JPH0355007B2 - - Google Patents
Info
- Publication number
- JPH0355007B2 JPH0355007B2 JP60135616A JP13561685A JPH0355007B2 JP H0355007 B2 JPH0355007 B2 JP H0355007B2 JP 60135616 A JP60135616 A JP 60135616A JP 13561685 A JP13561685 A JP 13561685A JP H0355007 B2 JPH0355007 B2 JP H0355007B2
- Authority
- JP
- Japan
- Prior art keywords
- base film
- pin terminal
- conductor
- small hole
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60135616A JPS61294706A (ja) | 1985-06-21 | 1985-06-21 | フレキシブルジヤンパ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60135616A JPS61294706A (ja) | 1985-06-21 | 1985-06-21 | フレキシブルジヤンパ及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61294706A JPS61294706A (ja) | 1986-12-25 |
| JPH0355007B2 true JPH0355007B2 (enrdf_load_stackoverflow) | 1991-08-22 |
Family
ID=15155970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60135616A Granted JPS61294706A (ja) | 1985-06-21 | 1985-06-21 | フレキシブルジヤンパ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61294706A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7381064B2 (en) * | 2003-08-26 | 2008-06-03 | Methode Electronics, Inc. | Flexible flat cable termination structure for a clockspring |
-
1985
- 1985-06-21 JP JP60135616A patent/JPS61294706A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61294706A (ja) | 1986-12-25 |
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