JP2649846B2 - Polishing equipment - Google Patents

Polishing equipment

Info

Publication number
JP2649846B2
JP2649846B2 JP1193762A JP19376289A JP2649846B2 JP 2649846 B2 JP2649846 B2 JP 2649846B2 JP 1193762 A JP1193762 A JP 1193762A JP 19376289 A JP19376289 A JP 19376289A JP 2649846 B2 JP2649846 B2 JP 2649846B2
Authority
JP
Japan
Prior art keywords
polished
polishing
moving table
supply
conveyor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1193762A
Other languages
Japanese (ja)
Other versions
JPH0360959A (en
Inventor
謙治 山田
誠吉 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP1193762A priority Critical patent/JP2649846B2/en
Publication of JPH0360959A publication Critical patent/JPH0360959A/en
Application granted granted Critical
Publication of JP2649846B2 publication Critical patent/JP2649846B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、フェライトコア等の被研摩物を自動研摩す
るための研摩装置に関する。
Description: TECHNICAL FIELD The present invention relates to a polishing apparatus for automatically polishing an object to be polished such as a ferrite core.

(従来の技術及び発明が解決しようとする課題) 従来、フェライトコアの搬入から研摩加工及び搬出に
至るまでを自動的に行う装置は提案されておらず、従来
の研摩装置はフェライトコアの供給、取り出し等に手作
業を伴う煩わしさがあった。
(Problems to be Solved by the Related Art and the Invention) Conventionally, there has not been proposed an apparatus for automatically performing operations from loading of a ferrite core to polishing and unloading. There was troublesome manual work for taking out and the like.

本発明は、上記の点に鑑み、被研摩物の供給から研摩
及び排出に至る工程を自動的に実行可能な研摩装置を提
供することを目的とする。
SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a polishing apparatus capable of automatically executing a process from supply of a workpiece to polishing and discharge.

(課題を解決するための手段) 上記目的を達成するために、本発明は、往復運動を行
う移動テーブルと、該移動テーブル上の被研摩物を研摩
する回転砥石とを有する研摩部と、被研摩物を移送する
供給側コンベアと、研摩加工後の被研摩物を移送する排
出側コンベアと、前記供給側コンベアより前記移動テー
ブル上に被研摩物を移載する供給側移載部と、前記移動
テーブルより前記排出側コンベア上に研摩加工後の被研
摩物を移載する排出側移載部とを備えており、さらに前
記排出側移載部で取り残した被研摩物を前記移動テーブ
ルの動きを利用して除去する排除手段を前記研摩部に昇
降自在に設けた構成としている。
(Means for Solving the Problems) In order to achieve the above object, the present invention provides a polishing unit having a reciprocating moving table, a rotary grindstone for polishing an object to be polished on the moving table, A supply-side conveyor for transferring the polished object, a discharge-side conveyor for transferring the polished object after polishing, a supply-side transfer unit for transferring the polished object from the supply-side conveyor onto the moving table, And a discharge-side transfer unit for transferring the polished work to the discharge-side conveyor from the transfer table, and further moving the polished work remaining in the discharge-side transfer unit to the movement of the transfer table. An elimination means for removing by using the polisher is provided so as to be movable up and down in the polishing section.

上記研摩装置において、被研摩物の底面のばり取り処
理を行うばり取り処理部を前記供給側コンベアの途中に
設け、被研摩物の底面を下にして当該被研摩物を前記移
動テーブル上に固定する構成とすることができる。
In the above-described polishing apparatus, a deburring unit for performing deburring of the bottom surface of the object to be polished is provided in the middle of the supply side conveyor, and the object to be polished is fixed on the moving table with the bottom surface of the object to be polished down. Configuration.

また、前記移動テーブルは上面にガイド用突条を有
し、かつ前記ガイド用突条との間で被研摩物を挟持する
クランプ手段が前記移動テーブルに設けられている構成
としてもよく、さらに、被研摩物が磁性体である場合に
前記移動テーブルが該被研摩物を吸着する電磁チャック
を構成するようにしてもよい。
Further, the moving table may have a guide ridge on an upper surface thereof, and the moving table may be provided with clamping means for clamping the object to be polished between the guide ridge and the moving table. When the object to be polished is a magnetic material, the moving table may constitute an electromagnetic chuck for attracting the object to be polished.

前記供給側及び排出側移載部は被研摩物を挟持する少
なくとも1個のチャックを有する構成とすることができ
る。
The supply-side and discharge-side transfer units may be configured to have at least one chuck for holding the workpiece.

(作用) 本発明の研摩装置においては、被研摩物は供給側コン
ベア及び供給側移載部を経て研摩部に供給され、研摩部
にて研摩加工された被研摩物は排出側移載部及び排出側
コンベアを経て排出されるようになっており、これらの
各工程において手作業を必要としない。従って、極めて
効率的に研摩加工を実行できる。また、研摩部に移載す
る前に被研摩物の底面ばり取り処理を実行しておくこ
と、及び研摩部の移動テーブル上に被研摩物を確実に保
持しておくことにより、高精度の研摩加工ができる。さ
らに、前記研摩部に設けた排除手段によって、前記排出
側移載部で取り残した被研摩物を前記移動テーブルから
除去でき、前記移動テーブル上に研摩加工後の被研摩物
が倒れた状態等で残って以後の処理に不都合をきたす事
態を未然に防止できる。
(Operation) In the polishing apparatus of the present invention, the object to be polished is supplied to the polishing section via the supply side conveyor and the supply side transfer section, and the object to be polished by the polishing section is transferred to the discharge side transfer section and the polishing section. The paper is discharged through the discharge conveyor, and no manual work is required in each of these steps. Therefore, polishing can be performed extremely efficiently. In addition, by performing deburring on the bottom surface of the workpiece before transferring it to the polishing section, and by securely holding the workpiece on the moving table of the polishing section, high-precision polishing is possible. Can be processed. Further, by the removing means provided in the polishing section, the object to be polished left in the discharge side transfer section can be removed from the moving table, and the object to be polished on the moving table falls down on the moving table. It is possible to prevent a situation in which the remaining processing causes inconvenience in the subsequent processing.

