JPH0359646U - - Google Patents
Info
- Publication number
- JPH0359646U JPH0359646U JP12001189U JP12001189U JPH0359646U JP H0359646 U JPH0359646 U JP H0359646U JP 12001189 U JP12001189 U JP 12001189U JP 12001189 U JP12001189 U JP 12001189U JP H0359646 U JPH0359646 U JP H0359646U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- semiconductor element
- shape memory
- memory alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図はこの考案の実施例を示す部分断面図で
第１図ａ、第１図ｂおよび第１図ｃはそれぞれ異
なる実施例を示す図、第２図は従来例を示す部分
断面図で第２図ａ、第２図ｂおよび第２図ｃはそ
れぞれ異なる従来例を示す図である。 １……半導体素子、２……金属導体、３……封
止材、４……形状記憶合金。
第１図ａ、第１図ｂおよび第１図ｃはそれぞれ異
なる実施例を示す図、第２図は従来例を示す部分
断面図で第２図ａ、第２図ｂおよび第２図ｃはそ
れぞれ異なる従来例を示す図である。 １……半導体素子、２……金属導体、３……封
止材、４……形状記憶合金。
Claims (1)
- 半導体素子を外部雰囲気より封止してなる半導
体装置において、半導体素子の電極に接続される
金属導体のうちの少なくとも１個について、前記
電極に接する部分または前記電極に近い一部分を
形状記憶合金としたことを特徴とする半導体装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12001189U JPH0359646U (ja) | 1989-10-14 | 1989-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12001189U JPH0359646U (ja) | 1989-10-14 | 1989-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359646U true JPH0359646U (ja) | 1991-06-12 |
Family
ID=31668104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12001189U Pending JPH0359646U (ja) | 1989-10-14 | 1989-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359646U (ja) |
-
1989
- 1989-10-14 JP JP12001189U patent/JPH0359646U/ja active Pending