.
The object to be polished 4o is transferred one after another with the longitudinal direction of the object to be polished perpendicular to the conveyance direction, and the separation chuck 31 clamps the object to be polished 40 on the conveyor and controls the flow of the object to be polished. It has the function of damming up.

The stopper 33 moves from the forward position on the end of the conveyor indicated by the solid line P in FIG. 6 through the imaginary line Qti- to the retracted and raised position of the imaginary aR, and conversely from the retracted and raised position of the imaginary aR to the imaginary #! It performs a reciprocating motion toward the forward position indicated by the solid line P via Q.
In the forward position indicated by the solid line P, the group of objects 40 to be polished that have passed through the separation chuck 31 is held at the end of the conveyor.

After both the first and second optical sensors 32A and 32B detect the presence of the object to be polished and a predetermined period of time (based on timer settings) has elapsed, the separation chuck 31 clamps the object 40 and polishes the other object. The object to be polished 4 is blocked by blocking the object and moving the stopper 33 toward the end of the conveyor (actual #iP position).
Separation of a group of objects 0, holding and transferring a group of objects to be polished by the chuck of the scraping processing section 6 or the supply side transfer section 4, and remaining unchucked due to the retreating and rising of the stopper 33 <Vi phantom line R) A series of operations including dropping the object to be polished from the conveyor and releasing the dam of the object to be polished by the separation chuck 31 are executed.

Note that there is also a polished object separation mechanism 30 having a similar mechanism at the tip of the discharge side conveyor 3 that transfers the polished objects after polishing.
C is placed. This is to enable automatic transfer to further steps such as cleaning of the object to be polished.

FIG. 7 shows a deburring section 6 disposed between the supply conveyors 2A and 28 for deburring the object to be polished.
shows. The purpose of providing this deburring processing section 6 is that when the object to be polished 40 is a sintered body such as a ferrite core, foreign matter adhering to the bottom surface (0.1 to 0.3 m
The purpose of this process is to remove material particles of about 500 yen (mm) in size, as well as powder that comes out from the tray on which the objects to be fired are placed during firing.If the polished surface (the surface opposite to the bottom surface) is polished with foreign matter still attached to the bottom surface, the polishing accuracy will be reduced. Prevent things from becoming sloppy.

This deburring processing section 6 includes a rodless cylinder 41 disposed between the conveyors 2A and 28, and horizontal movement from the tip of the conveyor 2A to the rear end of the conveyor 2B and return in the opposite direction by the rodless cylinder 41. It includes a chuck 42 for performing movement, a deburring abrasive disk (circular sand vapor) 43, and a rotation drive motor 44 for the abrasive disk.

The chuck 42 holds a group of objects to be polished 40 separated at the end of the conveyor 2A by the object separation mechanism 3OA and moves from the top of the conveyor 2A toward the conveyor 2B. is applied to the polishing disk 43 to remove burrs from the bottom surface, and then the group of objects to be polished is transferred onto the conveyor 2B. Here, the abrasive disk axis S is inclined with respect to the vertical axis by an angle φ (where φ is 3 to 5 degrees). Due to this inclination, a group of objects to be polished 40 separated at the end of the conveyor 2AL:r) is held in the chuck 42.
When holding the object, the polishing disk 43 is pressed against the bottom surface of the object even if there are variations in the holding position (even if the object moves in and out).

FIG. 8 and FIG. 9 show the structure and operation of the supply side transfer section 4, and the supply side transfer section 4 separates the polished objects at the end of the supply side conveyor 2B by a separation mechanism 30B. It has a function of holding a group of polished objects 40 and transferring them onto the moving table 11 of the polishing section 1.

The supply side transfer unit 4 includes a fixed support frame 50 arranged and fixed horizontally at a predetermined height with respect to the base 10, and the fixed support frame 5.
0, a servo motor 52 that rotationally drives the ball screw 51, and a nut that is screwed onto the ball screw 51 and moves laterally by the rotation of the ball screw 51. frame 53 and the horizontal movement frame 53
An elevating member 54 is attached to the elevating member 54 so that it can be raised and lowered, and two pairs of chucks 55 A are attached to the elevating member 54.
, 55 B. The lifting member 54 is driven up and down by an air cylinder 56 attached to the horizontal movement frame 53.
and each chuck 55A.