(実施例) 以下、本発明に係る研摩装置の実施例を図面に従って
説明する。
(Embodiment) Hereinafter, an embodiment of the polishing apparatus according to the present invention will be described with reference to the drawings.

第1図乃至第3図は研摩装置の全体構成を示し、研摩
装置は、コ字状や直方体状のフェライトコア等の被研摩
物を研摩する回転砥石を有していて研摩処理を実行する
研摩部1と、被研摩物を移送する供給側コンベア2A,2B
と、研摩加工後の被研摩物を移送する排出側コンベア3
と、前記供給側コンベア2Bより研摩部1に被研摩物を移
載する供給側移載部4と、前記研摩部1より前記排出側
コンベア3上に研摩加工後の被研摩物を移載する排出側
移載部5と、前記供給側コンベア2A,2B間に配置されて
前記被研摩物のばり取り処理を行うばり取り処理部6
と、前記研摩部1に研削液を供給する研削液供給部7と
を備えている。
FIGS. 1 to 3 show the overall structure of a polishing apparatus. The polishing apparatus has a rotary grindstone for polishing an object to be polished, such as a U-shaped or rectangular parallelepiped ferrite core, and performs a polishing process. Unit 1 and supply-side conveyors 2A and 2B for transferring the material to be polished
And a discharge side conveyor 3 for transferring the polished material after polishing.
And a supply-side transfer unit 4 for transferring an object to be polished from the supply-side conveyor 2B to the polishing unit 1, and a polished object to be polished from the polishing unit 1 onto the discharge-side conveyor 3. A deflashing processing unit 6 disposed between the discharge-side transfer unit 5 and the supply-side conveyors 2A and 2B for performing deburring processing of the object to be polished;
And a grinding fluid supply unit 7 for supplying a grinding fluid to the polishing unit 1.

前記研摩部1は、基台10に対し水平方向に摺動自在に
配置されていて、一定周期で往復運動を行う移動テーブ
ル11を有している。
The polishing section 1 has a moving table 11 that is slidably arranged in a horizontal direction with respect to a base 10 and that reciprocates at a constant cycle.

また、4本のガイドロッド12が基台10上に垂直に立設
固定され、昇降台13に固定されたボールブッシュ14が各
ガイドロッド12に摺動自在にはめられている。昇降台13
には円盤状回転砥石15の回転軸が軸支され、昇降台13に
取り付けられたモータ16で回転砥石15は回転駆動される
ようになっている。
In addition, four guide rods 12 are vertically installed and fixed on the base 10, and ball bushes 14 fixed to the elevating table 13 are slidably fitted on the respective guide rods 12. Lifting table 13
A rotating shaft of a disk-shaped rotary grindstone 15 is rotatably supported, and the rotary grindstone 15 is driven to rotate by a motor 16 mounted on a lift 13.

前記ガイドロッド12の上端には固定台20が固定され、
該固定台20に前記昇降台13の高さを調整するための高さ
調整機構21が取り付けられている。この調整機構21は例
えば昇降台13側のナットに螺合するボール螺子等で構成
される。
A fixed base 20 is fixed to the upper end of the guide rod 12,
A height adjusting mechanism 21 for adjusting the height of the elevating table 13 is attached to the fixed table 20. The adjustment mechanism 21 is configured by, for example, a ball screw or the like that is screwed into a nut on the lifting platform 13 side.

第4図に示すように、前記昇降台13はリニアスケール
25に直結され、該リニアスケール25を見て前記移動テー
ブル11とこれに対向している回転砥石15との間隔、すな
わち研摩量を任意設定する。
As shown in FIG. 4, the elevator 13 is a linear scale.
The distance between the moving table 11 and the rotating grindstone 15 facing the moving table 11, which is directly connected to the linear scale 25, that is, the polishing amount is arbitrarily set.

なお、前記円盤状回転砥石15の回転中心軸Zは移動テ
ーブル11の上面への垂線に完全に一致させるか、あるい
は第2図の如く微小角度θだけ傾斜させる。角度θは例
えば0°1′12″程度である。このように傾斜させる理
由は後述する。
The rotation center axis Z of the disc-shaped rotary grindstone 15 is made to completely coincide with the perpendicular to the upper surface of the moving table 11, or is inclined by a small angle θ as shown in FIG. The angle θ is, for example, about 0 ° 1′12 ″ The reason for such an inclination will be described later.

供給側コンベア2A,2Bはいずれも一般的なベルトコン
ベアであり、加工前の被研摩物を研摩部1方向に移送す
るものである。各コンベア2A,2Bの先端部には第5図及
び第6図に示すような分離チャック31、第1及び第2の
光センサ32A,32B及びストッパ33を具備した被研摩物分
離機構30A,30Bが配置されている。
Each of the supply-side conveyors 2A and 2B is a general belt conveyor, and transfers an object to be polished before processing toward the polishing section 1. At the tip of each of the conveyors 2A and 2B, a polished object separating mechanism 30A and 30B having a separation chuck 31, first and second optical sensors 32A and 32B, and a stopper 33 as shown in FIGS. Is arranged.

前記供給側コンベア2A,2Bは、コ字状や直方体状のフ
ェライトコア等の被研摩物40の被研摩面を上にし、かつ
被研摩物長手方向を搬送方向に直角に配置した状態で次
々と被研摩物40を移送するものであり、前記分離チャッ
ク31はコンベア上の被研摩物40を挟持して被研摩物の流
れをせき止める機能を持つ。
The supply-side conveyors 2A and 2B are arranged such that the surface to be polished of the object to be polished 40 such as a U-shaped or rectangular parallelepiped ferrite core is directed upward, and the longitudinal direction of the object to be polished is arranged at right angles to the conveying direction, one after another. The separation chuck 31 has a function of holding the work 40 on the conveyor and blocking the flow of the work.

ストッパ33は第6図の実線Pのコンベア端上の前進位
置から仮想線Qを経て仮想線Rの後退上昇位置に至り、
逆に仮想線Rの後退上昇位置から仮想線Qを経て実線P
の前進位置に向かう往復運動を実行するもので、実線P
の前進位置では分離チャック31を通過してきた被研摩物
40の一群をコンベア端部に止どめておく作用を果たす。
The stopper 33 is moved from the advanced position on the conveyor end of the solid line P in FIG.
Conversely, the solid line P from the retracted position of the virtual line R through the virtual line Q
Reciprocating movement toward the forward position of
The workpiece to be polished that has passed through the separation chuck 31 at the advance position
It serves to keep a group of 40 at the end of the conveyor.

前記第1及び第2の光センサ32A,32Bの両方が被研摩
物有りを検出して所定時間(タイマ設定による)経過
後、前記分離チャック31による被研摩物40の挟持及びそ
れ以外の被研摩物のせき止め、ストッパ33のコンベア端
部への前進(実線P位置)による被研摩物40の一群の分
離、及びばり取り処理部6又は供給側移載部4のチャッ
クによるそれらの被研摩物の一群の保持移送、ストッパ
33の後退上昇(仮想線R)によるチャックされないで残
った被研摩物のコンベアからの落とし、分離チャック31
による被研摩物せき止め解除という一連の動作を実行す
る。
After the first and second optical sensors 32A, 32B both detect the presence of an object to be polished and a predetermined time (by setting a timer) elapses, the separation chuck 31 clamps the object to be polished 40 and other polishing objects. Dust damping, separation of a group of polished objects 40 by advancement of the stopper 33 to the end of the conveyor (solid line P position), and removal of those polished objects by the deburring processing unit 6 or the chuck of the supply-side transfer unit 4 Group of holding transfer, stopper
33. The object to be polished remaining without being chucked is dropped from the conveyor by the retreating upward movement (the virtual line R), and the separation chuck 31 is removed.
Performs a series of operations of releasing the dam on the polished material.

なお、研摩加工後の被研摩物を移送する排出側コンベ
ア3の先端部にも同様の機構を持つ被研摩物分離機構30
Cが配置される。これは、さらに被研摩物の洗浄等を実
行する工程に自動的に移送可能なようにするためであ
る。
The polished object separation mechanism 30 having a similar mechanism is provided at the tip of the discharge side conveyor 3 for transferring the polished object to be polished.
C is placed. This is to enable automatic transfer to a step of performing cleaning or the like of the object to be polished.

第7図は前記供給側コンベア2A,2B間に配置されて前
記被研摩物のばり取り処理を行うばり取り処理部6を示
す。このばり取り処理部6を設けた目的は、被研摩物40
がフェライトコア等の焼結体である場合に底面に付着し
ている異物(成形時に付着した0.1〜0.3mm程度の材料粒
子とか、焼成時に被焼成物を載せるトレイから出る粉)
を除去することにあり、異物が底面に付着したままで研
摩面(底面の反対側の面)を研摩すると研摩精度がいい
かげんなものとなってしまうのを防止する。
FIG. 7 shows a deburring processing unit 6 which is disposed between the supply-side conveyors 2A and 2B and performs the deburring processing of the object to be polished. The purpose of providing this deburring processing unit 6 is to
Foreign matter adhering to the bottom when is a sintered body such as a ferrite core (material particles of about 0.1 to 0.3 mm adhering during molding or powder coming out of the tray on which the material to be fired is placed during firing)
This is to prevent the polishing accuracy from becoming poor when the polished surface (surface opposite to the bottom surface) is polished while the foreign matter remains attached to the bottom surface.

このばり取り処理部6は、コンベア2A,2B間に配置さ
れるロッドレスシリンダ41と、該ロッドレスシリンダ41
によりコンベア2A先端部からコンベア2B後端部へ至る水
平方向移動及び逆向きの復帰移動を実行するチャック42
と、ばり取り研摩ディスク(円形のサンドペーパー)43
と、該研摩ディスク回転駆動モータ44とを備えている。
The deburring processing unit 6 includes a rodless cylinder 41 disposed between the conveyors 2A and 2B,
The chuck 42 performs a horizontal movement from the front end of the conveyor 2A to the rear end of the conveyor 2B and a return movement in the opposite direction.
And deburring abrasive disc (circular sandpaper) 43
And the polishing disk rotation drive motor 44.