Opening and closing of the chucks 55B are performed by air cylinders (not shown) disposed on the side of the elevating member 54, and furthermore, the mutual distance between the chucks 55A and 55B can be changed using another air cylinder.

Now, while the objects 40 to be polished are arranged in one row on the conveyors 2A and 2B, the objects 40 to be polished are arranged in two rows on the movable table 11 of the polishing section 1.

For this reason, the left and right chucks 55A and 55B are each opened, the mutual distance between the chucks 55A and 55B is also increased, and the supply side transfer section 4 waits for the object to be polished 40 to arrive, and the end of the conveyor 2B is The object to be polished 40 separated at
The first half of the group of objects to be polished is held by the left chuck 55A as shown in FIG. 9(A), and then the horizontal movement frame 53 is moved by a predetermined amount to move the second half of the group to the right side as shown in FIG. 9(B). It is clamped with a chuck 55B. In this way, the objects to be polished 40 held in two rows in the supply transfer section 4 are transferred above the movable table 11 by the lifting operation of the lifting member 54 and the lateral movement of the lateral movement frame 53, and are then moved upward by the lifting member 54. By the lowering operation of 54, it comes to a position close to the top of the moving table 11 as shown in FIG. 5(C). However, at this time, the chuck is still held, and the objects to be polished 40 are placed on the left and right sides of the guide protrusion 60 at the center of the movable table 11.

Thereafter, the distance between the chucks 55A and 55B is narrowed, and the left and right polished objects 40 are brought closer to each other with respect to the guide protrusion 60 and brought into contact with each other as shown in FIG.
, 55B are lowered, and the objects to be polished 40 arranged in two rows are placed on the moving table 11 as shown in FIG.

The movable table 11 constitutes an electromagnetic chuck (with a built-in electromagnet), which attracts the magnetic object 40 to be polished onto the table by electromagnetic force, and after the chucks 55A and 55B release the object to be polished and return to the upward position, further As shown in FIG. 9(F), the objects to be polished 40 arranged in two rows are mechanically sandwiched between the guide ridges 60 by the clamp arm 61 provided on the movable table 11, and mechanically held against the table 11. Fixed to.

The mechanism itself of the discharge side transfer section 5 that transfers the polished object 40 from the polishing section 1 onto the discharge side conveyor 3 is the same as that of the supply side transfer section 4 described above. In this operation, after the clamp arm 61 of the movable table 11 is opened and the electromagnetic chuck is turned off, the group of objects 40 to be polished arranged in two rows as shown in FIG.
55B at the same time and chuck 5 as shown in the same figure (B).
The chuck 5 on the right side is moved upward and horizontally while widening the gap between 5A and 55B, and the chuck 5 on the right side is placed on the discharge side conveyor 3 as shown in the same figure (C).
5B, and then place one row of the objects 40 on the left chuck 55A so that the objects 40 to be polished are arranged in one row on the conveyor 3. Transfer.

A wiper 8 as shown in FIGS. 11 and 12 is provided on the side where the supply side transfer section of the polishing section 1 is arranged. A mechanism 65 is provided for wiping the top of the movable table 11 with a rubber wiper 66. In those figures, base 1
The vertical slide guide 6 is attached to the support plate 67A fixed on the 0 side.
7 is fixed, and a slide rod 68 passes through the slide guide 67 in a vertically slidable manner. A mounting member 69 is fixed to the lower end of the slide rod 68,
A rubber wiper 66 is fixed to the mounting member 69. An air cylinder 70 is provided between the vertical slide id 67 and the mounting member 69, and when the air cylinder 70 moves linearly, the wiper 66 is in the raised position, and when it extends, the wiper 66 is in the raised position.
6 descends and comes into pressure contact with the movable table 11 to perform the required wiping operation. A notch 72 is formed in the wiper 66 to avoid the guide protrusion 60 on the movable table side. This wiping operation of the wiper 66 is normally performed when the movable table 11 is moved toward the supply side transfer section 4 (movement in the direction of arrow X in FIG. 1).

Incidentally, a grinding liquid supply lower 1 is also provided near the lower end of the wiper 66 for supplying grinding liquid onto the movable table 11.

Further, on the side where the discharge side transfer section of the polishing section 1 is arranged, there is provided an object to be polished 4 left behind by the discharge side transfer section 5 after the polishing process.
A polished object removing means 75 is provided which removes the 0 using the reciprocating motion of the moving table 11. As shown in FIG. 13, this polished object removing means 75 has a vertical slide guide 77 fixed to a support plate 76 fixed to the base 10 side, and the slide guide 77 moves the id 77 in the vertical direction. It is slidably penetrated. A metal exclusion member 79 is fixed to the lower end of the slide rod 78. A notch 80 is formed in the exclusion member 79 to avoid the id protrusion 60 on the movable table side. An air cylinder 81 is provided between the vertical slide guide 77 and the exclusion member 79, and when the air cylinder 81 moves linearly, the exclusion member 79 is in the raised position, and when it is extended, the exclusion member 79 is lowered to the upper surface of the movable table 11. The object to be polished 40 left behind by the discharge side transfer section 5 is transferred to the moving table 11.
Moving operation toward the supply side transfer section 4 side (arrow X direction in Figure 1)
It functions to cause the table to fall from the table.

The grinding fluid supply section 7 has a clean tank 90, a dirty tank 91, and a centrifugal separator 92, as shown in PIS 1. The clean grinding fluid supplied from the clean tank 90 to the rotary grindstone 15 and the wiper 66 of the polishing section 1 cools the rotary grindstone 15, etc., and washes away dirt on the object to be polished 40 and the movable table 11. The grinding fluid is collected from the movable table 11 side into the gooty tank 91. The grinding fluid in the gooty tank 91 is sent to a centrifuge 92, where it is filtered to become clean grinding fluid and supplied to the clean tank 90.

Next, the overall operation of the above embodiment will be explained.

The objects to be polished 40 transferred in a single row on the supply side conveyor 2A are transferred to the object separation mechanism 3OA at the tip of the conveyor 2A.
The objects 40 to be polished are separated into a group of objects 40, held by the chuck 42 of the deburring processing section 6, and subjected to a deburring process on the bottom surface by a polishing disk 43 while being transported toward the conveyor 2B. The object to be polished 40 left behind by the chuck 42 falls from the tip side of the conveyor as the conveyor 2A travels due to the movement of the stopper 33 of the block B isostructure 3OA to the position of the imaginary line Q in FIG.

The group of objects 40 to be polished held by the chuck 42 and subjected to the deburring process on the bottom surface is transferred onto the conveyor 2B,
The conveyance operation of the conveyor 2B reaches the tip of the conveyor 2B, and the object separation mechanism 30B collects a group of objects 40 to be polished.
separated into These are the left and right chucks 55A of the supply side transfer section 4.

55B, and are held in two rows and transferred onto the moving table 11 of the polishing section 1 (which has been moved to the right as shown by the solid line in FIG. 1). At that time, chucks 55A, 5
The object to be polished 40 remaining without being held by 5B is separated tiM
Due to the movement of the stopper 33 of 1130B to the retracted and raised position, the stopper 33 falls from the conveyor tip side as the conveyor 2B runs.

The objects 40 to be polished arranged in two rows are transferred onto the movable table 11 of the polishing section 1, and the objects 40 to be polished are placed in the electromagnetic chuck and mechanical ramp arm 6 of the movable table 11 with their polished surfaces facing up.
1, and the movable table 11 is moved toward the discharge side transfer section 5 (the rotation center axis Z of the disc-shaped rotary grindstone 15 shown in FIG. 2 is perpendicular to the top surface of the movable table 11). If they match perfectly, the polished surface of the object to be polished 40 is the first
As shown in Fig. 4 (A), it becomes a iris state, and the center axis of rotation Z
If it is tilted slightly, the iris state will not occur as shown in Figure (B).