前記被研摩物分離機構30Aでコンベア2A端部において
分離された被研摩物40の一群を前記チャック42は保持し
てコンベア2A上からコンベア2B方向に移動し、その途中
で被研摩物40の底面を研摩ディスク43に当てて底面のば
りを取った後、それらの被研摩物の一群をコンベア2B上
に移載する。ここで、研摩ディスク軸Sは垂直軸に対し
て角度φ(但しφは3〜5°)だけ傾いている。この傾
きにより、コンベア2Aの端部において分離された被研摩
物40の一群をチャック42で挟持する際に、挟持位置にば
らつきがあっても(被研摩物の出入りが生じても)被研
摩物底面に研摩ディスク43が押し当てられるようになっ
ている。
The chuck 42 holds a group of the polished objects 40 separated at the end of the conveyor 2A by the polished object separation mechanism 30A and moves in the direction of the conveyor 2B from above the conveyor 2A, and in the middle thereof, the bottom surface of the polished object 40. Is applied to the polishing disk 43 to remove burrs on the bottom surface, and then a group of the objects to be polished is transferred onto the conveyor 2B. Here, the polishing disk axis S is inclined with respect to the vertical axis by an angle φ (where φ is 3 to 5 °). Due to this inclination, when a group of the workpieces 40 separated at the end of the conveyor 2A is clamped by the chuck 42, even if the clamping positions vary (even if the workpieces come in and out), the workpieces are polished. The polishing disk 43 is pressed against the bottom surface.

第8図及び第9図は供給側移載部4の構成及び動作を
示すものであり、供給側移載部4は、前記供給側コンベ
ア2Bの端部において被研摩物分離機構30Bで分離された
被研摩物40の一群を保持して研摩部1の移動テーブル11
上に移載する機能を持つ。
FIGS. 8 and 9 show the configuration and operation of the supply-side transfer unit 4. The supply-side transfer unit 4 is separated at the end of the supply-side conveyor 2B by the polished object separation mechanism 30B. The moving table 11 of the polishing section 1 while holding a group of
Has a function to transfer to the top.

供給側移載部4は、基台10に対して所定高さで水平方
向に配置固定された固定支持枠50と、該固定支持枠50に
て水平に軸支されたボール螺子51と、該ボール螺子51を
回転駆動するサーボモータ52と、前記ボール螺子51に螺
合するナットを持ち当該ボール螺子51の回転により横移
動する横移動枠53と、該横移動枠53に対して昇降自在に
取り付けられた昇降部材54と、該昇降部材54に取り付け
られた2対のチャック55A,55Bとを有している。前記昇
降部材54の昇降駆動は横移動枠53に取り付けられたエア
ーシリンダ56で実行され、各チャック55A,55Bの開閉は
それぞれ昇降部材54側に配置されたエアーシリンダ(図
示省略)で行なわれ、さらにチャック55Aと55Bとの相互
間隔を別のエアーシリンダで変化させ得るようになって
いる。
The supply-side transfer section 4 includes a fixed support frame 50 horizontally fixed at a predetermined height with respect to the base 10, a ball screw 51 horizontally supported by the fixed support frame 50, A servo motor 52 that rotationally drives the ball screw 51, a lateral moving frame 53 that has a nut that is screwed into the ball screw 51 and moves laterally by the rotation of the ball screw 51, and is vertically movable with respect to the lateral moving frame 53. It has an elevating member 54 attached thereto, and two pairs of chucks 55A and 55B attached to the elevating member 54. The lifting drive of the lifting member 54 is performed by an air cylinder 56 attached to the horizontal moving frame 53, and the opening and closing of the chucks 55A and 55B are performed by air cylinders (not shown) arranged on the lifting member 54 side, respectively. Further, the distance between the chucks 55A and 55B can be changed by another air cylinder.

さて、コンベア2A,2B上では被研摩物40は1列配置で
あるのに対して研摩部1の移動テーブル11上では被研摩
物40は2列配置である。このため、左右のチャック55A,
55Bのそれぞれを開いた状態としチャック55Aと55Bの相
互間隔も大きくしておいて供給側移載部4は被研摩物40
の到来を待機し、コンベア2B端部にて分離された被研摩
物40の一群の前半部分を第9図(A)のように左側チャ
ック55Aで挟持し、その後横移動枠53を所定量移動させ
て被研摩物群の後半部分を同図(B)のように右側チャ
ック55Bで挟持する。このように、供給側移載部4で2
列にして保持された被研摩物40は昇降部材54の上昇動作
及び横移動枠53の横移動動作によって移動テーブル11上
方に移送され、さらに昇降部材54の下降動作により同図
(C)のように移動テーブル11上に近接した位置とな
る。但し、このときはまだチャックの保持は継続してお
り、移動テーブル11の中央のガイド用突条60をはさんで
左右に被研摩物40が配置されるようにする。その後、チ
ャック55Aと55Bとの間隔を狭めてガイド用突条60に対し
て左右の被研摩物40を幅寄せして同図(D)のように当
接させ、然る後にチャック55A,55Bを下降させて移動テ
ーブル11上に2列配置の被研摩物40を同図(E)のよう
に載置する。
Now, on the conveyors 2A and 2B, the polished objects 40 are arranged in one row, whereas on the moving table 11 of the polishing section 1, the polished objects 40 are arranged in two rows. Therefore, the left and right chucks 55A,
55B are opened, the gap between the chucks 55A and 55B is increased, and the supply-side transfer unit 4
9A, the first half of a group of the workpieces 40 separated at the end of the conveyor 2B is clamped by the left side chuck 55A as shown in FIG. 9 (A), and then the horizontal moving frame 53 is moved by a predetermined amount. Then, the latter half of the group to be polished is held by the right chuck 55B as shown in FIG. Thus, the supply-side transfer unit 4
The workpieces 40 held in a row are transported above the moving table 11 by the raising and lowering members 54 and the horizontal moving frame 53, and further by the lowering members 54 as shown in FIG. At a position close to the moving table 11. However, at this time, the holding of the chuck is still continued, and the object to be polished 40 is arranged on the left and right across the guide ridge 60 at the center of the moving table 11. Thereafter, the gap between the chucks 55A and 55B is reduced, and the left and right polished objects 40 are brought closer to the guide ridges 60 and brought into contact as shown in FIG. Is lowered, and the objects to be polished 40 arranged in two rows are placed on the moving table 11 as shown in FIG.

移動テーブル11は電磁チャックを構成しており(電磁
石内蔵)、磁性体である被研摩物40を電磁力でテーブル
上に吸着し、チャック55A,55Bの被研摩物開放、上昇復
帰後、さらに、第9図(F)の如く移動テーブル11に設
けられたクランプ・アーム61により2列配置の被研摩物
40をガイド用突条60との間で機械的にはさんでテーブル
11に対し機械的に固定する。
The moving table 11 constitutes an electromagnetic chuck (with a built-in electromagnet). The object to be polished 40, which is a magnetic substance, is attracted to the table by electromagnetic force, and after the objects to be polished are released from the chucks 55A and 55B, the ascent is returned, As shown in FIG. 9 (F), the objects to be polished are arranged in two rows by a clamp arm 61 provided on the moving table 11.
The table is mechanically sandwiched between 40 and guide ridges 60
Mechanically secure to 11

なお、前記研摩部1より前記排出側コンベア3上に研
摩加工後の被研摩物40を移載する排出側移載部5の機構
自体は、上述した供給側移載部4と同じであり、その動
作は、移動テーブル11のクランプ・アーム61の開放及び
電磁チャックのオフの後に、第10図(A)の如く2列配
置の被研摩物40の群を2対のチャック55A,55Bで同時に
保持して同図(B)のようにチャック55Aと55Bとの間隔
を広げながら上昇、横移動して同図(C)の如く排出側
コンベア3上に右側のチャック55Bの1列分の被研摩物4
0を載置し、それから左側のチャック55Aの1列分の被研
摩物40を載置してコンベア3上に被研摩物40を1列配置
となるように移載する。
The mechanism of the discharge-side transfer unit 5 for transferring the polished workpiece 40 from the polishing unit 1 onto the discharge-side conveyor 3 is the same as the supply-side transfer unit 4 described above. The operation is as follows. After the clamp arm 61 of the moving table 11 is opened and the electromagnetic chuck is turned off, the group of polished objects 40 arranged in two rows as shown in FIG. 10 (A) is simultaneously held by two pairs of chucks 55A and 55B. As shown in FIG. 7B, the holder 55 is moved upward while increasing the distance between the chucks 55A and 55B and moved sideways to cover one row of the right chuck 55B on the discharge side conveyor 3 as shown in FIG. Abrasive 4
Then, the workpieces 40 for one row of the chuck 55A on the left side are placed thereon, and the workpieces 40 are transferred onto the conveyor 3 so as to be arranged in one row.

前記研摩部1の供給側移載部の配置側には、第11図及
び第12図に示すようなワイパー機構65が設けられてお
り、移動テーブル11上をゴム製ワイパー66で拭き取るよ
うになっている。それらの図において、基台10側に固定
された支持板67Aに垂直スライドガイド67が固定され、
該スライドガイド67をスライドロッド68が垂直方向に摺
動自在に貫通している。そして、該スライドロッド68の
下端に取付部材69が固着され、該取付部材69にゴム製ワ
イパー66が固定されている。前記垂直スライドガイド67
と取付部材69間にはエアーシリンダ70が設けられ、該エ
アーシリンダ70の縮動時はワイパー66は上昇位置、伸動
時はワイパー66は下降して移動テーブル11上に圧接して
所要の拭き取り動作を行う。前記ワイパー66には前記移
動テーブル側のガイド用突条60を避けるための切欠72が
形成されている。このワイパー66の拭き取り動作は、通
常移動テーブル11の供給側移載部4側への移動動作(第
1図矢印X方向の動き)の際に実施される。
A wiper mechanism 65 as shown in FIGS. 11 and 12 is provided on the side of the polishing unit 1 where the supply-side transfer unit is disposed, and the wiper mechanism 66 wipes the transfer table 11 with a rubber wiper 66. ing. In those figures, a vertical slide guide 67 is fixed to a support plate 67A fixed to the base 10 side,
A slide rod 68 penetrates the slide guide 67 slidably in the vertical direction. A mounting member 69 is fixed to the lower end of the slide rod 68, and a rubber wiper 66 is fixed to the mounting member 69. The vertical slide guide 67
An air cylinder 70 is provided between the air cylinder 70 and the mounting member 69. When the air cylinder 70 is contracted, the wiper 66 is in the raised position, and when the air cylinder 70 is extended, the wiper 66 is lowered and pressed against the moving table 11 to perform required wiping. Perform the operation. The wiper 66 is formed with a notch 72 for avoiding the guide ridge 60 on the moving table side. The wiping operation of the wiper 66 is performed at the time of the movement operation (movement in the direction of the arrow X in FIG. 1) of the normal movement table 11 to the supply-side transfer unit 4 side.