After the movement of the moving table 11 in the direction of the arrow AX is completed and all the objects 4o on the table have been polished, the objects 4o to be polished are arranged in two rows by the two pairs of chucks of the discharge side transfer section 5.
o are pinched and transferred to the discharge side conveyor 3 in a single row arrangement. Then, by the conveying operation of the discharge side conveyor 3, it is delivered to the leading end side.

Note that the object to be polished 4o remaining without being held by the chuck of the discharge side transfer section 5 is removed by the removal member 7 of the object to be polished removal means 75.
9 is set at a lowered position close to the movable table 11, the table falls as the movable table 11 moves in the direction of the arrow X.

(Effects of the Invention) As explained above, according to the polishing apparatus of the present invention, each process from supplying the object to be polished to polishing and discharging can be automatically executed, resulting in labor saving and efficiency of polishing work. It is possible to aim for Furthermore, the object to be polished can be held against the table reliably and accurately, and by performing processing such as removing the bottom surface of the object before polishing, highly accurate polishing can be achieved.

[Brief explanation of drawings]

#1 is a plan view showing an embodiment of the polishing device according to the present invention;
FIG. 2 is a front view of the same, FIG. 3 is a side view of the same, FIG. 4 is a side view showing a linear scale portion of the polishing section in the embodiment, FIG. Figure 6 is a front view of the same, Figure 7 is a front view of the burr 9 removal processing section,! @ Figure 8 is a side view showing the supply side transfer unit, Figure 9 is an explanatory diagram of the operation of the supply side transfer unit, Figure 10 is an explanatory diagram of the operation of the discharge side transfer unit, and Figure 1
Fig. 1 is a front view showing the wiper rock v1 portion, Fig. 12 is a side view of the same, Fig. 13 is a front view showing the object removal means portion, and Fig. 14 is an explanation showing the state of the polished surface of the object to be polished. It is a diagram. 1... Polishing section, 2A, 2B... Supply side conveyor, 3
... Discharge side conveyor, 4... Supply side transfer section, -5.
...Discharge side transfer section, 6...Deburring processing section, 7...
Grinding fluid processing unit, 11... Moving table, 15... Disc-shaped rotating grindstone, 16.44, 52... Motor, 25.
・Linear scale, 30 A, 30 B, 30 C・
... Polished object separation FIs, structure, 31... Separation chuck, 33... Stopper, 40... Polished object, 41 ・
...Rodless Schilling, 42.55A, 55B...
Chuck, 43... Polishing disk, 56, 70.81
... Air cylinder, 60 ... Guide protrusion, 65
... Wiper mechanism, 75... Polished object removal mechanism.

Claims (7)

[Claims] (1) A polishing section having a movable table that performs reciprocating motion and a rotary grindstone that polishes the object to be polished on the movable table;
a supply side conveyor that transfers the object to be polished; a discharge side conveyor that transfers the object to be polished after polishing; a supply side transfer section that transfers the object to be polished from the supply side conveyor onto the moving table; A polishing apparatus comprising: a discharge side transfer section for transferring a polished object from the movable table onto the discharge side conveyor. (2) The polishing apparatus according to claim 1, further comprising a deburring section for deburring the bottom surface of the object to be polished, provided in the middle of the supply conveyor. (3) The polishing apparatus according to claim 1, wherein the movable table has a guide protrusion on its upper surface. (4) The polishing apparatus according to claim 3, wherein the movable table is provided with clamp means for clamping the object to be polished between the guide protrusions. (5) The polishing apparatus according to claim 1, wherein the movable table constitutes an electromagnetic chuck. (6) The polishing apparatus according to claim 1, wherein the supply side and discharge side transfer parts have at least one chuck for holding the object to be polished. (7) The polishing apparatus according to claim 1, wherein the polishing section is provided with a removing means that is movable up and down for removing the object to be polished left behind by the discharge side transfer section using the movement of the moving table.