なお、ワイパー66の下端近傍には研削液を移動テーブ
ル11上に供給する研削液供給口71も設けられている。
A grinding liquid supply port 71 for supplying the grinding liquid onto the moving table 11 is also provided near the lower end of the wiper 66.

さらに、前記研摩部1の排出側移載部の配置側には、
前記排出側移載部5で取り残した研摩加工後の被研摩物
40を前記移動テーブル11の往復運動を利用して除去する
被研摩物排除手段75が設けられている。この被研摩物排
除手段75は、第13図に示すように、基台10側に固定され
た支持板76に垂直スライドガイド77が固定され、該スラ
イドガイド77をスライドロッド78が垂直方向に摺動自在
に貫通している。そして、該スライドロッド78の下端に
金属排除部材79が固着されている。該排除部材79には移
動テーブル側のガイド用突条60を避けるための切欠80が
形成されている。前記垂直スライドガイド77と排除部材
79間にはエアーシリンダ81が設けられ、該エアーシリン
ダ81の縮動時は排除部材79は上昇位置、伸動時は排除部
材79は下降して移動テーブル11上面に近接状態となって
排出側移載部5が取り残した被研摩物40を移動テーブル
11の供給側移載部4側への移動動作(第1図矢印X方
向)の際に当該テーブル上から落下させる作用を果た
す。
Further, on the arrangement side of the discharge side transfer unit of the polishing unit 1,
Polished material left behind by the transfer unit 5 after polishing
An object to be polished 75 is provided to remove 40 by utilizing the reciprocating motion of the moving table 11. As shown in FIG. 13, a vertical slide guide 77 is fixed to a support plate 76 fixed to the base 10 side, and a slide rod 78 slides the slide guide 77 in the vertical direction. It penetrates freely. Further, a metal removing member 79 is fixed to the lower end of the slide rod 78. A notch 80 is formed in the removing member 79 to avoid the guide ridge 60 on the moving table side. Vertical slide guide 77 and rejection member
An air cylinder 81 is provided between the air cylinders 81, and when the air cylinder 81 is contracted, the removing member 79 is in the raised position. Transfer table for polishing object 40 left behind by transfer unit 5
During the movement operation (11 in the direction of the arrow X in FIG. 1) to the supply-side transfer section 4 of FIG.

前記研削液供給部7は、第1図に示すように、クリー
ンタンク90、ダーティータンク91及び遠心分離機92を有
している。クリーンタンク90より研摩部1の回転砥石15
やワイパー66の部分に供給された清浄な研削液は、回転
砥石15等を冷却しかつ被研摩物40や移動テーブル11上の
汚れを流して汚れた研削液となって移動テーブル11側よ
りダーティータンク91に回収される。ダーティータンク
91内の研削液は遠心分離機92に送られ、ここでろ過され
て清浄な研削液となってクリーンタンク90に供給され
る。
As shown in FIG. 1, the grinding fluid supply unit 7 has a clean tank 90, a dirty tank 91, and a centrifuge 92. Rotary grindstone 15 of polishing section 1 from clean tank 90
And the clean grinding fluid supplied to the wiper 66 cools the rotary grindstone 15 and the like, and flows dirt on the workpiece 40 and the moving table 11 to become dirty grinding fluid. Collected in the tank 91. Dirty tank
The grinding fluid in 91 is sent to a centrifugal separator 92, where it is filtered and supplied to a clean tank 90 as a clean grinding fluid.

次に上記実施例の全体的な動作説明を行う。 Next, the overall operation of the embodiment will be described.

供給側コンベア2Aで1列配列で移送されてきた被研摩
物40はコンベア2A先端部で被研摩物分離機構30Aにより
一群の被研摩物40に分離され、これらがばり取り処理部
6のチャック42で保持されてコンベア2B方向に移送され
る途中において研摩ディスク43による底面のばり取り処
理を受ける。前記チャック42で取り残した被研摩物40
は、分離機構30Aのストッパ33の第6図仮想線Q位置へ
の後退上昇位置への動きによりコンベア2Aの走行に伴い
コンベア先端側から落下する。
The workpieces 40 transported in a single row on the supply side conveyor 2A are separated into a group of workpieces 40 by the workpiece separation mechanism 30A at the tip of the conveyor 2A. While being transported in the direction of the conveyor 2B while being held in the direction shown in FIG. Polished material 40 left behind by chuck 42
The stopper 33 of the separation mechanism 30A drops from the tip of the conveyor as the conveyor 2A travels due to the movement of the stopper 33 to the retreating and rising position to the position of the virtual line Q in FIG.

前記チャック42で保持されて底面のばり取り処理を受
けた一群の被研摩物40はコンベア2B上に移載され、コン
ベア2Bの搬送動作によりコンベア2B先端部に達し、被研
摩物分離機構30Bにより一群の被研摩物40に分離され
る。これらは、供給側移載部4の左右のチャック55A,55
Bで2列に分けて保持されて研摩部1の移動テーブル11
(第1図実線のように右側に移動した状態となってい
る)上に移載される。その際、チャック55A,55Bで保持
されずに残った被研摩物40は、分離機構30Bのストッパ3
3の後退上昇位置への動きによりコンベア2Bの走行に伴
いコンベア先端側から落下する。
A group of polished objects 40 held by the chuck 42 and subjected to the deburring process of the bottom surface is transferred onto the conveyor 2B, reaches the tip of the conveyor 2B by the transport operation of the conveyor 2B, and is separated by the polished object separation mechanism 30B. It is separated into a group of abrasives 40. These are the left and right chucks 55A, 55A of the supply-side transfer section 4.
The moving table 11 of the polishing section 1 is held in two rows by B
(The state has been moved to the right as shown by the solid line in FIG. 1). At this time, the polishing target 40 remaining without being held by the chucks 55A and 55B is the stopper 3 of the separation mechanism 30B.
3 When the conveyor 2B moves to the retreating and ascending position, the conveyor 2B falls from the tip of the conveyor.

研摩部1の移動テーブル11上に移載された2列配置の
被研摩物40は、研摩面が上となった状態で移動テーブル
11の電磁チャック及び機械的なクランプ・アーム61にて
吸着固定され、移動テーブル11の排出側移載部5側への
移動動作(第1図矢印AX方向)にて円盤状回転砥石15に
よる上面の平面研摩を受ける。
The object to be polished in two rows arranged on the moving table 11 of the polishing section 1 is moved with the polished surface facing upward.
The upper surface of the moving table 11 is moved to the discharge-side transfer unit 5 side (in the direction of the arrow AX in FIG. 1) by the disk-shaped rotating grindstone 15 by suction and fixed by the electromagnetic chuck 11 and the mechanical clamp arm 61. Undergoes plane polishing.

円盤状回転砥石15の第2図に示した回転中心軸Zが移
動テーブル11の上面への垂線に完全に一致している場
合、被研摩物40の研摩面は第14図(A)のようにあやめ
状態となり、回転中心軸Zを僅かに傾けた場合は同図
(B)のようにあやめ状態とはならない。
When the rotation center axis Z shown in FIG. 2 of the disc-shaped rotary grindstone 15 completely coincides with the perpendicular to the upper surface of the moving table 11, the polished surface of the workpiece 40 is as shown in FIG. When the rotation center axis Z is slightly tilted, the iris state is not obtained as shown in FIG.

移動テーブル11の矢印AX方向の移動が完了してテーブ
ル上の総ての被研摩物40が研摩を受けた後、排出側移載
部5の2対のチャックにより2列配置で被研摩物40は挟
持され、排出側コンベア3に1列配置で移載される。そ
して、排出側コンベア3の搬送動作により先端側に送出
される。
After the movement of the moving table 11 in the direction of the arrow AX is completed and all the objects to be polished 40 on the table have been polished, the objects to be polished 40 are arranged in two rows by the two pairs of chucks of the discharge-side transfer unit 5. Are sandwiched and transferred to the discharge-side conveyor 3 in a single-row arrangement. Then, the sheet is sent to the front end side by the transport operation of the discharge side conveyor 3.

なお、排出側移載部5のチャックで保持されないで残
った被研摩物40は、被研摩物排除手段75の排除部材79を
移動テーブル11に近接した下降位置とすることにより、
移動テーブル11の矢印X方向の移動によってテーブルか
ら落下する。
The object 40 to be polished remaining without being held by the chuck of the discharge-side transfer portion 5 is moved downward by setting the removing member 79 of the object-to-be-polished removing means 75 to the descending position close to the moving table 11.
The moving table 11 drops from the table by moving in the direction of the arrow X.

(発明の効果) 以上説明したように、本発明の研摩装置によれば、被
研摩物の供給から、研摩及び排出に至るまでの各工程を
自動的に実行でき、省力化及び研摩作業の効率化を図る
ことができる。さらに、テーブルに対して被研摩物を確
実かつ正確に保持でき、被研摩物の底面ばり取り処理等
を研摩前に実行したりすることで、高精度の研摩加工を
実現できる。
(Effects of the Invention) As described above, according to the polishing apparatus of the present invention, each process from supply of the object to be polished to polishing and discharging can be automatically executed, thereby saving labor and improving the efficiency of the polishing operation. Can be achieved. Further, the object to be polished can be reliably and accurately held on the table, and a high-precision polishing can be realized by performing a deburring process or the like of the bottom surface of the object to be polished before polishing.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明に係る研摩装置の実施例を示す平面図、
第2図は同正面図、第3図は同側面図、第4図は実施例
における研摩部のリニアスケール部分を示す側面図、第
5図は被研摩物分離機構部分を示す平面図、第6図は同
正面図、第7図はばり取り処理部の正面図、第8図は供
給側移載部を示す側面図、第9図は供給側移載部の動作
説明図、第10図は排出側移載部の動作説明図、第11図は
ワイパー機構部分を示す正面図、第12図は同側面図、第
13図は被研摩物排除手段部分を示す正面図、第14図は被
研摩物の研摩面の状態を示す説明図である。 1……研摩部、2A,2B……供給側コンベア、3……排出
側コンベア、4……供給側移載部、5……排出側移載
部、6……ばり取り処理部、7……研削液処理部、11…
…移動テーブル、15……円盤状回転砥石、16,44,52……
モータ、25……リニアスケール、30A,30B,30C……被研
摩物分離機構、31……分離チャック、33……ストッパ、
40……被研摩物、41……ロッドレスシリンダ、42,55A,5
5B……チャック、43……研摩ディスク、56,70,81……エ
アーシリンダ、60……ガイド用突条、65……ワイパー機
構、75……被研摩物排除機構。
FIG. 1 is a plan view showing an embodiment of a polishing apparatus according to the present invention,
FIG. 2 is a front view, FIG. 3 is a side view, FIG. 4 is a side view showing a linear scale portion of the polishing section in the embodiment, FIG. 6 is a front view of the same, FIG. 7 is a front view of the deburring section, FIG. 8 is a side view showing the supply-side transfer section, FIG. 9 is an operation explanatory view of the supply-side transfer section, FIG. Is an explanatory view of the operation of the discharge-side transfer section, FIG. 11 is a front view showing the wiper mechanism, FIG. 12 is a side view of the same, FIG.
FIG. 13 is a front view showing an object-to-be-polished removing means, and FIG. 14 is an explanatory view showing a state of a polished surface of the object to be polished. 1 ... polishing section, 2A, 2B ... supply side conveyor, 3 ... discharge side conveyor, 4 ... supply side transfer section, 5 ... discharge side transfer section, 6 ... deburring processing section, 7 ... ... Grinding fluid treatment unit, 11 ...
… Movable table, 15… Disc-shaped rotary whetstone, 16,44,52 ……
Motor, 25 Linear scale, 30A, 30B, 30C Separation mechanism for polished object, 31 Separation chuck, 33 Stopper,
40: Polished object, 41: Rodless cylinder, 42, 55A, 5
5B ... Chuck, 43 ... Abrasive disk, 56,70,81 ... Air cylinder, 60 ... Guide ridge, 65 ... Wiper mechanism, 75 ... Equipment removal mechanism.

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】往復運動を行う移動テーブルと、該移動テ
ーブル上の被研摩物を研摩する回転砥石とを有する研摩
部と、被研摩物を移送する供給側コンベアと、研摩加工
後の被研摩物を移送する排出側コンベアと、前記供給側
コンベアより前記移動テーブル上に被研摩物を移載する
供給側移載部と、前記移動テーブルより前記排出側コン
ベア上に研摩加工後の被研摩物を移載する排出側移載部
とを備え、 前記研摩部には前記排出側移載部で取り残した被研摩物
を前記移動テーブルの動きを利用して除去する排除手段
が昇降自在に設けられていることを特徴とする研摩装
置。
1. A polishing section having a moving table for reciprocating movement, a rotary grindstone for polishing an object to be polished on the moving table, a supply side conveyor for transferring the object to be polished, and a polishing object after polishing. A discharge-side conveyor for transferring objects, a supply-side transfer unit for transferring an object to be polished from the supply-side conveyor onto the moving table, and an object to be polished after being polished from the moving table onto the discharge-side conveyor. And a discharge-side transfer unit for transferring the object.The polishing unit is provided with an elimination unit that removes the object to be polished remaining in the discharge-side transfer unit by using the movement of the moving table so as to be movable up and down. A polishing device characterized by the following.
【請求項2】被研摩物の底面のばり取り処理を行うばり
取り処理部を前記供給側コンベアの途中に設け、被研摩
物の底面を下にして当該被研摩物を前記移動テーブル上
に固定する請求項1記載の研摩装置。
2. A deburring section for performing a deburring process on the bottom surface of the object to be polished is provided in the middle of the supply side conveyor, and the object to be polished is fixed on the moving table with the bottom surface of the object to be polished down. The polishing apparatus according to claim 1, wherein the polishing is performed.
【請求項3】前記移動テーブルは上面にガイド用突条を
有し、かつ前記ガイド用突条との間で被研摩物を挟持す
るクランプ手段が前記移動テーブルに設けられている請
求項1又は2記載の研摩装置。
3. The moving table has a guide ridge on an upper surface thereof, and a clamp means for clamping an object to be polished between the guide and the guide ridge is provided on the movable table. 2. The polishing apparatus according to 2.
【請求項4】被研摩物が磁性体であって、前記移動テー
ブルが該被研摩物を吸着する電磁チャックを構成してい
る請求項1,2又は3記載の研摩装置。
4. The polishing apparatus according to claim 1, wherein the object to be polished is a magnetic material, and said moving table constitutes an electromagnetic chuck for attracting said object to be polished.
【請求項5】前記供給側及び排出側移載部は被研摩物を
挟持する少なくとも1個のチャックを有している請求項
1,2,3又は4記載の研摩装置。
5. The supply-side and discharge-side transfer section has at least one chuck for holding an object to be polished.
The polishing apparatus according to 1, 2, 3 or 4.
JP1193762A 1989-07-26 1989-07-26 Polishing equipment Expired - Fee Related JP2649846B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1193762A JP2649846B2 (en) 1989-07-26 1989-07-26 Polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1193762A JP2649846B2 (en) 1989-07-26 1989-07-26 Polishing equipment

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JPH0360959A JPH0360959A (en) 1991-03-15
JP2649846B2 true JP2649846B2 (en) 1997-09-03

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JP1193762A Expired - Fee Related JP2649846B2 (en) 1989-07-26 1989-07-26 Polishing equipment

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370864B1 (en) * 1998-12-02 2003-02-19 한국전기초자 주식회사 Adhesive Device for Polishing Tools
JP4987396B2 (en) * 2006-09-05 2012-07-25 株式会社大平製作所 Long-feed through-feed grinding machine

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51113292A (en) * 1975-03-31 1976-10-06 Toyoda Mach Works Ltd Work plane machining device
JPS60114458A (en) * 1983-11-26 1985-06-20 Nippon Kogaku Kk <Nikon> Spherical face forming grinder for lens
JPS6158269A (en) * 1984-08-30 1986-03-25 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device
JPS61230849A (en) * 1985-04-08 1986-10-15 Shibayama Kikai Kk Wafer stable transport arm of grinding machine
JPS6384858A (en) * 1986-09-26 1988-04-15 Hitachi Ltd Grinding method and device
JP2670787B2 (en) * 1987-12-10 1997-10-29 スピードファム コーポレーション Multi-face grinding machine

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